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CONN IC DIP SOCKET 8POS TIN
| Part | Number of Positions or Pins (Grid) | Termination | Contact Finish - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Features | Pitch - Mating | Pitch - Mating | Housing Material | Contact Material - Post | Contact Material - Mating | Type | Type | Type | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 8 | Solder | Gold | -55 °C | 125 °C | Surface Mount | Open Frame | 0.1 in | 2.54 mm | Liquid Crystal Polymer (LCP) | Beryllium Copper | Beryllium Copper | 0.3 " | 7.62 mm | DIP | 2.54 mm | 0.1 in | 30 Áin | 0.76 Ám | Tin |
Samtec Inc. | 8 | Solder | -55 °C | 125 °C | Surface Mount | Open Frame | 0.1 in | 2.54 mm | Liquid Crystal Polymer (LCP) | Beryllium Copper | Beryllium Copper | 0.3 " | 7.62 mm | DIP | 2.54 mm | 0.1 in | Tin | |||
Samtec Inc. | 8 | Solder | -55 °C | 125 °C | Surface Mount | Open Frame | 0.1 in | 2.54 mm | Liquid Crystal Polymer (LCP) | Beryllium Copper | Beryllium Copper | 0.3 " | 7.62 mm | DIP | 2.54 mm | 0.1 in | Tin | |||
Samtec Inc. | 8 | Solder | -55 °C | 125 °C | Surface Mount | Open Frame | 0.1 in | 2.54 mm | Liquid Crystal Polymer (LCP) | Beryllium Copper | Beryllium Copper | 0.3 " | 7.62 mm | DIP | 2.54 mm | 0.1 in | Tin | |||
Samtec Inc. | 8 | Solder | Gold | -55 °C | 125 °C | Surface Mount | Open Frame | 0.1 in | 2.54 mm | Liquid Crystal Polymer (LCP) | Beryllium Copper | Beryllium Copper | 0.3 " | 7.62 mm | DIP | 2.54 mm | 0.1 in | 30 Áin | 0.76 Ám | Tin |