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HTSW-136-26-T-D

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Samtec Inc.

CONN HEADER VERT 72POS 2.54MM

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HTSW-136-26-T-D

Active
Samtec Inc.

CONN HEADER VERT 72POS 2.54MM

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationHTSW-136-26-T-D
Connector TypeHeader
Contact Finish - PostTin
Contact Length - Mating5.84 mm
Contact Length - Mating [x]0.23 in
Contact Length - Post3.2 mm
Contact Length - Post [x]0.126 in
Contact MaterialPhosphor Bronze
Contact ShapeSquare
Contact TypeMale Pin
Current Rating (Amps)Varies by Wire Gauge
Fastening TypePush-Pull
Insulation ColorNatural
Insulation Height0.1 in
Insulation Height2.54 mm
Insulation MaterialLiquid Crystal Polymer (LCP)
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions72
Number of Positions LoadedAll
Number of Rows2
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 °C
Overall Contact Length11.58 mm
Overall Contact Length0.456 in
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Row Spacing - Mating [x]2.54 mm
Row Spacing - Mating [x]0.1 in
ShroudingUnshrouded
StyleBoard to Board, Cable
TerminationSolder

HTSW-130 Series

Headers & Wire Housings High Temperature PCB Header Strips, 0.100" pitch

...
PartInsulation ColorNumber of Positions LoadedPitch - MatingPitch - MatingNumber of RowsMaterial Flammability RatingContact Finish - MatingContact Finish Thickness - MatingContact Finish Thickness - MatingTerminationContact Length - Mating [x]Contact Length - MatingOverall Contact LengthOverall Contact LengthShroudingContact TypeContact Length - PostContact Length - PostContact ShapeContact Finish - PostFastening TypeContact MaterialOperating Temperature [Min]Operating Temperature [Max]Current Rating (Amps)Insulation HeightInsulation HeightConnector TypeInsulation MaterialStyleMounting TypeNumber of PositionsRow Spacing - Mating [x]Row Spacing - Mating [x]Contact Length - Post [x]Contact Length - Post [x]Contact Length - MatingOverall Contact Length [x]Overall Contact Length [x]Number of Positions
Samtec Inc.
Samtec Inc.
Natural
All
0.1 in
2.54 mm
1
UL94 V-0
Gold
10 çin
0.25 çm
Solder
0.23 in
5.84 mm
1.23 in
31.24 mm
Unshrouded
Male Pin
22.86 mm
0.9 in
Square
Tin
Push-Pull
Phosphor Bronze
-55 °C
125 °C
Varies by Wire Gauge
0.1 in
2.54 mm
Header
Liquid Crystal Polymer (LCP)
Board to Board
Cable
Through Hole
Samtec Inc.
Natural
All
0.1 in
2.54 mm
2
UL94 V-0
Gold
3 µin
0.076 µm
Solder
0.23 in
5.84 mm
0.53 in
13.46 mm
Unshrouded
Male Pin
Square
Tin
Push-Pull
Phosphor Bronze
-55 °C
125 °C
Varies by Wire Gauge
0.1 in
2.54 mm
Header
Liquid Crystal Polymer (LCP)
Board to Board
Cable
Through Hole
26
2.54 mm
0.1 in
5.08 mm
0.2 in
Samtec Inc.
Natural
All
0.1 in
2.54 mm
2
UL94 V-0
Gold
30 Áin
0.76 Ám
Solder
8.13 mm
0.53 in
13.46 mm
Unshrouded
Male Pin
2.79 mm
Square
Tin
Push-Pull
Phosphor Bronze
-55 °C
125 °C
Varies by Wire Gauge
0.1 in
2.54 mm
Header
Liquid Crystal Polymer (LCP)
Board to Board
Cable
Through Hole
28
2.54 mm
0.1 in
0.11 in
0.32 in
Samtec Inc.
Natural
All
0.1 in
2.54 mm
2
UL94 V-0
Solder
0.23 in
5.84 mm
0.456 in
11.58 mm
Unshrouded
Male Pin
3.2 mm
Square
Tin
Push-Pull
Phosphor Bronze
-55 °C
105 ░C
Varies by Wire Gauge
0.1 in
2.54 mm
Header
Liquid Crystal Polymer (LCP)
Board to Board
Cable
Through Hole
72
2.54 mm
0.1 in
0.126 in
Samtec Inc.
Samtec Inc.
Natural
All
0.1 in
2.54 mm
1
UL94 V-0
Gold
10 çin
0.25 çm
Solder
0.23 in
5.84 mm
Unshrouded
Male Pin
Square
Tin
Push-Pull
Phosphor Bronze
-55 °C
125 °C
Varies by Wire Gauge
0.1 in
2.54 mm
Header
Liquid Crystal Polymer (LCP)
Board to Board
Cable
Through Hole
12
7.62 mm
0.3 "
0.63 "
16 mm
Samtec Inc.
Natural
All
0.1 in
2.54 mm
2
UL94 V-0
Solder
0.23 in
5.84 mm
1.23 in
31.24 mm
Unshrouded
Male Pin
22.86 mm
0.9 in
Square
Tin
Push-Pull
Phosphor Bronze
-55 °C
105 ░C
Varies by Wire Gauge
0.1 in
2.54 mm
Header
Liquid Crystal Polymer (LCP)
Board to Board
Cable
Through Hole
10
2.54 mm
0.1 in
Samtec Inc.
Natural
All
0.1 in
2.54 mm
2
UL94 V-0
Gold
30 Áin
0.76 Ám
Solder
0.23 in
5.84 mm
0.456 in
11.58 mm
Unshrouded
Male Pin
3.2 mm
Square
Tin
Push-Pull
Phosphor Bronze
-55 °C
125 °C
Varies by Wire Gauge
0.1 in
2.54 mm
Header
Liquid Crystal Polymer (LCP)
Board to Board
Cable
Through Hole
2.54 mm
0.1 in
0.126 in
16
Natural
All
0.1 in
2.54 mm
2
UL94 V-0
Gold
30 Áin
0.76 Ám
Solder
0.23 in
5.84 mm
Unshrouded
Male Pin
9.91 mm
0.39 in
Square
Tin
Push-Pull
Phosphor Bronze
-55 °C
125 °C
Varies by Wire Gauge
0.24 in
6.1 mm
Header
Liquid Crystal Polymer (LCP)
Board to Board
Cable
Through Hole
Right Angle
12
2.54 mm
0.1 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 6.15

Description

General part information

HTSW-130 Series

Headers & Wire Housings High Temperature PCB Header Strips, 0.100" pitch

Documents

Technical documentation and resources

No documents available