NC191LT250T5
ActiveChip Quik Inc.
SMOOTH FLOW LOW TEMP SOLDER PAST
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NC191LT250T5
ActiveChip Quik Inc.
SMOOTH FLOW LOW TEMP SOLDER PAST
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | NC191LT250T5 |
|---|---|
| Composition | Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
| Flux Type | No-Clean |
| Form | Jar, 8.8 oz (250g) |
| Melting Point [custom] | 138 °C |
| Melting Point [custom] | 280 °F |
| Mesh Type | 5 |
| Shelf Life | 6 Months |
| Shelf Life Start | Date of Manufacture |
| Type | Solder Paste |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 67.95 | |
Description
General part information
NC191LT250T5
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)
Documents
Technical documentation and resources