SEAFP-20-01-L-08-RA-WT

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Samtec Inc.

1.27MM 8 PLUGIN,P=1.27MM BOARD-TO-BOARD AND BACKPLANE CONNECTOR ROHS

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Active

Samtec Inc.

1.27MM 8 PLUGIN,P=1.27MM BOARD-TO-BOARD AND BACKPLANE CONNECTOR ROHS

Technical Specifications

Parameters and characteristics for this part

Board to Board & Mezzanine Connectors .050" SEARAY High-Speed Open-Pin-Field Array Socket, Press-Fit

Part	Number of Positions	Contact Finish Thickness	Contact Finish Thickness	Contact Finish	Connector Type	Height Above Board [z]	Height Above Board [z]	Pitch [x]	Pitch [x]	Number of Rows	Mated Stacking Heights	Mounting Type	Features
Samtec Inc. SEAFP-20-05.0-L-06	120	10 Áin	0.25 Ám	Gold	High Density Array Female	5 mm	0.197 in	0.05 in	1.27 mm	6	7 mm	Through Hole
Samtec Inc. SEAFP-20-05.0-S-06	120	30 Áin	0.76 Ám	Gold	High Density Array Female	5 mm	0.197 in	0.05 in	1.27 mm	6	7 mm	Through Hole
Samtec Inc. SEAFP-20-01-L-08-RA-WT	160	10 Áin	0.25 Ám	Gold	High Density Array Female			0.05 in	1.27 mm	8			Solder Retention
Samtec Inc. SEAFP-20-01-L-08-RA-WT-GP	160	10 Áin	0.25 Ám	Gold	High Density Array Female			0.05 in	1.27 mm	8			Board Guide Solder Retention

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Board to Board & Mezzanine Connectors .050" SEARAY High-Speed Open-Pin-Field Array Socket, Press-Fit

Technical documentation and resources