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STM32F412ZEJ3 - Product Image

STM32F412ZEJ3

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STMicroelectronics

STM32 DYNAMIC EFFICIENCY MCU WITH BAM, HIGH-PERFORMANCE AND DSP WITH FPU, ARM CORTEX-M4 MCU WITH 512 KBYTES OF FLASH MEMORY, 100 MHZ CPU, ART ACCELERATOR, DFSDM

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STM32F412ZEJ3 - Product Image

STM32F412ZEJ3

Active
STMicroelectronics

STM32 DYNAMIC EFFICIENCY MCU WITH BAM, HIGH-PERFORMANCE AND DSP WITH FPU, ARM CORTEX-M4 MCU WITH 512 KBYTES OF FLASH MEMORY, 100 MHZ CPU, ART ACCELERATOR, DFSDM

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Technical Specifications

Parameters and characteristics for this part

SpecificationSTM32F412ZEJ3
ConnectivityLINbus, I2C, USB OTG, QSPI, IrDA, CANbus, UART/USART, SPI, MMC/SD/SDIO, EBI/EMI
Core ProcessorARM® Cortex®-M4
Core Size32-Bit Single-Core
Data Converters [custom]16
Data Converters [custom]12 b
Mounting TypeSurface Mount
Number of I/O114
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Oscillator TypeInternal
Package / Case144-UFBGA
PeripheralsWDT, I2S, Brown-out Detect/Reset, POR, PWM, LCD, DMA
Program Memory Size512 KB
Program Memory TypeFLASH
RAM Size256 K
Speed100 MHz
Supplier Device Package144-UFBGA (10x10)
Voltage - Supply (Vcc/Vdd) [Max]3.6 V
Voltage - Supply (Vcc/Vdd) [Min]1.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 1008$ 7.15
LCSCPiece 1$ 12.42
200$ 4.81
500$ 4.64
1008$ 4.55
NewarkEach 1$ 7.52

Description

General part information

STM32F412ZE Series

STM32F412xE/G devices are based on the high-performance Arm®Cortex®-M4 32-bit RISC core operating at a frequency of up to 100 MHz. Their Cortex®-M4 core features a Floating point unit (FPU) single precision which supports all Arm single-precision data-processing instructions and data types. It also implements a full set of DSP instructions and a memory protection unit (MPU) which enhances application security.

STM32F412xE/G devices belong to the STM32 Dynamic Efficiency™ product line (with products combining power efficiency, performance and integration) while adding a new innovative feature called Batch Acquisition Mode (BAM) allowing even more power consumption saving during data batching.

STM32F412xE/G devices incorporate high-speed embedded memories (up to 1 Mbyte of flash memory, 256 Kbytes of SRAM), and an extensive range of enhanced I/Os and peripherals connected to two APB buses, three AHB buses and a 32-bit multi-AHB bus matrix.