NC191LT35

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Chip Quik Inc.

SMOOTH FLOW LOW TEMP SOLDER PAST

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NC191LT35

Active

Chip Quik Inc.

SMOOTH FLOW LOW TEMP SOLDER PAST

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 17.95

Description

General part information

NC191 Series

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Syringe, 1.23 oz (35g), 10cc

Documents

Technical documentation and resources

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	NC191LT35	NC191 Series

Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	Bi57.6Sn42Ag0.4 (57.6/42/0.4), Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Composition	-	Bi57Sn42Ag1 (57/42/1)
Flux Type	No-Clean	No-Clean
Form	35 g	2 - 50 g
Form	1.23 oz	0.07 - 30 oz
Form	10 cc	10 cc
Form	Syringe	Syringe, Jar, Jar, 8.8 oz (250g), Tube
Form	-	1.76 oz
Melting Point	-	428 °F
Melting Point	-	217 °C
Melting Point	-	220 °C
Melting Point	-	422 °F
Melting Point [custom]	138 °C	137 - 183 °C
Melting Point [custom]	280 °F	279 - 361 °F
Mesh Type	-	5
Mesh Type [custom]	4	4
Process	-	Leaded
Shelf Life	6 Months	6 - 24 Months
Shelf Life Start	Date of Manufacture	Date of Manufacture
Shipping Info	-	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Storage/Refrigeration Temperature	-	37 °F
Storage/Refrigeration Temperature	-	25 °C
Storage/Refrigeration Temperature	-	3 °C
Storage/Refrigeration Temperature	-	77 °F
Type	Solder Paste	Solder Paste, Flux - No Clean

NC191 Series

SMOOTH FLOW LOW TEMP SOLDER PAST

Part	Composition	Shelf Life	Shelf Life Start	Flux Type	Melting Point [custom]	Melting Point [custom]	Mesh Type	Type	Form	Form	Form	Form	Shipping Info	Mesh Type [custom]	Form	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Melting Point [Max] [custom]	Melting Point [Min] [custom]	Process	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Storage/Refrigeration Temperature [Max]
Chip Quik Inc. NC191LT35T5	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	6 Months	Date of Manufacture	No-Clean	138 °C	280 °F	5	Solder Paste	35 g	1.23 oz	10 cc	Syringe
Chip Quik Inc. NC191LT10	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	6 Months	Date of Manufacture	No-Clean	138 °C	280 °F		Solder Paste	10 g	0.35 oz, 5 ml		Syringe	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	4
Chip Quik Inc. NC191SNL50T5	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	6 Months	Date of Manufacture	No-Clean			5	Solder Paste	50 g			Jar			1.76 oz	428 °F	217 °C	220 °C	422 °F
Chip Quik Inc. NC191AX35		12 Months	Date of Manufacture	No-Clean	183 °C	361 °F		Solder Paste	35 g	1.23 oz	10 cc	Syringe		4						Leaded
Chip Quik Inc. NC191LT250T5	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	6 Months	Date of Manufacture	No-Clean	138 °C	280 °F	5	Solder Paste				Jar, 8.8 oz (250g)
Chip Quik Inc. NC191LT35	Bi57.6Sn42Ag0.4 (57.6/42/0.4)	6 Months	Date of Manufacture	No-Clean	138 °C	280 °F		Solder Paste	35 g	1.23 oz	10 cc	Syringe		4
Chip Quik Inc. NC191SNL35	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	6 Months	Date of Manufacture	No-Clean				Solder Paste	35 g	1.23 oz	10 cc	Syringe		4		428 °F	217 °C	220 °C	422 °F
Chip Quik Inc. NC191AX250T5		12 Months	Date of Manufacture	No-Clean	183 °C	361 °F	5	Solder Paste				Jar, 8.8 oz (250g)								Leaded
Chip Quik Inc. NC191SNL250	Sn96.5Ag3Cu0.5 (96.5/3/0.5)	6 Months	Date of Manufacture	No-Clean				Solder Paste				Jar, 8.8 oz (250g)		4		428 °F	217 °C	220 °C	422 °F
Chip Quik Inc. NC191-2CC6		24 Months	Date of Manufacture					Flux - No Clean	2 g	0.07 oz, 2 cc		Tube									37 °F	25 °C	3 °C	77 °F