TMS320C6413ZTSA500

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Texas Instruments

DSP FIXED-POINT 32BIT 500MHZ 4000MIPS 288-PIN FCBGA TRAY

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Search across all available documentation for this part.

DocumentsTMS320C6000 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (Rev. G)TMS320C6000 DSP Cache User's Guide (Rev. A)+62

TMS320C6413ZTSA500

Active

Texas Instruments

DSP FIXED-POINT 32BIT 500MHZ 4000MIPS 288-PIN FCBGA TRAY

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DocumentsTMS320C6000 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (Rev. G)TMS320C6000 DSP Cache User's Guide (Rev. A)+62

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	TMS320C6413ZTSA500	TMS320 Series

	-	-
Clock Rate	500 MHz	1 - 900 MHz
Clock Rate	-	364.5 - 405 MHz
Clock Rate	-	513 - 810 MHz
Clock Rate	-	256 - 720 MHz
Connectivity	-	I2C, EBI/EMI, UART/USART, CANbus, USB, uPP, SPI, SCI, McBSP, LINbus
Core Processor	-	C28x, C2xx DSP
Core Size	-	32-Bit Single-Core, 16-Bit
Core Size	-	32-Bit Dual-Core
Data Converters	-	5 - 16
Data Converters	-	10 - 12 b
Data Converters	-	D/A 3x12b, A/D 20x12b, A/D 20x16b, A/D 12x16b, A/D 24x12b, A/D 14x12b, 14x12b, A/D 13x12b, A/D 9x16b, A/D 14x16b, 12x12b, D/A 1x12b, A/D 17x12b
Data Converters	-	6 - 12 b
Data Converters	-	10 - 12 b
Data Converters	-	4
Data Converters	-	10
Grade	-	Automotive
Interface	-	McASP, PCI, UART, McBSP, 10/100 Ethernet MAC, I2C, HPI, Host Interface, SPI, Ethernet MAC, PCIe, SRIO, EBI/EMI, TSIP, 10/100/1000 Ethernet, UTOPIA, SSP, USB, I2S, MMC/SD, UART/USART, TDM, BSP, Ethernet, Serial ATA, SD/SDIO, Telecom, UTPOIA, ASP, Serial Port, SCI, CAN, Duplex Serial Port, 10/100/1000 Ethernet MAC, UPP, DDR3, Communication Ports, LCD, McSPI, UHPI, MMC/SD/SDIO, SATA, Parallel
Interface	-	Host Interface
Interface	-	Duplex Serial Port
Mounting Type	Surface Mount	Surface Mount, Through Hole
Non-Volatile Memory	External	ROM, External, FLASH
Non-Volatile Memory	-	1.088 - 768 kB
Non-Volatile Memory	-	8 kB
Number of I/O	-	13 - 169
On-Chip RAM	288 kB	1 - 896 kB
On-Chip RAM	-	2.1 - 248 MB
On-Chip RAM	-	8 kB
Operating Temperature	-	-40 - 105 °C
Operating Temperature	-	125 °C
Operating Temperature	-	-55 °C
Operating Temperature [Max]	105 °C	70 - 125 °C
Operating Temperature [Min]	-40 °C	-40 - 0 °C
Oscillator Type	-	Internal, External
Package / Case	FCBGA, 288-BBGA	376-BBGA Exposed Pad, 176-LQFP, 548-BBGA, FCBGA, 176-BGA, 841-BFBGA, 176-LQFP Exposed Pad, 337-LFBGA, 361-LFBGA, 80-LQFP, 288-LFBGA, 532-BFBGA, 100-LQFP, 697-BFBGA, 38-TSSOP, 256-BGA, 196-LFBGA, 64-TQFP, 132-BQFP Bumpered, 100-TQFP Exposed Pad, 128-LQFP, 561-BFBGA, FCCSPBGA, 1031-BFBGA, 143-VFBGA, 144-LQFP, 144-LFBGA, 548-BFBGA, 737-BFBGA, 272-BBGA, 48-LQFP, 529-BFBGA, 338-LFBGA, 240-LFBGA, 68-LCC (J-Lead), 688-BFBGA, FCBGA Exposed Pad, 625-BFBGA, 201-LFBGA, 100-LFBGA, 257-LFBGA, 684-BFBGA, 181-BCPGA Exposed Pad, 181-CPGA, 100-BQFP, 56-VFQFN Exposed Pad, 325-BFCPGA Exposed Pad, 384-FBGA, 144-TQFP Exposed Pad, 352-BBGA, FCBGA Exposed Pad, 288-BBGA, 169-LFBGA, 144-BQFP, 388-BBGA, 40-DIP, 304-BFQFP Exposed Pad, 80-TQFP Exposed Pad, 352-BBGA, 352-LBGA, 305-BFCPGA Exposed Pad, 32-LQFP, 44-LCC (J-Lead), 340-FBGA Exposed Pad, 176-LFBGA, 208-LQFP Exposed Pad, 80-BQFP, 64-BQFP, 68-BCPGA Exposed Pad, 384-BFBGA
Package / Case	-	6.1 mm
Package / Case	-	0.24 "
Package / Case	-	15.24 mm
Package / Case	-	0.6 in
Peripherals	-	WDT, DMA, PWM, POR, Brown-out Detect/Reset
Program Memory Size	-	1 - 512 KB
Program Memory Type	-	FLASH, ROMless
Qualification	-	AEC-Q100
RAM Size	-	1 - 102 K
RAM Size	-	82K x 16, 6K x 16, 4K x 16, 2K x 8, 18K x 16, 5K, 5K x 16
Speed	-	20 - 200 MHz
Supplier Device Package	288-FCBGA (23x23)	376-BGA (23x23), 176-LQFP (24x24), 548-FCBGA (27x27), 176-BGA (15x15), 841-FCBGA (24x24), 176-HLQFP (24x24), 337-NFBGA (16x16), 361-NFBGA, 288-BGA Microstar (16x16), 532-FC/CSP (23x23), 100-LQFP (14x14), 697-FCBGA (24x24), 38-TSSOP, 256-BGA (17x17), 196-NFBGA (10x10), 361-NFBGA (13x13), 64-TQFP (10x10), 132-BQFP, 100-HTQFP (14x14), 128-LQFP (14x14), 561-FC/CSP (23x23), 1031-FCBGA (25x25), 143-BGA MICROSTAR JUNIOR (7x7), 144-LQFP (20x20), 144-BGA MICROSTAR (12x12), 548-FC/CSP (23x23), 256-BGA (27x27), 737-FCBGA (24x24), 272-BGA (27x27), 48-LQFP (7x7), 337-BGA (13x13), 529-FCBGA (19x19), 338-BGA (13x13), 179-NFBGA (12x12), 179-BGA MicroStar (12x12), 240-BGA MICROSTAR, 68-PLCC (24.23x24.23), 688-FCBGA (23x23), 561-FCBGA (23x23), 625-FCBGA (21x21), 144-NFBGA (12x12), 532-FCBGA (23x23), 118-BGA MICROSTAR JUNIOR (7x7), 201-NFBGA (15x15), 100-BGA MICROSTAR (10x10), 257-BGA MICROSTAR (16x16), 684-FCBGA (23x23), 181-CPGA (39x39), 181-CPGA, 100-QFP (20x14), 56-VQFN (7x7), 325-CPGA (47.25x47.25), 384-FC/CSP (18x18), 144-HTQFP (20x20), 352-FCBGA (27x27), 240-NFBGA (15x15), 288-FCBGA (23x23), 201-BGA MICROSTAR (15x15), 169-BGA MicroStar (12x12), 548-FCBGA, 144-QFP (28x28), 288-NFBGA (16x16), 388-BGA (35x35), 40-PDIP, 304-PQFP (40x40), 80-HTQFP (12x12), 352-BGA (35x35), 305-CPGA, 32-LQFP (7x7), 100-NFBGA (10x10), 44-PLCC, 340-BGA (18x18), 176-BGA MICROSTAR (15x15), 352-FCBGA (35x35), 208-HLQFP (28x28), 80-QFP (14x20), 64-QFP (14x20), 68-CPGA (24.38x24.38), 384-FCBGA (18x18)
Supplier Device Package	-	16 - 47.25
Supplier Device Package	-	16 - 47.25
Type	Fixed Point	Fixed Point, Fixed/Floating Point, Digital Media System-on-Chip (DMSoC), Floating Point, DSP+ARM®
Voltage - Core	1.2 V	1 - 5 V
Voltage - Core	-	1 - 1.6 V
Voltage - Core	-	Variable
Voltage - I/O	3.3 V	1 - 5 V
Voltage - Supply (Vcc/Vdd)	-	1.14 - 4.5 V
Voltage - Supply (Vcc/Vdd)	-	1.26 - 5.5 V

TMS320 Series

IC DGTL MEDIA PROCESSOR 376-BGA

...

Part	Interface	On-Chip RAM	Operating Temperature [Min]	Operating Temperature [Max]	Type	Voltage - Core	Mounting Type	Package / Case	Supplier Device Package	Clock Rate	Voltage - I/O	Non-Volatile Memory	Non-Volatile Memory	Speed	Peripherals	Oscillator Type	Data Converters [custom]	Data Converters [custom]	Number of I/O	Core Size	RAM Size	Grade	Qualification	Program Memory Type	Core Processor	Program Memory Size	Voltage - Core [custom]	Connectivity	Data Converters	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	RAM Size
Texas Instruments TMS320DM6437ZDU5	10/100 Ethernet MAC, HPI, I2C, McASP, McBSP, PCI, UART	240 kB	0 °C	90 °C	Fixed Point	1.05 V, 1.2 V	Surface Mount	376-BBGA Exposed Pad	376-BGA (23x23)	500 MHz	1.8 V, 3.3 V	64 kB	ROM
Texas Instruments TMS320VC5502PGF200	Host Interface, I2C, McBSP, UART	80 kB	-40 °C	85 °C	Fixed Point	1.26 V	Surface Mount	176-LQFP	176-LQFP (24x24)	200 MHz	3.3 V	32 kB
Texas Instruments TMS320DM641AGNZ5		160 kB	0 °C	90 °C	Fixed Point	1.2 V	Surface Mount	548-BBGA, FCBGA	548-FCBGA (27x27)	500 MHz	3.3 V		External
Texas Instruments TMS320DSP105APGE16
Texas Instruments TMS320F28234ZJZS			-40 °C	125 °C			Surface Mount	176-BGA	176-BGA (15x15)					150 MHz	DMA, POR, PWM, WDT	Internal	16	12 b	88	32-Bit Single-Core	34 K	Automotive	AEC-Q100	FLASH	C28x	256 KB
Texas Instruments TMS320C6670AXCYPA2	EBI/EMI, Ethernet MAC, I2C, PCIe, SPI, SRIO, UART	6.25 MB	-40 °C	100 °C	Fixed/Floating Point		Surface Mount	841-BFBGA, FCBGA	841-FCBGA (24x24)	1.2 GHz	1 V, 1.5 V, 1.8 V	128 kB	ROM														1 V
Texas Instruments TMS320F28376SPTPS			-40 °C	125 ¯C			Surface Mount	176-LQFP Exposed Pad	176-HLQFP (24x24)					200 MHz	DMA, POR, PWM, WDT	Internal			97	32-Bit Single-Core	66 K			FLASH	C28x	512 KB		CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART, uPP, USB	A/D 20x12b, A/D 20x16b, D/A 3x12b	1.14 V	3.47 V
Texas Instruments TMS320C6424ZDU7	10/100 Ethernet MAC, EBI/EMI, HPI, I2C, McASP, McBSP, UART	240 kB	0 °C	90 °C	Fixed Point	1.05 V, 1.2 V	Surface Mount	376-BBGA Exposed Pad	376-BGA (23x23)	700 MHz	1.8 V, 3.3 V	64 kB	ROM
Texas Instruments TMS320F28235PTPQ			-40 °C	125 °C			Surface Mount	176-LQFP Exposed Pad	176-HLQFP (24x24)					150 MHz	DMA, POR, PWM, WDT	Internal	16	12 b	88	32-Bit Single-Core	34 K	Automotive	AEC-Q100	FLASH	C28x	512 KB
Texas Instruments TMS320F28377SZWTQ			-40 °C	125 °C			Surface Mount	337-LFBGA	337-NFBGA (16x16)					200 MHz	DMA, POR, PWM, WDT	Internal			169	32-Bit Single-Core		Automotive	AEC-Q100	FLASH	C28x	1 MB		CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART, uPP, USB	A/D 12x16b, A/D 24x12b, D/A 3x12b	1.14 V	3.47 V	82K x 16

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	60	$ 45.54
Texas Instruments	JEDEC TRAY (5+1)	1	$ 45.99
		100	$ 40.88
		250	$ 33.61
		1000	$ 30.06

Description

General part information

TMS320 Series

The TMS320C64x™ DSPs (including the TMS320C6413, TMS320C6410 devices) are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The TMS320C6413 and TMS320C6410 (C6413 and C6410) devices are based on the second-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture (VelociTI.2™) developed by Texas Instruments (TI)™ The high-performance, lower-cost C6413/C6410 DSPs enable customers to reduce system costs for telecom, medical, industrial, office, and photo lab equipment. The C64x™ is a code-compatible member of the C6000™ DSP platform.

With performance of up to 4000 million instructions per second (MIPS) at a clock rate of 500 MHz, the C6413 device offers cost-effective solutions to high-performance DSP programming challenges.

With performance of up to 3200 million instructions per second (MIPS) at a clock rate of 400 MHz, the C6410 device offers cost-effective solutions to high-performance DSP programming challenges. The C6410 device also provides excellent value for packet telephony and for other cost-sensitive applications demanding high performance. The C6410 device also provides excellent value for packet telephony and to other cost-sensitive applications demanding high performance

Documents

Technical documentation and resources

TMS320C6000 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (Rev. G)

TMS320C6413ZTSA500

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TMS320C6413ZTSA500

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Technical Specifications

TMS320 Series

Pricing

Description

TMS320 Series

Documents

TMS320C6000 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (Rev. G)

TMS320C6000 DSP Cache User's Guide (Rev. A)

Using a TMS320C6000 McBSP for Data Packing (Rev. A)

TMS320C64x EDMA Architecture

TMS320C6000 EDMA IO Scheduling and Performance

How to Migrate CCS 3.x Projects to the Latest CCS (Rev. A)

TMS320C6000 Host Port to the i80960 Microprocessors Interface (Rev. A)

TMS320C6410/13 Power Consumption Summary

Using IBIS Models for Timing Analysis (Rev. A)

Circular Buffering on TMS320C6000 (Rev. A)

Migrating from TMS320C64x to TMS320C64x+ (Rev. A)

TMS320C6000 DSP Host-Post Interface (HPI) Reference Guide (Rev. C)

Thermal Considerations for the DM64xx, DM64x, and C6000 Devices

TMS320C6000 EMIF to External Flash Memory (Rev. A)

TMS320C6000 McBSP Interface to an ST-BUS Device (Rev. B)

TMS320C64x Reference Design

TMS320C6000 McBSP Initialization (Rev. C)

TMS320C6000 DSP Peripherals Overview Reference Guide (Rev. Q)

TMS320C6000 DSP External Memory Interface (EMIF) Reference Guide (Rev. E)

Cache Usage in High-Performance DSP Applications with the TMS320C64x

TMS320 DSP/BIOS v5.42 User's Guide (Rev. I)

TMS320C6000 DSP Inter-Integrated Circuit (I2C) Module Reference Guide (Rev. D)

TMS320C6000 Enhanced DMA: Example Applications (Rev. A)

TMS320C6410/13/18 DSP Inter-Integrated Circuit (I2C) Module Addendum to SPRU175 (Rev. A)

TMS320C6000 Board Design: Considerations for Debug (Rev. C)

TMS320C6413 Hardware Designer's Resource Guide (Rev. D)

Use and Handling of Semiconductor Packages With ENIG Pad Finishes

TMS320C6413, TMS320C6410 Fixed-Point Digital Signal Processors datasheet (Rev. F)

TMS320C6000 DSP Designing for JTAG Emulation Reference Guide

TMS320C6000 HPI Boot Operation

TMS320C6000 McBSP to Voice Band Audio Processor (VBAP) Interface (Rev. A)

TMS320C6000 DSP 32-bit Timer Reference Guide (Rev. B)

TMS320C64x DSP Host Port Interface (HPI) Performance

TMS320C6000 McBSP: Interface to SPI ROM (Rev. C)

TMS320C6000 DSP TCP/IP Stack Software (Rev. C)

TMS320C6000 McBSP: IOM-2 Interface (Rev. A)

TMS320C6000 Host Port to MPC860 Interface (Rev. A)

TMS320C6000 Tools: Vector Table and Boot ROM Creation (Rev. D)

TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (Rev. J)

TMS320C6000 DSP Multi-channel Audio Serial Port (McASP) Reference Guide (Rev. J)

TMS320C6000 EMIF-to-External SDRAM Interface (Rev. E)

TMS320C6000 DSP General-Purpose Input/Output (GPIO) Reference Guide (Rev. A)

TMS320C64x DSP Two-Level Internal Memory Reference Guide (Rev. C)

TMS320C6000 Optimizing Compiler v 6.1 User's Guide (Rev. O)

General Guide to Implement Logarithmic and Exponential Operations on Fixed-Point

TMS320C6000 C Compiler: C Implementation of Intrinsics

Emulation and Trace Headers Technical Reference Manual (Rev. I)

TMS320C6000 Host Port to MC68360 Interface (Rev. A)

TMS320C6000 Board Design for JTAG (Rev. C)

TMS320C6000 DSP Power-Down Logic and Modes Reference Guide (Rev. C)

Using the TMS320C6000 McBSP as a High Speed Communication Port (Rev. A)

TMS320C6000 Multichannel Communications System Interface

TMS320C6000 EMIF to TMS320C6000 Host Port Interface (Rev. B)

TMS320C6000 McBSP: AC'97 Codec Interface (TLV320AIC27) (Rev. A)

Common Object File Format (COFF)

TMS320C64x EDMA Performance Data

TMS320C6413, TMS320C6410 DSPs Silicon Errata (Rev. C)

TMS320C6000 DSP Enhanced Direct Memory Access (EDMA) Controller Reference Guide (Rev. C)

TMS320C6000 EMIF to External Asynchronous SRAM Interface (Rev. A)

TMS320C6000 McBSP as a TDM Highway (Rev. A)

TMS320C6000 Assembly Language Tools v 6.1 User's Guide (Rev. Q)

TMS320C6000 u-Law and a-Law Companding with Software or the McBSP

Introduction to TMS320C6000 DSP Optimization

TMS320C6000 Chip Support Library API Reference Guide (Rev. J)

Technical Specifications

TMS320 Series