NC191SNL35

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Chip Quik Inc.

SMOOTH FLOW LEAD-FREE SOLDER PAS

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NC191SNL35

Active

Chip Quik Inc.

SMOOTH FLOW LEAD-FREE SOLDER PAS

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	NC191SNL35	NC191 Series

Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	Bi57.6Sn42Ag0.4 (57.6/42/0.4), Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Composition	-	Bi57Sn42Ag1 (57/42/1)
Flux Type	No-Clean	No-Clean
Form	35 g	2 - 50 g
Form	1.23 oz	0.07 - 30 oz
Form	10 cc	10 cc
Form	Syringe	Syringe, Jar, Jar, 8.8 oz (250g), Tube
Form	-	1.76 oz
Melting Point	-	137 - 183 °C
Melting Point	-	279 - 361 °F
Melting Point [Max] [custom]	428 °F	428 °F
Melting Point [Max] [custom]	220 °C	220 °C
Melting Point [Min] [custom]	217 °C	217 °C
Melting Point [Min] [custom]	422 °F	422 °F
Mesh Type	-	5
Mesh Type [custom]	4	4
Process	-	Leaded
Shelf Life	6 Months	6 - 24 Months
Shelf Life Start	Date of Manufacture	Date of Manufacture
Shipping Info	-	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Storage/Refrigeration Temperature	-	37 °F
Storage/Refrigeration Temperature	-	25 °C
Storage/Refrigeration Temperature	-	3 °C
Storage/Refrigeration Temperature	-	77 °F
Type	Solder Paste	Solder Paste, Flux - No Clean

NC191 Series

SMOOTH FLOW LOW TEMP SOLDER PAST

Part	Composition	Shelf Life	Shelf Life Start	Flux Type	Melting Point [custom]	Melting Point [custom]	Mesh Type	Type	Form	Form	Form	Form	Shipping Info	Mesh Type [custom]	Form	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Process	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]
Chip Quik Inc. NC191LT35T5	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	6 Months	Date of Manufacture	No-Clean	138 °C	280 °F	5	Solder Paste	35 g	1.23 oz	10 cc	Syringe
Chip Quik Inc. NC191LT10	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	6 Months	Date of Manufacture	No-Clean	138 °C	280 °F		Solder Paste	10 g	0.35 oz, 5 ml		Syringe	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	4
Chip Quik Inc. NC191SNL50T5	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	6 Months	Date of Manufacture	No-Clean			5	Solder Paste	50 g			Jar			1.76 oz	428 °F	217 °C	220 °C	422 °F
Chip Quik Inc. NC191AX35		12 Months	Date of Manufacture	No-Clean	183 °C	361 °F		Solder Paste	35 g	1.23 oz	10 cc	Syringe		4						Leaded
Chip Quik Inc. NC191LT250T5	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	6 Months	Date of Manufacture	No-Clean	138 °C	280 °F	5	Solder Paste				Jar, 8.8 oz (250g)
Chip Quik Inc. NC191LT35	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	6 Months	Date of Manufacture	No-Clean	138 °C	280 °F		Solder Paste	35 g	1.23 oz	10 cc	Syringe		4
Chip Quik Inc. NC191SNL35	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	6 Months	Date of Manufacture	No-Clean				Solder Paste	35 g	1.23 oz	10 cc	Syringe		4		428 °F	217 °C	220 °C	422 °F
Chip Quik Inc. NC191AX250T5		12 Months	Date of Manufacture	No-Clean	183 °C	361 °F	5	Solder Paste				Jar, 8.8 oz (250g)								Leaded
Chip Quik Inc. NC191SNL250	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	6 Months	Date of Manufacture	No-Clean				Solder Paste				Jar, 8.8 oz (250g)		4		428 °F	217 °C	220 °C	422 °F
Chip Quik Inc. NC191-2CC6		24 Months	Date of Manufacture					Flux - No Clean	2 g	0.07 oz, 2 cc		Tube									37 °F	25 °C	3 °C	77 °F

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 18.95

Description

General part information

NC191 Series

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (35g), 10cc

Documents

Technical documentation and resources