HTSW-135 Series

Catalog

CONN UNSHROUDED HEADER HDR 70 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

Part	Contact Finish - Mating	Pitch - Mating	Number of Positions	Insulation Material	Termination	Fastening Type	Insulation Color	Number of Rows	Contact Type	Number of Positions Loaded	Material Flammability Rating	Contact Material	Operating Temperature (Max)	Operating Temperature (Min)	Contact Shape	Current Rating	Current Rating	Contact Length - Mating	Style	Mounting Type	Insulation Height	Contact Finish Thickness - Mating	Connector Type	Contact Finish - Post	Contact Length - Post	Row Spacing - Mating	Shrouding	Overall Contact Length	Contact Finish Thickness - Post
Samtec Inc. HTSW-135-05-S-D	Gold	0.1 in	70	Liquid Crystal Polymer (LCP)	Solder	Push-Pull	Natural	2	Male Pin	All	UL94 V-0	Phosphor Bronze	125 °C	-55 °C	Square	0 A	Varies by Wire Gauge	0.105 in	Board Board or Cable	Through Hole	0.1 in	30 µin	Header	Tin	0.13 in	0.1 in	Unshrouded	0.335 in
Samtec Inc. HTSW-135-25-S-D-RA	Gold	0.1 in	70	Liquid Crystal Polymer (LCP)	Solder	Push-Pull	Natural	2	Male Pin	All	UL94 V-0	Phosphor Bronze	125 °C	-55 °C	Square	0 A	Varies by Wire Gauge	0.32 in	Board Board or Cable	Right Angle Through Hole	0.24 in	30 µin	Header	Tin	0.1 in	0.1 in	Unshrouded
Samtec Inc. HTSW-135-07-H-D	Gold	0.1 in	70	Liquid Crystal Polymer (LCP)	Solder	Push-Pull	Natural	2	Male Pin	All	UL94 V-0	Phosphor Bronze	125 °C	-55 °C	Square	0 A	Varies by Wire Gauge	0.23 in	Board Board or Cable	Through Hole	0.1 in	30 µin	Header	Gold	0.1 in	0.1 in	Unshrouded	0.43 in	3 µin
Samtec Inc. HTSW-135-09-T-D	Tin	0.1 in	70	Liquid Crystal Polymer (LCP)	Solder	Push-Pull	Natural	2	Male Pin	All	UL94 V-0	Phosphor Bronze	105 °C	-55 °C	Square	0 A	Varies by Wire Gauge	0.23 in	Board Board or Cable	Through Hole	0.1 in		Header	Tin	0.4 in	0.1 in	Unshrouded	0.73 in
Samtec Inc. HTSW-135-08-L-D	Gold	0.1 in	70	Liquid Crystal Polymer (LCP)	Solder	Push-Pull	Natural	2	Male Pin	All	UL94 V-0	Phosphor Bronze	125 °C	-55 °C	Square	0 A	Varies by Wire Gauge	0.23 in	Board Board or Cable	Through Hole	0.1 in	10 µin	Header	Tin	0.2 in	0.1 in	Unshrouded	0.53 in
Samtec Inc. HTSW-135-10-G-D	Gold	0.1 in	70	Liquid Crystal Polymer (LCP)	Solder	Push-Pull	Natural	2	Male Pin	All	UL94 V-0	Phosphor Bronze	125 °C	-55 °C	Square	0 A	Varies by Wire Gauge	0.23 in	Board Board or Cable	Through Hole	0.1 in	10 µin	Header	Gold	0.5 in	0.1 in	Unshrouded	0.83 in	3 µin
Samtec Inc. HTSW-135-07-F-D	Gold	0.1 in	70	Liquid Crystal Polymer (LCP)	Solder	Push-Pull	Natural	2	Male Pin	All	UL94 V-0	Phosphor Bronze	125 °C	-55 °C	Square	0 A	Varies by Wire Gauge	0.23 in	Board Board or Cable	Through Hole	0.1 in	3 µin	Header	Tin	0.1 in	0.1 in	Unshrouded	0.43 in
Samtec Inc. HTSW-135-14-G-D
Samtec Inc. HTSW-135-19-T-T	Tin	0.1 in	105	Liquid Crystal Polymer (LCP)	Solder	Push-Pull	Natural	3	Male Pin	All	UL94 V-0	Phosphor Bronze	105 °C	-55 °C	Square	0 A	Varies by Wire Gauge	0.82 in	Board Board or Cable	Through Hole	0.1 in		Header	Tin	0.11 in	0.1 in	Unshrouded	1.03 in
Samtec Inc. HTSW-135-19-G-D