ICF-308 Series

Catalog

.100" SURFACE MOUNT SCREW MACHIN

Part	Row Spacing	Type	Pitch - Mating	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Mounting Type	Features	Contact Material - Post	Pitch - Post	Grid Columns	Grid Rows	Number of Positions or Pins (Grid)	Housing Material	Termination	Contact Finish - Post	Contact Material - Mating	Contact Finish Thickness - Mating
Samtec Inc. ICF-308-T-I	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Tin	125 °C	-55 °C	Surface Mount	Open Frame	Beryllium Copper	0.1 in	4	2	8	LCP Liquid Crystal Polymer	Solder	Tin	Beryllium Copper
Samtec Inc. ICF-308-S-O	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Gold	125 °C	-55 °C	Surface Mount	Open Frame	Beryllium Copper	0.1 in	4	2	8	LCP Liquid Crystal Polymer	Solder	Tin	Beryllium Copper	30 µin
Samtec Inc. ICF-308-T-I-TR	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Tin	125 °C	-55 °C	Surface Mount	Open Frame	Beryllium Copper	0.1 in	4	2	8	LCP Liquid Crystal Polymer	Solder	Tin	Beryllium Copper
Samtec Inc. ICF-308-T-O-TR	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Tin	125 °C	-55 °C	Surface Mount	Open Frame	Beryllium Copper	0.1 in	4	2	8	LCP Liquid Crystal Polymer	Solder	Tin	Beryllium Copper
Samtec Inc. ICF-308-TM-O-TR	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Tin	125 °C	-55 °C	Surface Mount	Open Frame	Beryllium Copper	0.1 in	4	2	8	LCP Liquid Crystal Polymer	Solder	Tin	Beryllium Copper
Samtec Inc. ICF-308-S-O-TR	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	Gold	125 °C	-55 °C	Surface Mount	Open Frame	Beryllium Copper	0.1 in	4	2	8	LCP Liquid Crystal Polymer	Solder	Tin	Beryllium Copper	30 µin