CONN PCI EXP FMALE 164POS 0.039
| Part | Material - Insulation | Read Out | Card Thickness | Card Thickness | Contact Finish Thickness | Contact Finish Thickness | Number of Positions | Contact Finish | Gender | Termination | Card Type | Features | Color | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material | Pitch [x] | Pitch [x] | Number of Rows |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Liquid Crystal Polymer (LCP) | Dual | 0.062 in | 1.57 mm | 0.76 Ám | 30 Áin | 164 | Gold | Female | Solder | PCI Express™ | Board Guide | Black | Board Edge Straddle Mount | -55 °C | 125 °C | Phosphor Bronze | 0.039 in | 1 mm | 2 |
Samtec Inc. | Polyamide (PA66) Nylon 6/6 | Dual | 0.062 in | 1.57 mm | 0.076 Ám | 3 Áin | 164 | Gold | Female | Solder Staggered | PCI Express™ | Board Guide | Black | Through Hole | -55 °C | 125 °C | Phosphor Bronze | 0.039 in | 1 mm | 2 |
Samtec Inc. | Liquid Crystal Polymer (LCP) | Dual | 0.062 in | 1.57 mm | 0.076 Ám | 3 Áin | 164 | Gold | Female | Solder | PCI Express™ | Locking Ramp | Black | Board Edge Straddle Mount | -55 °C | 125 °C | Phosphor Bronze | 0.039 in | 1 mm | 2 |
Samtec Inc. | Liquid Crystal Polymer (LCP) | Dual | 0.062 in | 1.57 mm | 0.76 Ám | 30 Áin | 164 | Gold | Female | Solder | PCI Express™ | Board Guide | Black | Board Edge Straddle Mount | -55 °C | 125 °C | Phosphor Bronze | 0.039 in | 1 mm | 2 |
Samtec Inc. | Liquid Crystal Polymer (LCP) | Dual | 0.062 in | 1.57 mm | 0.076 Ám | 3 Áin | 164 | Gold | Female | Solder Staggered | PCI Express™ | Board Guide | Black | Through Hole Right Angle | -55 °C | 125 °C | Phosphor Bronze | 0.039 in | 1 mm | 2 |
Samtec Inc. | Liquid Crystal Polymer (LCP) | Dual | 0.062 in | 1.57 mm | 0.76 Ám | 30 Áin | 164 | Gold | Female | Solder | PCI Express™ | Locking Ramp | Black | Board Edge Straddle Mount | -55 °C | 125 °C | Phosphor Bronze | 0.039 in | 1 mm | 2 |