SMOOTH FLOW LEAD-FREE SOLDER PAS
| Part | Shelf Life | Mesh Type | Form | Form | Form | Composition | Type | Shelf Life Start | Flux Type | Melting Point [Max] [custom] | Melting Point [Min] [custom] | Melting Point [Max] [custom] | Melting Point [Min] [custom] | Melting Point [custom] | Melting Point [custom] | Mesh Type [custom] | Form | Form | Process | Composition [custom] | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Chip Quik Inc. NC191SNL50T5 | 6 Months | 5 | Jar | 1.76 oz | 50 g | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | Date of Manufacture | No-Clean | 428 °F | 217 °C | 220 °C | 422 °F | |||||||||||
Chip Quik Inc. NC191AX35 | 12 Months | Syringe | 35 g | Solder Paste | Date of Manufacture | No-Clean | 361 °F | 183 °C | 4 | 1.23 oz | 10 cc | Leaded | ||||||||||||
Chip Quik Inc. NC191LT250T5 | 6 Months | 5 | Jar, 8.8 oz (250g) | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Solder Paste | Date of Manufacture | No-Clean | 280 °F | 138 °C | |||||||||||||||
Chip Quik Inc. NC191LT35 | 6 Months | Syringe | 35 g | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Solder Paste | Date of Manufacture | No-Clean | 280 °F | 138 °C | 4 | 1.23 oz | 10 cc | ||||||||||||
Chip Quik Inc. NC191LTA15T5 | 12 Months | 5 | Syringe | 15 g | Solder Paste | Date of Manufacture | No-Clean | 279 °F | 137 °C | 0.53 oz, 5 ml | Bi57Sn42Ag1 (57/42/1) | |||||||||||||
Chip Quik Inc. NC191SNL35 | 6 Months | Syringe | 35 g | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | Date of Manufacture | No-Clean | 428 °F | 217 °C | 220 °C | 422 °F | 4 | 1.23 oz | 10 cc | ||||||||||
Chip Quik Inc. NC191AX250T5 | 12 Months | 5 | Jar, 8.8 oz (250g) | Solder Paste | Date of Manufacture | No-Clean | 361 °F | 183 °C | Leaded | |||||||||||||||
Chip Quik Inc. NC191SNL250 | 6 Months | Jar, 8.8 oz (250g) | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | Date of Manufacture | No-Clean | 428 °F | 217 °C | 220 °C | 422 °F | 4 | |||||||||||||
Chip Quik Inc. NC191-2CC6 | 24 Months | Tube | 2 g | Flux - No Clean | Date of Manufacture | 0.07 oz, 2 cc | 37 °F | 25 °C | 3 °C | 77 °F | ||||||||||||||
Chip Quik Inc. NC191LTA50T5 | 12 Months | 5 | Jar | 1.76 oz | 50 g | Solder Paste | Date of Manufacture | No-Clean | 279 °F | 137 °C | Bi57Sn42Ag1 (57/42/1) |