CONN SOCKET SIP 10POS GOLD
| Part | Termination | Contact Material - Mating | Termination Post Length [x] | Termination Post Length [x] | Operating Temperature [Min] | Operating Temperature [Max] | Material Flammability Rating | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Housing Material | Mounting Type | Pitch - Post | Pitch - Post | Type | Number of Positions or Pins (Grid) | Contact Material - Post [custom] | Contact Resistance | Contact Material - Post | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Features | Termination Post Length | Termination Post Length | 
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Omron Electronics Inc-EMC Div  | Solder  | Beryllium Copper  | 0.138 in  | 3.5 mm  | -55 °C  | 125 °C  | UL94 V-0  | 1 A  | 0.1 in  | 2.54 mm  | Gold  | 10 çin  | 0.25 çm  | 10 çin  | 0.25 çm  | Gold  | Polybutylene Terephthalate (PBT)  Glass Filled  | Threaded  | 2.54 mm  | 0.1 in  | SIP  | 10  | Brass  | 20 mOhm  | ||||||
Omron Electronics Inc-EMC Div  | Solder  | Beryllium Copper  | -55 °C  | 125 °C  | UL94 V-0  | 1 A  | 0.1 in  | 2.54 mm  | Gold  | 30 µin  | 0.76 µm  | 30 Áin  | 0.76 Ám  | Gold  | Polybutylene Terephthalate (PBT)  Glass Filled  | Through Hole  | 2.54 mm  | 0.1 in  | SIP  | 20 mOhm  | Beryllium Copper  | 1 x 32  | 32  | Closed Frame  | ||||||
Omron Electronics Inc-EMC Div  | Solder  | Beryllium Copper  | -55 °C  | 125 °C  | UL94 V-0  | 1 A  | 0.1 in  | 2.54 mm  | Gold  | 10 çin  | 0.25 çm  | 10 çin  | 0.25 çm  | Gold  | Polybutylene Terephthalate (PBT)  Glass Filled  | Through Hole  | 2.54 mm  | 0.1 in  | SIP  | 3  | 20 mOhm  | Beryllium Copper  | Closed Frame  | 3.2 mm  | 0.126 in  | |||||
Omron Electronics Inc-EMC Div  | Solder  | Beryllium Copper  | -55 °C  | 125 °C  | UL94 V-0  | 1 A  | 0.1 in  | 2.54 mm  | Gold  | 10 çin  | 0.25 çm  | 10 çin  | 0.25 çm  | Gold  | Polybutylene Terephthalate (PBT)  Glass Filled  | Through Hole  | 2.54 mm  | 0.1 in  | SIP  | 15  | 20 mOhm  | Beryllium Copper  | Closed Frame  | 3.2 mm  | 0.126 in  | |||||
Omron Electronics Inc-EMC Div  | Solder  | Beryllium Copper  | -55 °C  | 125 °C  | UL94 V-0  | 1 A  | 0.1 in  | 2.54 mm  | Gold  | 10 çin  | 0.25 çm  | 10 çin  | 0.25 çm  | Gold  | Polybutylene Terephthalate (PBT)  Glass Filled  | Threaded  | 2.54 mm  | 0.1 in  | SIP  | Brass  | 20 mOhm  | 1 x 32  | 32  |