STM32F412ZGJ6TR
ActiveSTM32 DYNAMIC EFFICIENCY MCU WITH BAM, HIGH-PERFORMANCE AND DSP WITH FPU, ARM CORTEX-M4 MCU WITH 1 MBYTE OF FLASH MEMORY, 100 MHZ CPU, ART ACCELERATOR, DFSDM
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STM32F412ZGJ6TR
ActiveSTM32 DYNAMIC EFFICIENCY MCU WITH BAM, HIGH-PERFORMANCE AND DSP WITH FPU, ARM CORTEX-M4 MCU WITH 1 MBYTE OF FLASH MEMORY, 100 MHZ CPU, ART ACCELERATOR, DFSDM
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Technical Specifications
Parameters and characteristics for this part
| Specification | STM32F412ZGJ6TR |
|---|---|
| Connectivity | LINbus, I2C, USB OTG, QSPI, IrDA, CANbus, UART/USART, SPI, MMC/SD/SDIO, EBI/EMI |
| Core Processor | ARM® Cortex®-M4 |
| Core Size | 32-Bit Single-Core |
| Data Converters [custom] | 16 |
| Data Converters [custom] | 12 b |
| Mounting Type | Surface Mount |
| Number of I/O | 114 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 144-UFBGA |
| Peripherals | WDT, I2S, Brown-out Detect/Reset, POR, PWM, LCD, DMA |
| Program Memory Size | 1 MB |
| Program Memory Type | FLASH |
| RAM Size | 256 K |
| Speed | 100 MHz |
| Supplier Device Package | 144-UFBGA (10x10) |
| Voltage - Supply (Vcc/Vdd) [Max] | 3.6 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.7 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 1500 | $ 7.53 | |
Description
General part information
STM32F412ZE Series
STM32F412xE/G devices are based on the high-performance Arm®Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
STM32F412xE/G devices belong to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing even more power consumption saving during data batching.
STM32F412xE/G devices incorporate high-speed embedded memories (up to 1 Mbyte of flash memory, 256 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.
Documents
Technical documentation and resources