XR2C-3205

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Omron Electronics Inc-EMC Div

CONN SOCKET SIP 32POS GOLD

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XR2C-3205

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Omron Electronics Inc-EMC Div

CONN SOCKET SIP 32POS GOLD

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DocumentsHow to Read Date Codes Datasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	XR2C-3205

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	30 µin
Contact Finish Thickness - Post	0.76 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	20 mOhm
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid) [custom]	1 x 32
Number of Positions or Pins (Grid) [custom]	32
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Type	SIP

XR2C Series

Part	Termination	Contact Material - Mating	Termination Post Length [x]	Termination Post Length [x]	Operating Temperature [Min]	Operating Temperature [Max]	Material Flammability Rating	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Housing Material	Mounting Type	Pitch - Post	Pitch - Post	Type	Number of Positions or Pins (Grid)	Contact Material - Post [custom]	Contact Resistance	Contact Material - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Features	Termination Post Length	Termination Post Length
Omron Electronics Inc-EMC Div XR2C1011N	Solder	Beryllium Copper	0.138 in	3.5 mm	-55 °C	125 °C	UL94 V-0	1 A	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	10 çin	0.25 çm	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Threaded	2.54 mm	0.1 in	SIP	10	Brass	20 mOhm
Omron Electronics Inc-EMC Div XR2C-3205	Solder	Beryllium Copper			-55 °C	125 °C	UL94 V-0	1 A	0.1 in	2.54 mm	Gold	30 µin	0.76 µm	30 Áin	0.76 Ám	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	2.54 mm	0.1 in	SIP			20 mOhm	Beryllium Copper	1 x 32	32	Closed Frame
Omron Electronics Inc-EMC Div XR2C-0311-N	Solder	Beryllium Copper			-55 °C	125 °C	UL94 V-0	1 A	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	10 çin	0.25 çm	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	2.54 mm	0.1 in	SIP	3		20 mOhm	Beryllium Copper			Closed Frame	3.2 mm	0.126 in
Omron Electronics Inc-EMC Div XR2C-1511-N	Solder	Beryllium Copper			-55 °C	125 °C	UL94 V-0	1 A	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	10 çin	0.25 çm	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Through Hole	2.54 mm	0.1 in	SIP	15		20 mOhm	Beryllium Copper			Closed Frame	3.2 mm	0.126 in
Omron Electronics Inc-EMC Div XR2C-3215	Solder	Beryllium Copper			-55 °C	125 °C	UL94 V-0	1 A	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	10 çin	0.25 çm	Gold	Polybutylene Terephthalate (PBT) Glass Filled	Threaded	2.54 mm	0.1 in	SIP		Brass	20 mOhm		1 x 32	32

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 7.13
		10	$ 6.05
		25	$ 5.67
		50	$ 5.40
		100	$ 5.15
		300	$ 4.76
		500	$ 4.59
		1000	$ 4.37