STM32F412ZE Series
STM32 Dynamic Efficiency MCU with BAM, High-performance and DSP with FPU, Arm Cortex-M4 MCU with 512 Kbytes of Flash memory, 100 MHz CPU, Art Accelerator, DFSDM
Manufacturer: STMicroelectronics
Catalog
STM32 Dynamic Efficiency MCU with BAM, High-performance and DSP with FPU, Arm Cortex-M4 MCU with 512 Kbytes of Flash memory, 100 MHz CPU, Art Accelerator, DFSDM
Key Features
• Memories
- Up to 1 Mbyte of flash memory
- 256 Kbytes of SRAM
- Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR flash memory
- Dual mode Quad-SPI interface
• Clock, reset and supply management
- 1.7 V to 3.6 V application supply and I/Os
- POR, PDR, PVD and BOR
- 4-to-26 MHz crystal oscillator
- Internal 16 MHz factory-trimmed RC
- 32 kHz oscillator for RTC with calibration
- Internal 32 kHz RC with calibration
• Power consumption
- Run: 112 µA/MHz (peripheral off)
- Stop (Flash in Stop mode, fast wakeup time): 50 µA typical at 25 °C; 75 µA max at 25 °C
- Stop (flash memory in Deep power down mode, slow wakeup time): down to 18 µA at 25 °C; 40 µA max at 25 °C
- Standby: 2.4 µA at 25 °C / 1.7 V without RTC; 12 µA at 85 °C at 1.7 V
- VBATsupply for RTC: 1 µA at 25 °C1×12-bit, 2.4 MSPS ADC: up to 16 channels
Description
AI
STM32F412xE/G devices are based on the high-performance Arm®Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.
STM32F412xE/G devices belong to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing even more power consumption saving during data batching.
STM32F412xE/G devices incorporate high-speed embedded memories (up to 1 Mbyte of flash memory, 256 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.
All devices offer one 12-bit ADC, a low-power RTC, twelve general-purpose 16-bit timers, two PWM timers for motor control and two general-purpose 32-bit timers.
They also feature standard and advanced communication interfaces:
- Up to four I2Cs, including one I2C supporting Fast-Mode Plus
- Five SPIs
- Five I2Ss of which two are full duplex. To achieve audio class accuracy, the I2S peripherals can be clocked via a dedicated internal audio PLL, or via an external clock to allow synchronization.
- Four USARTs
- An SDIO/MMC interface
- A USB 2.0 OTG full-speed interface
- Two CANs.
In addition, STM32F412xE/G devices embed advanced peripherals:
- A flexible static memory controller interface (FSMC)
- A Quad-SPI memory interface
- A digital filter for sigma modulator (DFSDM), two filters, up to four inputs, and support of microphone MEMs.
STM32F412xE/G devices are offered in 7 packages ranging from 48 to 144 pins. The set of available peripherals depends on the selected package.
The STM32F412xE/G operates in the -40 to +125 °C temperature range from a 1.7 (PDR OFF) to 3.6 V power supply. A comprehensive set of power-saving modes allows the design of low-power applications.