T2M-115-01-L-D-SM-WT

Active

Samtec Inc.

CONN HEADER SMD 30POS 2MM

T2M-115-01-L-D-SM-WT

Active

Samtec Inc.

CONN HEADER SMD 30POS 2MM

Description Specifications Series Pricing CAD Documents

Description

General part information

T2M-115 Series

Connector Header Surface Mount 30 position 0.079" (2.00mm)

Technical Specifications

Parameters and characteristics for this part

Specification	T2M-115-01-L-D-SM-WT

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 µin
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating	2.6 A, 3.8 A
Fastening Type	Push-Pull
Features	Solder Retention
Insulation Color	Black
Insulation Height	0.228 in
Insulation Material	Liquid Crystal Polymer (LCP)
Mounting Type	Surface Mount
Number of Positions	30
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.079 in
Row Spacing - Mating	0.079 in
Shrouding	Shrouded - 4 Wall
Style	Board, Board or Cable
Termination	Solder

T2M-115 Series

Part	Current Rating	Number of Positions Loaded	Termination	Connector Type	Pitch - Mating	Insulation Material	Contact Material	Fastening Type	Row Spacing - Mating	Contact Finish - Mating	Style	Contact Finish - Post	Shrouding	Contact Finish Thickness - Mating	Contact Shape	Number of Rows	Number of Positions	Operating Temperature (Max)	Operating Temperature (Min)	Contact Type	Insulation Color	Insulation Height	Mounting Type	Features	Overall Contact Length	Contact Length - Post
Samtec Inc. T2M-115-01-L-D-SM-TR	2.6 A 3.8 A	All	Solder	Header	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Push-Pull	0.079 in	Gold	Board Board or Cable	Tin	Shrouded - 4 Wall	10 µin	Square	2	30	125 °C	-55 °C	Male Pin	Black	0.228 in	Surface Mount
Samtec Inc. T2M-115-01-L-D-SM-WT	2.6 A 3.8 A	All	Solder	Header	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Push-Pull	0.079 in	Gold	Board Board or Cable	Tin	Shrouded - 4 Wall	10 µin	Square	2	30	125 °C	-55 °C	Male Pin	Black	0.228 in	Surface Mount	Solder Retention
Samtec Inc. T2M-115-01-S-D-SM-DS-K	2.6 A 3.8 A	All	Solder	Header	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Push-Pull	0.079 in	Gold	Board Board or Cable	Tin	Shrouded - 4 Wall	30 µin	Square	2	30	125 °C	-55 °C	Male Pin	Black	0.228 in	Surface Mount	Mating Flange Pick and Place
Samtec Inc. T2M-115-01-L-D-TH	2.6 A 3.8 A	All	Solder	Header	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Push-Pull	0.079 in	Gold	Board Board or Cable	Tin	Shrouded - 4 Wall	10 µin	Square	2	30	125 °C	-55 °C	Male Pin	Black	0.228 in	Through Hole		0.302 in	0.117 in
Samtec Inc. T2M-115-01-S-D-RA	2.6 A 3.8 A	All	Solder	Header	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Push-Pull	0.079 in	Gold	Board Board or Cable	Tin	Shrouded - 4 Wall	30 µin	Square	2	30	125 °C	-55 °C	Male Pin	Black	0.293 in	Right Angle Through Hole			0.09 in
Samtec Inc. T2M-115-01-S-D-TH-DS	2.6 A 3.8 A	All	Solder	Header	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Push-Pull	0.079 in	Gold	Board Board or Cable	Tin	Shrouded - 4 Wall	30 µin	Square	2	30	125 °C	-55 °C	Male Pin	Black	0.228 in	Through Hole	Mating Flange	0.302 in	0.117 in
Samtec Inc. T2M-115-01-L-D-SM-WT-K	2.6 A 3.8 A	All	Solder	Header	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Push-Pull	0.079 in	Gold	Board Board or Cable	Tin	Shrouded - 4 Wall	10 µin	Square	2	30	125 °C	-55 °C	Male Pin	Black	0.228 in	Surface Mount	Pick and Place Solder Retention
Samtec Inc. T2M-115-01-S-D-SM-WT-TR	2.6 A 3.8 A	All	Solder	Header	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Push-Pull	0.079 in	Gold	Board Board or Cable	Tin	Shrouded - 4 Wall	30 µin	Square	2	30	125 °C	-55 °C	Male Pin	Black	0.228 in	Surface Mount	Solder Retention
Samtec Inc. T2M-115-01-L-D-SM-DS-K	2.6 A 3.8 A	All	Solder	Header	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Push-Pull	0.079 in	Gold	Board Board or Cable	Tin	Shrouded - 4 Wall	10 µin	Square	2	30	125 °C	-55 °C	Male Pin	Black	0.228 in	Surface Mount	Mating Flange Pick and Place
Samtec Inc. T2M-115-01-L-D-SM-WT-K-TR	2.6 A 3.8 A	All	Solder	Header	0.079 in	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Push-Pull	0.079 in	Gold	Board Board or Cable	Tin	Shrouded - 4 Wall	10 µin	Square	2	30	125 °C	-55 °C	Male Pin	Black	0.228 in	Surface Mount	Pick and Place Solder Retention

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

T2M-115-01-L-D-SM-WT | Datasheet

T2M Series Other Related Documents 03

T2M Datasheet

Datasheet

High Reliability Tiger Eye™ Discrete Wire Header, 2.00 mm Pitch