Zenode.ai Logo
Beta
K
XR2C-0311-N - XR2C-0311-N

XR2C-0311-N

Active
Omron Electronics Inc-EMC Div

CONN SOCKET SIP 3POS GOLD

Deep-Dive with AI

Search across all available documentation for this part.

XR2C-0311-N - XR2C-0311-N

XR2C-0311-N

Active
Omron Electronics Inc-EMC Div

CONN SOCKET SIP 3POS GOLD

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationXR2C-0311-N
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post10 çin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - PostBeryllium Copper
Contact Resistance20 mOhm
Current Rating (Amps)1 A
FeaturesClosed Frame
Housing MaterialPolybutylene Terephthalate (PBT), Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)3
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.2 mm
Termination Post Length0.126 in
TypeSIP

XR2C Series

PartTerminationContact Material - MatingTermination Post Length [x]Termination Post Length [x]Operating Temperature [Min]Operating Temperature [Max]Material Flammability RatingCurrent Rating (Amps)Pitch - MatingPitch - MatingContact Finish - MatingContact Finish Thickness - PostContact Finish Thickness - PostContact Finish Thickness - MatingContact Finish Thickness - MatingContact Finish - PostHousing MaterialMounting TypePitch - PostPitch - PostTypeNumber of Positions or Pins (Grid)Contact Material - Post [custom]Contact ResistanceContact Material - PostNumber of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid) [custom]FeaturesTermination Post LengthTermination Post Length
Omron Electronics Inc-EMC Div
Solder
Beryllium Copper
0.138 in
3.5 mm
-55 °C
125 °C
UL94 V-0
1 A
0.1 in
2.54 mm
Gold
10 çin
0.25 çm
10 çin
0.25 çm
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
Threaded
2.54 mm
0.1 in
SIP
10
Brass
20 mOhm
Omron Electronics Inc-EMC Div
Solder
Beryllium Copper
-55 °C
125 °C
UL94 V-0
1 A
0.1 in
2.54 mm
Gold
30 µin
0.76 µm
30 Áin
0.76 Ám
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
Through Hole
2.54 mm
0.1 in
SIP
20 mOhm
Beryllium Copper
1 x 32
32
Closed Frame
Omron Electronics Inc-EMC Div
Solder
Beryllium Copper
-55 °C
125 °C
UL94 V-0
1 A
0.1 in
2.54 mm
Gold
10 çin
0.25 çm
10 çin
0.25 çm
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
Through Hole
2.54 mm
0.1 in
SIP
3
20 mOhm
Beryllium Copper
Closed Frame
3.2 mm
0.126 in
Omron Electronics Inc-EMC Div
Solder
Beryllium Copper
-55 °C
125 °C
UL94 V-0
1 A
0.1 in
2.54 mm
Gold
10 çin
0.25 çm
10 çin
0.25 çm
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
Through Hole
2.54 mm
0.1 in
SIP
15
20 mOhm
Beryllium Copper
Closed Frame
3.2 mm
0.126 in
Omron Electronics Inc-EMC Div
Solder
Beryllium Copper
-55 °C
125 °C
UL94 V-0
1 A
0.1 in
2.54 mm
Gold
10 çin
0.25 çm
10 çin
0.25 çm
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
Threaded
2.54 mm
0.1 in
SIP
Brass
20 mOhm
1 x 32
32

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 0.61
10$ 0.53
25$ 0.48
50$ 0.46
100$ 0.44
250$ 0.40
500$ 0.38
1000$ 0.31
3000$ 0.28

Description

General part information

XR2C Series

3 (1 x 3) Pos SIP Socket Gold Through Hole

Documents

Technical documentation and resources