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CSD13381F4 Series

12-V, N channel NexFET™ power MOSFET, single LGA 1 mm x 0.6mm, 180 mOhm, gate ESD protection

Manufacturer: Texas Instruments
Link to Manufacturer Page: https://www.ti.com/

Catalog

12-V, N channel NexFET™ power MOSFET, single LGA 1 mm x 0.6mm, 180 mOhm, gate ESD protection

PartGate Charge (Qg) (Max) @ VgsFET TypeTechnologyMounting TypeSupplier Device PackageCurrent - Continuous Drain (Id) @ 25°COperating Temperature [Max]Operating Temperature [Min]Drive Voltage (Max Rds On, Min Rds On)Vgs (Max) [Max]Input Capacitance (Ciss) (Max) @ Vds [Max]Rds On (Max) @ Id, Vgs [Max]Drain to Source Voltage (Vdss)Package / CasePower Dissipation (Max) [Max]Vgs(th) (Max) @ Id
Texas Instruments
CSD13381F4T
1.4 nC
N-Channel
MOSFET (Metal Oxide)
Surface Mount
3-PICOSTAR
2.1 A
150 °C
-55 °C
1.8 V, 4.5 V
8 V
200 pF
180 mOhm
12 V
3-XFDFN
500 mW
1.1 V
Texas Instruments
CSD13381F4
1.4 nC
N-Channel
MOSFET (Metal Oxide)
Surface Mount
3-PICOSTAR
2.1 A
150 °C
-55 °C
1.8 V, 4.5 V
8 V
200 pF
180 mOhm
12 V
3-XFDFN
500 mW
1.1 V

Key Features

Low on-resistanceLow Qgand QgdLow threshold voltageUltra-small footprint (0402 case size)1.0 mm × 0.6 mmUltra-low profileMaximum height: 0.36-mmIntegrated ESD protection diodeRated > 4-kV HBMRated > 2-kV CDMLead and halogen freeRoHS compliantLow on-resistanceLow Qgand QgdLow threshold voltageUltra-small footprint (0402 case size)1.0 mm × 0.6 mmUltra-low profileMaximum height: 0.36-mmIntegrated ESD protection diodeRated > 4-kV HBMRated > 2-kV CDMLead and halogen freeRoHS compliant

Description

AI
This 140-mΩ, 12-V N-channel FemtoFET™ MOSFET technology is designed and optimized to minimize the footprint in many handheld and mobile applications. This technology is capable of replacing standard small signal MOSFETs while providing at least a 60% reduction in footprint size. This 140-mΩ, 12-V N-channel FemtoFET™ MOSFET technology is designed and optimized to minimize the footprint in many handheld and mobile applications. This technology is capable of replacing standard small signal MOSFETs while providing at least a 60% reduction in footprint size.