HTSW-108-26-SM-D

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Samtec Inc.

CONN HEADER VERT 16POS 2.54MM

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HTSW-108-26-SM-D

Active

Samtec Inc.

CONN HEADER VERT 16POS 2.54MM

Deep-Dive with AI

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	HTSW-108-26-SM-D

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Length - Mating	5.84 mm
Contact Length - Mating [x]	0.23 in
Contact Length - Post	3.2 mm
Contact Length - Post [x]	0.126 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	Varies by Wire Gauge
Fastening Type	Push-Pull
Insulation Color	Natural
Insulation Height	0.1 in
Insulation Height	2.54 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	16
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Overall Contact Length	11.58 mm
Overall Contact Length	0.456 in
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

HTSW-130 Series

Headers & Wire Housings High Temperature PCB Header Strips, 0.100" pitch

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Part	Insulation Color	Number of Positions Loaded	Pitch - Mating	Pitch - Mating	Number of Rows	Material Flammability Rating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Contact Length - Mating [x]	Contact Length - Mating	Overall Contact Length	Overall Contact Length	Shrouding	Contact Type	Contact Length - Post	Contact Length - Post	Contact Shape	Contact Finish - Post	Fastening Type	Contact Material	Operating Temperature [Min]	Operating Temperature [Max]	Current Rating (Amps)	Insulation Height	Insulation Height	Connector Type	Insulation Material	Style	Mounting Type	Number of Positions	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Length - Post [x]	Contact Length - Post [x]	Contact Length - Mating	Overall Contact Length [x]	Overall Contact Length [x]	Number of Positions
Samtec Inc. HTSW-125-26-S-T
Samtec Inc. HTSW-125-13-L-S	Natural	All	0.1 in	2.54 mm	1	UL94 V-0	Gold	10 çin	0.25 çm	Solder	0.23 in	5.84 mm	1.23 in	31.24 mm	Unshrouded	Male Pin	22.86 mm	0.9 in	Square	Tin	Push-Pull	Phosphor Bronze	-55 °C	125 °C	Varies by Wire Gauge	0.1 in	2.54 mm	Header	Liquid Crystal Polymer (LCP)	Board to Board Cable	Through Hole
Samtec Inc. HTSW-113-08-F-D	Natural	All	0.1 in	2.54 mm	2	UL94 V-0	Gold	3 µin	0.076 µm	Solder	0.23 in	5.84 mm	0.53 in	13.46 mm	Unshrouded	Male Pin			Square	Tin	Push-Pull	Phosphor Bronze	-55 °C	125 °C	Varies by Wire Gauge	0.1 in	2.54 mm	Header	Liquid Crystal Polymer (LCP)	Board to Board Cable	Through Hole	26	2.54 mm	0.1 in	5.08 mm	0.2 in
Samtec Inc. HTSW-114-14-S-D	Natural	All	0.1 in	2.54 mm	2	UL94 V-0	Gold	30 Áin	0.76 Ám	Solder		8.13 mm	0.53 in	13.46 mm	Unshrouded	Male Pin	2.79 mm		Square	Tin	Push-Pull	Phosphor Bronze	-55 °C	125 °C	Varies by Wire Gauge	0.1 in	2.54 mm	Header	Liquid Crystal Polymer (LCP)	Board to Board Cable	Through Hole	28	2.54 mm	0.1 in		0.11 in	0.32 in
Samtec Inc. HTSW-136-26-T-D	Natural	All	0.1 in	2.54 mm	2	UL94 V-0				Solder	0.23 in	5.84 mm	0.456 in	11.58 mm	Unshrouded	Male Pin	3.2 mm		Square	Tin	Push-Pull	Phosphor Bronze	-55 °C	105 ░C	Varies by Wire Gauge	0.1 in	2.54 mm	Header	Liquid Crystal Polymer (LCP)	Board to Board Cable	Through Hole	72	2.54 mm	0.1 in		0.126 in
Samtec Inc. HTSW-114-22-G-D
Samtec Inc. HTSW-112-22-L-S	Natural	All	0.1 in	2.54 mm	1	UL94 V-0	Gold	10 çin	0.25 çm	Solder	0.23 in	5.84 mm			Unshrouded	Male Pin			Square	Tin	Push-Pull	Phosphor Bronze	-55 °C	125 °C	Varies by Wire Gauge	0.1 in	2.54 mm	Header	Liquid Crystal Polymer (LCP)	Board to Board Cable	Through Hole	12			7.62 mm	0.3 "		0.63 "	16 mm
Samtec Inc. HTSW-105-13-T-D	Natural	All	0.1 in	2.54 mm	2	UL94 V-0				Solder	0.23 in	5.84 mm	1.23 in	31.24 mm	Unshrouded	Male Pin	22.86 mm	0.9 in	Square	Tin	Push-Pull	Phosphor Bronze	-55 °C	105 ░C	Varies by Wire Gauge	0.1 in	2.54 mm	Header	Liquid Crystal Polymer (LCP)	Board to Board Cable	Through Hole	10	2.54 mm	0.1 in
Samtec Inc. HTSW-108-26-SM-D	Natural	All	0.1 in	2.54 mm	2	UL94 V-0	Gold	30 Áin	0.76 Ám	Solder	0.23 in	5.84 mm	0.456 in	11.58 mm	Unshrouded	Male Pin	3.2 mm		Square	Tin	Push-Pull	Phosphor Bronze	-55 °C	125 °C	Varies by Wire Gauge	0.1 in	2.54 mm	Header	Liquid Crystal Polymer (LCP)	Board to Board Cable	Through Hole		2.54 mm	0.1 in		0.126 in				16
Samtec Inc. HTSW-106-10-S-D-RA	Natural	All	0.1 in	2.54 mm	2	UL94 V-0	Gold	30 Áin	0.76 Ám	Solder	0.23 in	5.84 mm			Unshrouded	Male Pin	9.91 mm	0.39 in	Square	Tin	Push-Pull	Phosphor Bronze	-55 °C	125 °C	Varies by Wire Gauge	0.24 in	6.1 mm	Header	Liquid Crystal Polymer (LCP)	Board to Board Cable	Through Hole Right Angle	12	2.54 mm	0.1 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 5.89

Description

General part information

HTSW-130 Series

Headers & Wire Housings High Temperature PCB Header Strips, 0.100" pitch

Documents

Technical documentation and resources

No documents available