TMS320F28075PTPS

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Texas Instruments

C2000™ 32-BIT MCU WITH 120 MHZ, FPU, TMU, 512 KB FLASH, CLA, SDFM

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DocumentsMaximizing power for Level 3 EV charging stations C2000™ Safety Mechanisms (Rev. B)+109

TMS320F28075PTPS

Active

Texas Instruments

C2000™ 32-BIT MCU WITH 120 MHZ, FPU, TMU, 512 KB FLASH, CLA, SDFM

Deep-Dive with AI

DocumentsMaximizing power for Level 3 EV charging stations C2000™ Safety Mechanisms (Rev. B)+109

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	TMS320F28075PTPS	TMS320 Series

	-	-
Clock Rate	-	1 - 900 MHz
Clock Rate	-	364.5 - 405 MHz
Clock Rate	-	513 - 810 MHz
Clock Rate	-	256 - 720 MHz
Connectivity	CANbus, McBSP, EBI/EMI, UART/USART, SCI, USB, I2C, SPI	I2C, EBI/EMI, UART/USART, CANbus, USB, uPP, SPI, SCI, McBSP, LINbus
Core Processor	C28x	C28x, C2xx DSP
Core Size	32-Bit Single-Core	32-Bit Single-Core, 16-Bit
Core Size	-	32-Bit Dual-Core
Data Converters	D/A 3x12b, A/D 17x12b	D/A 3x12b, A/D 20x12b, A/D 20x16b, A/D 12x16b, A/D 24x12b, A/D 14x12b, 14x12b, A/D 13x12b, A/D 9x16b, A/D 14x16b, 12x12b, D/A 1x12b, A/D 17x12b
Data Converters	-	5 - 16
Data Converters	-	10 - 12 b
Data Converters	-	6 - 12 b
Data Converters	-	10 - 12 b
Data Converters	-	4
Data Converters	-	10
Grade	-	Automotive
Interface	-	McASP, PCI, UART, McBSP, 10/100 Ethernet MAC, I2C, HPI, Host Interface, SPI, Ethernet MAC, PCIe, SRIO, EBI/EMI, TSIP, 10/100/1000 Ethernet, UTOPIA, SSP, USB, I2S, MMC/SD, UART/USART, TDM, BSP, Ethernet, Serial ATA, SD/SDIO, Telecom, UTPOIA, ASP, Serial Port, SCI, CAN, Duplex Serial Port, 10/100/1000 Ethernet MAC, UPP, DDR3, Communication Ports, LCD, McSPI, UHPI, MMC/SD/SDIO, SATA, Parallel
Interface	-	Host Interface
Interface	-	Duplex Serial Port
Mounting Type	Surface Mount	Surface Mount, Through Hole
Non-Volatile Memory	-	1.088 - 768 kB
Non-Volatile Memory	-	ROM, External, FLASH
Non-Volatile Memory	-	8 kB
Number of I/O	97	13 - 169
On-Chip RAM	-	1 - 896 kB
On-Chip RAM	-	2.1 - 248 MB
On-Chip RAM	-	8 kB
Operating Temperature	-	-40 - 105 °C
Operating Temperature	-	125 °C
Operating Temperature	-	-55 °C
Operating Temperature [Max]	125 ¯C	70 - 125 °C
Operating Temperature [Min]	-40 °C	-40 - 0 °C
Oscillator Type	External	Internal, External
Package / Case	176-LQFP Exposed Pad	376-BBGA Exposed Pad, 176-LQFP, 548-BBGA, FCBGA, 176-BGA, 841-BFBGA, 176-LQFP Exposed Pad, 337-LFBGA, 361-LFBGA, 80-LQFP, 288-LFBGA, 532-BFBGA, 100-LQFP, 697-BFBGA, 38-TSSOP, 256-BGA, 196-LFBGA, 64-TQFP, 132-BQFP Bumpered, 100-TQFP Exposed Pad, 128-LQFP, 561-BFBGA, FCCSPBGA, 1031-BFBGA, 143-VFBGA, 144-LQFP, 144-LFBGA, 548-BFBGA, 737-BFBGA, 272-BBGA, 48-LQFP, 529-BFBGA, 338-LFBGA, 240-LFBGA, 68-LCC (J-Lead), 688-BFBGA, FCBGA Exposed Pad, 625-BFBGA, 201-LFBGA, 100-LFBGA, 257-LFBGA, 684-BFBGA, 181-BCPGA Exposed Pad, 181-CPGA, 100-BQFP, 56-VFQFN Exposed Pad, 325-BFCPGA Exposed Pad, 384-FBGA, 144-TQFP Exposed Pad, 352-BBGA, FCBGA Exposed Pad, 288-BBGA, 169-LFBGA, 144-BQFP, 388-BBGA, 40-DIP, 304-BFQFP Exposed Pad, 80-TQFP Exposed Pad, 352-BBGA, 352-LBGA, 305-BFCPGA Exposed Pad, 32-LQFP, 44-LCC (J-Lead), 340-FBGA Exposed Pad, 176-LFBGA, 208-LQFP Exposed Pad, 80-BQFP, 64-BQFP, 68-BCPGA Exposed Pad, 384-BFBGA
Package / Case	-	6.1 mm
Package / Case	-	0.24 "
Package / Case	-	15.24 mm
Package / Case	-	0.6 in
Peripherals	WDT, DMA, PWM, POR	WDT, DMA, PWM, POR, Brown-out Detect/Reset
Program Memory Size	512 KB	1 - 512 KB
Program Memory Type	FLASH	FLASH, ROMless
Qualification	-	AEC-Q100
RAM Size	-	1 - 102 K
RAM Size	-	82K x 16, 6K x 16, 4K x 16, 2K x 8, 18K x 16, 5K, 5K x 16
Speed	120 MHz	20 - 200 MHz
Supplier Device Package	176-HLQFP (24x24)	376-BGA (23x23), 176-LQFP (24x24), 548-FCBGA (27x27), 176-BGA (15x15), 841-FCBGA (24x24), 176-HLQFP (24x24), 337-NFBGA (16x16), 361-NFBGA, 288-BGA Microstar (16x16), 532-FC/CSP (23x23), 100-LQFP (14x14), 697-FCBGA (24x24), 38-TSSOP, 256-BGA (17x17), 196-NFBGA (10x10), 361-NFBGA (13x13), 64-TQFP (10x10), 132-BQFP, 100-HTQFP (14x14), 128-LQFP (14x14), 561-FC/CSP (23x23), 1031-FCBGA (25x25), 143-BGA MICROSTAR JUNIOR (7x7), 144-LQFP (20x20), 144-BGA MICROSTAR (12x12), 548-FC/CSP (23x23), 256-BGA (27x27), 737-FCBGA (24x24), 272-BGA (27x27), 48-LQFP (7x7), 337-BGA (13x13), 529-FCBGA (19x19), 338-BGA (13x13), 179-NFBGA (12x12), 179-BGA MicroStar (12x12), 240-BGA MICROSTAR, 68-PLCC (24.23x24.23), 688-FCBGA (23x23), 561-FCBGA (23x23), 625-FCBGA (21x21), 144-NFBGA (12x12), 532-FCBGA (23x23), 118-BGA MICROSTAR JUNIOR (7x7), 201-NFBGA (15x15), 100-BGA MICROSTAR (10x10), 257-BGA MICROSTAR (16x16), 684-FCBGA (23x23), 181-CPGA (39x39), 181-CPGA, 100-QFP (20x14), 56-VQFN (7x7), 325-CPGA (47.25x47.25), 384-FC/CSP (18x18), 144-HTQFP (20x20), 352-FCBGA (27x27), 240-NFBGA (15x15), 288-FCBGA (23x23), 201-BGA MICROSTAR (15x15), 169-BGA MicroStar (12x12), 548-FCBGA, 144-QFP (28x28), 288-NFBGA (16x16), 388-BGA (35x35), 40-PDIP, 304-PQFP (40x40), 80-HTQFP (12x12), 352-BGA (35x35), 305-CPGA, 32-LQFP (7x7), 100-NFBGA (10x10), 44-PLCC, 340-BGA (18x18), 176-BGA MICROSTAR (15x15), 352-FCBGA (35x35), 208-HLQFP (28x28), 80-QFP (14x20), 64-QFP (14x20), 68-CPGA (24.38x24.38), 384-FCBGA (18x18)
Supplier Device Package	-	16 - 47.25
Supplier Device Package	-	16 - 47.25
Type	-	Fixed Point, Fixed/Floating Point, Digital Media System-on-Chip (DMSoC), Floating Point, DSP+ARM®
Voltage - Core	-	1 - 5 V
Voltage - Core	-	1 - 1.6 V
Voltage - Core	-	Variable
Voltage - I/O	-	1 - 5 V
Voltage - Supply (Vcc/Vdd) [Max]	3.47 V	1.26 - 5.5 V
Voltage - Supply (Vcc/Vdd) [Min]	1.14 V	1.14 - 4.5 V

TMS320 Series

IC DGTL MEDIA PROCESSOR 376-BGA

...

Part	Interface	On-Chip RAM	Operating Temperature [Min]	Operating Temperature [Max]	Type	Voltage - Core	Mounting Type	Package / Case	Supplier Device Package	Clock Rate	Voltage - I/O	Non-Volatile Memory	Non-Volatile Memory	Speed	Peripherals	Oscillator Type	Data Converters [custom]	Data Converters [custom]	Number of I/O	Core Size	RAM Size	Grade	Qualification	Program Memory Type	Core Processor	Program Memory Size	Voltage - Core [custom]	Connectivity	Data Converters	Voltage - Supply (Vcc/Vdd) [Min]	Voltage - Supply (Vcc/Vdd) [Max]	RAM Size
Texas Instruments TMS320DM6437ZDU5	10/100 Ethernet MAC, HPI, I2C, McASP, McBSP, PCI, UART	240 kB	0 °C	90 °C	Fixed Point	1.05 V, 1.2 V	Surface Mount	376-BBGA Exposed Pad	376-BGA (23x23)	500 MHz	1.8 V, 3.3 V	64 kB	ROM
Texas Instruments TMS320VC5502PGF200	Host Interface, I2C, McBSP, UART	80 kB	-40 °C	85 °C	Fixed Point	1.26 V	Surface Mount	176-LQFP	176-LQFP (24x24)	200 MHz	3.3 V	32 kB
Texas Instruments TMS320DM641AGNZ5		160 kB	0 °C	90 °C	Fixed Point	1.2 V	Surface Mount	548-BBGA, FCBGA	548-FCBGA (27x27)	500 MHz	3.3 V		External
Texas Instruments TMS320DSP105APGE16
Texas Instruments TMS320F28234ZJZS			-40 °C	125 °C			Surface Mount	176-BGA	176-BGA (15x15)					150 MHz	DMA, POR, PWM, WDT	Internal	16	12 b	88	32-Bit Single-Core	34 K	Automotive	AEC-Q100	FLASH	C28x	256 KB
Texas Instruments TMS320C6670AXCYPA2	EBI/EMI, Ethernet MAC, I2C, PCIe, SPI, SRIO, UART	6.25 MB	-40 °C	100 °C	Fixed/Floating Point		Surface Mount	841-BFBGA, FCBGA	841-FCBGA (24x24)	1.2 GHz	1 V, 1.5 V, 1.8 V	128 kB	ROM														1 V
Texas Instruments TMS320F28376SPTPS			-40 °C	125 ¯C			Surface Mount	176-LQFP Exposed Pad	176-HLQFP (24x24)					200 MHz	DMA, POR, PWM, WDT	Internal			97	32-Bit Single-Core	66 K			FLASH	C28x	512 KB		CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART, uPP, USB	A/D 20x12b, A/D 20x16b, D/A 3x12b	1.14 V	3.47 V
Texas Instruments TMS320C6424ZDU7	10/100 Ethernet MAC, EBI/EMI, HPI, I2C, McASP, McBSP, UART	240 kB	0 °C	90 °C	Fixed Point	1.05 V, 1.2 V	Surface Mount	376-BBGA Exposed Pad	376-BGA (23x23)	700 MHz	1.8 V, 3.3 V	64 kB	ROM
Texas Instruments TMS320F28235PTPQ			-40 °C	125 °C			Surface Mount	176-LQFP Exposed Pad	176-HLQFP (24x24)					150 MHz	DMA, POR, PWM, WDT	Internal	16	12 b	88	32-Bit Single-Core	34 K	Automotive	AEC-Q100	FLASH	C28x	512 KB
Texas Instruments TMS320F28377SZWTQ			-40 °C	125 °C			Surface Mount	337-LFBGA	337-NFBGA (16x16)					200 MHz	DMA, POR, PWM, WDT	Internal			169	32-Bit Single-Core		Automotive	AEC-Q100	FLASH	C28x	1 MB		CANbus, EBI/EMI, I2C, McBSP, SCI, SPI, UART/USART, uPP, USB	A/D 12x16b, A/D 24x12b, D/A 3x12b	1.14 V	3.47 V	82K x 16

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	1	$ 17.71
		10	$ 16.27
		40	$ 15.60
		80	$ 13.74
		240	$ 13.07
		440	$ 12.23
Texas Instruments	JEDEC TRAY (5+1)	1	$ 13.86
		100	$ 12.11
		250	$ 9.33
		1000	$ 8.35

Description

General part information

TMS320 Series

C2000™ 32-bit microcontrollersare optimized for processing, sensing, and actuation to improve closed-loop performance inreal-time control applicationssuch asindustrial motor drives;solar inverters and digital power;electrical vehicles and transportation;motor control; andsensing and signal processing. The C2000 line includes thePremium performance MCUsand theEntry performance MCUs.

The TMS320F2807x microcontroller family is suited for advanced closed-loop control applications such asindustrial motor drives;solar inverters and digital power;electrical vehicles and transportation; andsensing and signal processing. To accelerate application development, theDigitalPower software development kit (SDK) for C2000 MCUsand theMotorControl software development kit (SDK) for C2000™ MCUsare available.

The F2807x is a 32-bit floating-point microcontroller based on TI’s industry-leading C28x core. This core is boosted by the trigonometric hardware accelerator which improves performance of trigonometric-based algorithms with CPU instructions such as sine, cosine, and arctangent functions, which are common in torque-loop and position calculations.

Documents

Technical documentation and resources

Maximizing power for Level 3 EV charging stations

White paper

C2000™ Safety Mechanisms (Rev. B)

Product overview

Getting Started With C2000™ Real-Time Control Microcontrollers (MCUs) (Rev. C)

TMS320F28075PTPS

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TMS320F28075PTPS

Deep-Dive with AI

Technical Specifications

TMS320 Series

Pricing

Description

TMS320 Series

Documents

Maximizing power for Level 3 EV charging stations

C2000™ Safety Mechanisms (Rev. B)

Getting Started With C2000™ Real-Time Control Microcontrollers (MCUs) (Rev. C)

C2000Ware motor control SDK getting started guide (Rev. A)

Calculator for CAN Bit Timing Parameters

Methods for Mitigating ADC Memory Cross-Talk (Rev. A)

C2000Ware DigitalPower SDK Getting Started Guide (Rev. B)

C2000™ Software Frequency Response Analyzer (SFRA) Library User’s Guide (Rev. A)

MCU로의 절연 모듈레이터 디지털 인터페이스를 사용한 클록 에지 지 연 보상 (Rev. A)

CW/CCW Support on the C2000 eQEP Module (Rev. A)

Running an Application from Internal Flash Memory on the TMS320F28xxx DSP (Rev. L)

PowerPAD™ Thermally Enhanced Package (Rev. H)

Functional Safety: A tunable FMEDA for C2000™ MCUs

Using PWM Output as a Digital-to-Analog Converter on a TMS320F280x (Rev. A)

Real-Time Control Reference Guide

Charge-Sharing Driving Circuits for C2000 ADCs (using TINA-TI simulation tool) (Rev. A)

Migrating Software From 8-Bit (Byte) Addressable CPU’s to C28x CPU (Rev. A)

Calculating FIT for a Mission Profile

Using Enhanced Pulse Width Modulator (ePWM) Module for 0-100% Duty Cycle Control

Taktflankenverzögerungskompensation mit isolierten Modulatoren Digitale Schnittstelle zu MCUs (Rev. A)

Error Detection in SRAM (Rev. A)

C2000™ MCU JTAG Connectivity Debug (Rev. C)

Industrial Functional Safety for C2000™ Real-Time Microcontrollers (Rev. E)

TMS320C28x Extended Instruction Sets Technical Reference Manual (Rev. C)

C2000 SysConfig

How fast is your 32-bit MCU?

Fast Current Loop Driverlib Library User’s Guide

CRM/ZVS PFC Implementation Based on C2000 Type-4 PWM Module

A Technical Introduction to the TMS320F28004x Microcontroller (Rev. A)

DesignDRIVE Development Kit IDDK v2.2.1 - Hardware Reference Guide

SYS/BIOS (TI-RTOS Kernel) User's Guide (Rev. V)

Designing the Next Generation of Industrial Drive and Control Systems (Rev. A)

Sensored Field Oriented Control of 3-Phase Perm Magnet Sync Motors Using F2837x (Rev. A)

Digital Control Implementation for Hybrid Hysteretic Control LLC Converter (Rev. A)

簡化汽車及工業領域的功 能安全認證

Developing a multi-channel wireless inductive charger

CRC Engines in C2000 Devices (Rev. A)

Real-Time Benchmarks Showcasing C2000™ Control MCU's Optimized Signal Chain (Rev. A)

Flash Programming Solutions for the TMS320F28xxx DSCs

Programming TMS320x28xx and 28xxx Peripherals in C/C++ (Rev. E)

C2000 CPU Memory Built-In Self-Test

Interfacing the C2000 with an AFE03x: B-FSK Example (Rev. D)

Online Stack Overflow Detection on the TMS320C28x DSP

Enhancing the Computational Performance of the C2000™ Microcontroller Family (Rev. C)

자동차 및 산업 분야의 기능적 안전성 인증 간소화

Certification for SafeTI Functional Safety Hardware Process (Rev. A)

Clock Edge Delay Compensation With Isolated Modulators Digital Interface to MCUs (Rev. A)

Calculating Useful Lifetimes of Embedded Processors (Rev. B)

Configuring Source of Multiple ePWM Trip-Zone Events

C2000™ Hardware Built-In Self-Test (Rev. A)

TMS320F2807x Real-Time Microcontrollers datasheet (Rev. K)

High-Performance, High-Precision, Smart Sensing for Industrial Drives

TMS320C28x DSP CPU and Instruction Set (Rev. F)

Implementing IEC 60730 / UL 1998 Compliance for C2000 Real-Time Microcontrollers (Rev. A)

How processing in real-time drives high-performance power systems

TI GaN FET와 C2000™ 실시간 MCU를 결합하여 전력 밀도가 높고 효율적인 전원 시스템 달성

ADC Input Circuit Evaluation for C2000 Real-Time MCUs (using PSPICE-FOR-TI)

Understanding Security Features for C2000 Real-Time Control MCUs (Rev. E)

TÜV SÜD Certificate for Functional Safety Software Development Process (Rev. C)

Updating Firmware on Security Enabled TMS320F2837xx or TMS320F2807x Devices

EEPROM Emulation for Gen 2 C2000 Real-Time MCUs (Rev. A)

Common Object File Format (COFF)

Implement three-phase interleaved LLC on C2000 Type-4 PWM

DesignDRIVE Development Kit IDDK v2.2.1 - User’s Guide

Breakthrough technologies lead the solar power industry into the future

C2000 Real-Time Control Peripheral Reference Guide (Rev. T)

Migration Between TMS320F2837x and TMS320F28P65x

Semiconductor and IC Package Thermal Metrics (Rev. D)

Serial Flash Programming of C2000 Microcontrollers (Rev. H)

Achieving Coexistence of Safety Functions for EV/HEV Using C2000 MCUs

簡化汽車及工業領域的功能安全認證