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SEAFP-20-05.0-S-06 - SEAFP-30-05.0-L-04

SEAFP-20-05.0-S-06

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Samtec Inc.

CONN HD ARRAY F 120POS PRESS-FIT

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SEAFP-20-05.0-S-06 - SEAFP-30-05.0-L-04

SEAFP-20-05.0-S-06

Active
Samtec Inc.

CONN HD ARRAY F 120POS PRESS-FIT

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationSEAFP-20-05.0-S-06
Connector TypeHigh Density Array, Female
Contact FinishGold
Contact Finish Thickness0.76 Ám
Contact Finish Thickness30 Áin
Height Above Board [z]5 mm
Height Above Board [z]0.197 in
Mated Stacking Heights7 mm
Mounting TypeThrough Hole
Number of Positions120
Number of Rows6
Pitch [x]0.05 in
Pitch [x]1.27 mm

SEAFP-20 Series

Board to Board & Mezzanine Connectors .050" SEARAY High-Speed Open-Pin-Field Array Socket, Press-Fit

PartNumber of PositionsContact Finish ThicknessContact Finish ThicknessContact FinishConnector TypeHeight Above Board [z]Height Above Board [z]Pitch [x]Pitch [x]Number of RowsMated Stacking HeightsMounting TypeFeatures
120
10 Áin
0.25 Ám
Gold
High Density Array
Female
5 mm
0.197 in
0.05 in
1.27 mm
6
7 mm
Through Hole
120
30 Áin
0.76 Ám
Gold
High Density Array
Female
5 mm
0.197 in
0.05 in
1.27 mm
6
7 mm
Through Hole
160
10 Áin
0.25 Ám
Gold
High Density Array
Female
0.05 in
1.27 mm
8
Solder Retention
160
10 Áin
0.25 Ám
Gold
High Density Array
Female
0.05 in
1.27 mm
8
Board Guide
Solder Retention

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 91$ 12.04

Description

General part information

SEAFP-20 Series

Board to Board & Mezzanine Connectors .050" SEARAY High-Speed Open-Pin-Field Array Socket, Press-Fit

Documents

Technical documentation and resources