T2M-115 Series

Catalog

CONN HEADER SMD 30POS 2MM

Part	Insulation Color	Insulation Height	Insulation Height	Connector Type	Number of Positions Loaded	Row Spacing - Mating	Row Spacing - Mating	Contact Type	Current Rating (Amps)	Number of Rows	Insulation Material	Contact Finish - Mating	Number of Positions	Operating Temperature [Min]	Operating Temperature [Max]	Shrouding	Contact Finish - Post	Style	Fastening Type	Mounting Type	Pitch - Mating [x]	Pitch - Mating [x]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Shape	Termination	Contact Material	Features	Overall Contact Length	Overall Contact Length	Contact Length - Post	Contact Length - Post	Insulation Height [z]	Insulation Height [z]
Samtec Inc. T2M-115-01-L-D-SM-TR	Black	5.8 mm	0.228 in	Header	All	0.079 in	2 mm	Male Pin	3.8 A	2	Liquid Crystal Polymer (LCP)	Gold	30	-55 °C	125 °C	Shrouded - 4 Wall	Tin	Board to Board Cable	Push-Pull	Surface Mount	0.079 in	2 mm	10 çin	0.25 çm	Square	Solder	Phosphor Bronze
Samtec Inc. T2M-115-01-L-D-SM-WT	Black	5.8 mm	0.228 in	Header	All	0.079 in	2 mm	Male Pin	3.8 A	2	Liquid Crystal Polymer (LCP)	Gold	30	-55 °C	125 °C	Shrouded - 4 Wall	Tin	Board to Board Cable	Push-Pull	Surface Mount	0.079 in	2 mm	10 çin	0.25 çm	Square	Solder	Phosphor Bronze	Solder Retention
Samtec Inc. T2M-115-01-S-D-SM-DS-K	Black	5.8 mm	0.228 in	Header	All	0.079 in	2 mm	Male Pin	3.8 A	2	Liquid Crystal Polymer (LCP)	Gold	30	-55 °C	125 °C	Shrouded - 4 Wall	Tin	Board to Board Cable	Push-Pull	Surface Mount	0.079 in	2 mm	30 Áin	0.76 Ám	Square	Solder	Phosphor Bronze	Mating Flange Pick and Place
Samtec Inc. T2M-115-01-L-D-TH	Black	5.8 mm	0.228 in	Header	All	0.079 in	2 mm	Male Pin	3.8 A	2	Liquid Crystal Polymer (LCP)	Gold	30	-55 °C	125 °C	Shrouded - 4 Wall	Tin	Board to Board Cable	Push-Pull	Through Hole	0.079 in	2 mm	10 çin	0.25 çm	Square	Solder	Phosphor Bronze		0.302 in	7.67 mm	0.117 in	2.97 mm
Samtec Inc. T2M-115-01-S-D-RA	Black			Header	All	0.079 in	2 mm	Male Pin	3.8 A	2	Liquid Crystal Polymer (LCP)	Gold	30	-55 °C	125 °C	Shrouded - 4 Wall	Tin	Board to Board Cable	Push-Pull	Through Hole Right Angle	0.079 in	2 mm	30 Áin	0.76 Ám	Square	Solder	Phosphor Bronze				0.09 "	2.29 mm	7.44 mm	0.293 in
Samtec Inc. T2M-115-01-S-D-TH-DS	Black	5.8 mm	0.228 in	Header	All	0.079 in	2 mm	Male Pin	3.8 A	2	Liquid Crystal Polymer (LCP)	Gold	30	-55 °C	125 °C	Shrouded - 4 Wall	Tin	Board to Board Cable	Push-Pull	Through Hole	0.079 in	2 mm	30 Áin	0.76 Ám	Square	Solder	Phosphor Bronze	Mating Flange	0.302 in	7.67 mm	0.117 in	2.97 mm
Samtec Inc. T2M-115-01-L-D-SM-WT-K	Black	5.8 mm	0.228 in	Header	All	0.079 in	2 mm	Male Pin	3.8 A	2	Liquid Crystal Polymer (LCP)	Gold	30	-55 °C	125 °C	Shrouded - 4 Wall	Tin	Board to Board Cable	Push-Pull	Surface Mount	0.079 in	2 mm	10 çin	0.25 çm	Square	Solder	Phosphor Bronze	Pick and Place Solder Retention
Samtec Inc. T2M-115-01-S-D-SM-WT-TR	Black	5.8 mm	0.228 in	Header	All	0.079 in	2 mm	Male Pin	3.8 A	2	Liquid Crystal Polymer (LCP)	Gold	30	-55 °C	125 °C	Shrouded - 4 Wall	Tin	Board to Board Cable	Push-Pull	Surface Mount	0.079 in	2 mm	30 Áin	0.76 Ám	Square	Solder	Phosphor Bronze	Solder Retention
Samtec Inc. T2M-115-01-L-D-SM-WT-K-TR	Black	5.8 mm	0.228 in	Header	All	0.079 in	2 mm	Male Pin	3.8 A	2	Liquid Crystal Polymer (LCP)	Gold	30	-55 °C	125 °C	Shrouded - 4 Wall	Tin	Board to Board Cable	Push-Pull	Surface Mount	0.079 in	2 mm	10 çin	0.25 çm	Square	Solder	Phosphor Bronze	Pick and Place Solder Retention
Samtec Inc. T2M-115-01-L-D-RA-WT	Black			Header	All	0.079 in	2 mm	Male Pin	3.8 A	2	Liquid Crystal Polymer (LCP)	Gold	30	-55 °C	125 °C	Shrouded - 4 Wall	Tin	Board to Board Cable	Push-Pull	Through Hole Right Angle	0.079 in	2 mm	10 çin	0.25 çm	Square	Solder	Phosphor Bronze	Solder Retention			0.09 "	2.29 mm	7.44 mm	0.293 in