XR2C Series
Manufacturer: Omron Electronics Inc-EMC Div
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⌘K
CONN SOCKET SIP 10POS GOLD
| Part | Contact Finish Thickness - Post | Type | Material Flammability Rating | Termination Post Length | Contact Finish Thickness - Mating | Contact Material - Post | Current Rating | Contact Material - Mating | Pitch - Mating | Housing Material | Contact Resistance | Contact Finish - Mating | Mounting Type | Grid Columns | Number of Positions or Pins (Grid) | Grid Rows | Operating Temperature (Max) | Operating Temperature (Min) | Pitch - Post | Contact Finish - Post | Termination | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Omron Electronics Inc-EMC Div | 10 µin | SIP | UL94 V-0 | 0.138 in | 10 µin | Brass | 1 A | Beryllium Copper | 0.1 in | Glass Filled PBT Polybutylene Terephthalate | 20 mOhm | Gold | Threaded | 10 | 10 | 1 | 125 °C | -55 °C | 0.1 in | Gold | Solder | |
 Omron Electronics Inc-EMC Div | 30 µin | SIP | UL94 V-0 | 0.092 in | 30 µin | Beryllium Copper | 1 A | Beryllium Copper | 0.1 in | Glass Filled PBT Polybutylene Terephthalate | 20 mOhm | Gold | Through Hole | 32 | 32 | 1 | 125 °C | -55 °C | 0.1 in | Gold | Solder | Closed Frame |
 Omron Electronics Inc-EMC Div | 10 µin | SIP | UL94 V-0 | 0.126 in | 10 µin | Beryllium Copper | 1 A | Beryllium Copper | 0.1 in | Glass Filled PBT Polybutylene Terephthalate | 20 mOhm | Gold | Through Hole | 3 | 3 | 1 | 125 °C | -55 °C | 0.1 in | Gold | Solder | Closed Frame |
 Omron Electronics Inc-EMC Div | 10 µin | SIP | UL94 V-0 | 0.126 in | 10 µin | Beryllium Copper | 1 A | Beryllium Copper | 0.1 in | Glass Filled PBT Polybutylene Terephthalate | 20 mOhm | Gold | Through Hole | 15 | 15 | 1 | 125 °C | -55 °C | 0.1 in | Gold | Solder | Closed Frame |
Omron Electronics Inc-EMC Div | 10 µin | SIP | UL94 V-0 | 0.092 in | 10 µin | Brass | 1 A | Beryllium Copper | 0.1 in | Glass Filled PBT Polybutylene Terephthalate | 20 mOhm | Gold | Threaded | 32 | 32 | 1 | 125 °C | -55 °C | 0.1 in | Gold | Solder |