Technical Specifications
Parameters and characteristics for this part
| Specification | STM32F412ZGJ6 |
|---|---|
| Connectivity | LINbus, I2C, USB OTG, QSPI, IrDA, CANbus, UART/USART, SPI, MMC/SD/SDIO, EBI/EMI |
| Core Processor | ARM® Cortex®-M4 |
| Core Size | 32-Bit Single-Core |
| Data Converters [custom] | 16 |
| Data Converters [custom] | 12 b |
| Mounting Type | Surface Mount |
| Number of I/O | 114 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 144-UFBGA |
| Peripherals | WDT, I2S, Brown-out Detect/Reset, POR, PWM, LCD, DMA |
| Program Memory Size | 1 MB |
| Program Memory Type | FLASH |
| RAM Size | 256 K |
| Speed | 100 MHz |
| Supplier Device Package | 144-UFBGA (10x10) |
| Voltage - Supply (Vcc/Vdd) [Max] | 3.6 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.7 V |
STM32F412ZE Series
STM32 Dynamic Efficiency MCU with BAM, High-performance and DSP with FPU, Arm Cortex-M4 MCU with 512 Kbytes of Flash memory, 100 MHz CPU, Art Accelerator, DFSDM
| Part | Core Processor | Data Converters [custom] | Data Converters [custom] | Program Memory Size | Core Size | Number of I/O | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Mounting Type | Connectivity | Oscillator Type | Program Memory Type | RAM Size | Peripherals | Operating Temperature [Max] | Operating Temperature [Min] | Supplier Device Package | Package / Case | Speed | Supplier Device Package [x] | Supplier Device Package [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
STMicroelectronics | ARM® Cortex®-M4 | 16 | 12 b | 512 KB | 32-Bit Single-Core | 114 | 3.6 V | 1.7 V | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MMC/SD/SDIO QSPI SPI UART/USART USB USB OTG | Internal | FLASH | 256 K | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 105 °C | -40 °C | 144-LQFP (20x20) | 144-LQFP | 100 MHz | ||
STMicroelectronics | ARM® Cortex®-M4 | 16 | 12 b | 1 MB | 32-Bit Single-Core | 50 I/O | 3.6 V | 1.7 V | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MMC/SD/SDIO QSPI SPI UART/USART USB OTG | Internal | FLASH | 256 K | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 85 °C | -40 °C | 64-LQFP (10x10) | 64-LQFP | 100 MHz | ||
STMicroelectronics | ARM® Cortex®-M4 | 16 | 12 b | 512 KB | 32-Bit Single-Core | 81 | 3.6 V | 1.7 V | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MMC/SD/SDIO QSPI SPI UART/USART USB OTG | Internal | FLASH | 256 K | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 125 °C | -40 °C | 100-LQFP (14x14) | 100-LQFP | 100 MHz | ||
STMicroelectronics | ARM® Cortex®-M4 | 16 | 12 b | 1 MB | 32-Bit Single-Core | 114 | 3.6 V | 1.7 V | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MMC/SD/SDIO QSPI SPI UART/USART USB OTG | Internal | FLASH | 256 K | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 85 °C | -40 °C | 144-UFBGA (10x10) | 144-UFBGA | 100 MHz | ||
STMicroelectronics | ARM® Cortex®-M4 | 16 | 12 b | 1 MB | 32-Bit | 81 | 3.6 V | 1.7 V | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MMC/SD/SDIO QSPI SPI UART/USART USB USB OTG | Internal | FLASH | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 85 °C | -40 °C | 100-UFBGA (7x7) | 100-UFBGA | 100 MHz | |||
STMicroelectronics | ARM® Cortex®-M4 | 16 | 12 b | 1 MB | 32-Bit Single-Core | 114 | 3.6 V | 1.7 V | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MMC/SD/SDIO QSPI SPI UART/USART USB OTG | Internal | FLASH | 256 K | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 85 °C | -40 °C | 144-UFBGA (10x10) | 144-UFBGA | 100 MHz | ||
STMicroelectronics | ARM® Cortex®-M4 | 512 KB | 32-Bit Single-Core | 36 | 3.6 V | 1.7 V | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MMC/SD/SDIO QSPI SPI UART/USART USB OTG | Internal | FLASH | 256 K | Brown-out Detect/Reset DMA I2S POR PWM WDT | 85 °C | -40 °C | 48-UFQFPN (7x7) | 48-UFQFN Exposed Pad | 100 MHz | ||||
STMicroelectronics | ARM® Cortex®-M4 | 16 | 12 b | 512 KB | 32-Bit Single-Core | 50 I/O | 3.6 V | 1.7 V | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MMC/SD/SDIO QSPI SPI UART/USART USB OTG | Internal | FLASH | 256 K | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 85 °C | -40 °C | 64-WLCSP | 64-UFBGA WLCSP | 100 MHz | 3.62 | 3.65 |
STMicroelectronics | ARM® Cortex®-M4 | 16 | 12 b | 512 KB | 32-Bit Single-Core | 114 | 3.6 V | 1.7 V | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MMC/SD/SDIO QSPI SPI UART/USART USB OTG | Internal | FLASH | 256 K | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 125 °C | -40 °C | 144-UFBGA (10x10) | 144-UFBGA | 100 MHz | ||
STMicroelectronics | ARM® Cortex®-M4 | 16 | 12 b | 512 KB | 32-Bit Single-Core | 81 | 3.6 V | 1.7 V | Surface Mount | CANbus EBI/EMI I2C IrDA LINbus MMC/SD/SDIO QSPI SPI UART/USART USB OTG | Internal | FLASH | 256 K | Brown-out Detect/Reset DMA I2S LCD POR PWM WDT | 85 °C | -40 °C | 100-UFBGA (7x7) | 100-UFBGA | 100 MHz |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 1 | $ 14.02 | |
| 10 | $ 9.96 | |||
| 25 | $ 8.91 | |||
| 80 | $ 7.90 | |||
| 230 | $ 7.22 | |||
| 440 | $ 6.89 | |||
| 1008 | $ 6.66 | |||
Description
General part information
STM32F412ZE Series
STM32F412xE/G devices are based on the high-performance Arm®Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
STM32F412xE/G devices belong to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing even more power consumption saving during data batching.
STM32F412xE/G devices incorporate high-speed embedded memories (up to 1 Mbyte of flash memory, 256 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.
Documents
Technical documentation and resources
