Specification	XR2C-1511-N

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	20 mOhm
Current Rating	1 A
Features	Closed Frame
Grid Columns	15
Grid Rows	1
Housing Material	Glass Filled, Polybutylene Terephthalate, PBT
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	15
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.126 in
Type	SIP

XR2C Series

Part	Contact Finish Thickness - Post	Type	Material Flammability Rating	Termination Post Length	Contact Finish Thickness - Mating	Contact Material - Post	Current Rating	Contact Material - Mating	Pitch - Mating	Housing Material	Contact Resistance	Contact Finish - Mating	Mounting Type	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Operating Temperature (Max)	Operating Temperature (Min)	Pitch - Post	Contact Finish - Post	Termination	Features
Omron Electronics Inc-EMC Div XR2C1011N	10 µin	SIP	UL94 V-0	0.138 in	10 µin	Brass	1 A	Beryllium Copper	0.1 in	Glass Filled PBT Polybutylene Terephthalate	20 mOhm	Gold	Threaded	10	10	1	125 °C	-55 °C	0.1 in	Gold	Solder
Omron Electronics Inc-EMC Div XR2C-3205	30 µin	SIP	UL94 V-0	0.092 in	30 µin	Beryllium Copper	1 A	Beryllium Copper	0.1 in	Glass Filled PBT Polybutylene Terephthalate	20 mOhm	Gold	Through Hole	32	32	1	125 °C	-55 °C	0.1 in	Gold	Solder	Closed Frame
Omron Electronics Inc-EMC Div XR2C-0311-N	10 µin	SIP	UL94 V-0	0.126 in	10 µin	Beryllium Copper	1 A	Beryllium Copper	0.1 in	Glass Filled PBT Polybutylene Terephthalate	20 mOhm	Gold	Through Hole	3	3	1	125 °C	-55 °C	0.1 in	Gold	Solder	Closed Frame
Omron Electronics Inc-EMC Div XR2C-1511-N	10 µin	SIP	UL94 V-0	0.126 in	10 µin	Beryllium Copper	1 A	Beryllium Copper	0.1 in	Glass Filled PBT Polybutylene Terephthalate	20 mOhm	Gold	Through Hole	15	15	1	125 °C	-55 °C	0.1 in	Gold	Solder	Closed Frame
Omron Electronics Inc-EMC Div XR2C-3215	10 µin	SIP	UL94 V-0	0.092 in	10 µin	Brass	1 A	Beryllium Copper	0.1 in	Glass Filled PBT Polybutylene Terephthalate	20 mOhm	Gold	Threaded	32	32	1	125 °C	-55 °C	0.1 in	Gold	Solder

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XR2C-1511-N | Datasheet

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