
SEAFP-20-01-L-08-RA-WT-GP
ActiveSamtec Inc.
BOARD TO BOARD & MEZZANINE CONNECTORS .050" SEARAY HIGH-SPEED OPEN-PIN-FIELD ARRAY SOCKET, PRESS-FIT
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SEAFP-20-01-L-08-RA-WT-GP
ActiveSamtec Inc.
BOARD TO BOARD & MEZZANINE CONNECTORS .050" SEARAY HIGH-SPEED OPEN-PIN-FIELD ARRAY SOCKET, PRESS-FIT
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | SEAFP-20-01-L-08-RA-WT-GP |
|---|---|
| Connector Type | High Density Array, Female |
| Contact Finish | Gold |
| Contact Finish Thickness | 10 Áin |
| Contact Finish Thickness | 0.25 Ám |
| Features | Solder Retention, Board Guide |
| Number of Positions | 160 |
| Number of Rows | 8 |
| Pitch [x] | 0.05 in |
| Pitch [x] | 1.27 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
SEAFP-20 Series
Board to Board & Mezzanine Connectors .050" SEARAY High-Speed Open-Pin-Field Array Socket, Press-Fit