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SS-111-T-5

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Samtec Inc.

SOCKET STRIPS

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SS-111-T-5

Active
Samtec Inc.

SOCKET STRIPS

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSS-111-T-5
Connector TypeReceptacle
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Mating0.76 Ám
Contact Length - Post0.173 in
Contact Length - Post4.4 mm
Contact MaterialBeryllium Copper
Contact ShapeCircular
Contact TypeFemale Socket
Fastening TypePush-Pull
Insulation ColorBlack
Insulation Height0.1 in
Insulation Height2.54 mm
Insulation MaterialPolybutylene Terephthalate (PBT), Glass Filled
Mounting TypeThrough Hole
Number of Positions11
Number of Positions LoadedAll
Number of Rows1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
TerminationSolder

SS-111 Series

PartTerminationNumber of RowsInsulation HeightInsulation HeightMounting TypeContact TypeConnector TypeNumber of PositionsFastening TypeInsulation ColorPitch - MatingPitch - MatingContact Finish - PostContact Finish Thickness - MatingContact Finish Thickness - MatingContact ShapeOperating Temperature [Min]Operating Temperature [Max]Number of Positions LoadedContact Finish - MatingContact Length - Post [x]Contact Length - Post [x]Insulation MaterialContact MaterialContact Length - PostContact Length - PostContact Finish Thickness - PostContact Finish Thickness - Post
Samtec Inc.
Solder
1
0.1 in
2.54 mm
Through Hole
Female Socket
Receptacle
11
Push-Pull
Black
0.1 in
2.54 mm
Tin
30 Áin
0.76 Ám
Circular
-55 °C
125 °C
All
Gold
3.18 mm
0.125 in
Polybutylene Terephthalate (PBT)
Glass Filled
Beryllium Copper
Samtec Inc.
Solder
1
0.1 in
2.54 mm
Through Hole
Female Socket
Receptacle
11
Push-Pull
Black
0.1 in
2.54 mm
Tin
30 Áin
0.76 Ám
Circular
-55 °C
125 °C
All
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
Beryllium Copper
0.18 in
4.57 mm
Samtec Inc.
Solder
1
0.1 in
2.54 mm
Through Hole
Female Socket
Receptacle
11
Push-Pull
Black
0.1 in
2.54 mm
Tin
30 Áin
0.76 Ám
Circular
-55 °C
125 °C
All
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
Beryllium Copper
Samtec Inc.
Solder
1
0.1 in
2.54 mm
Through Hole
Female Socket
Receptacle
11
Push-Pull
Black
0.1 in
2.54 mm
Tin
10 çin
0.25 çm
Circular
-55 °C
125 °C
All
Gold
3.18 mm
0.125 in
Polybutylene Terephthalate (PBT)
Glass Filled
Beryllium Copper
Samtec Inc.
Solder
1
0.1 in
2.54 mm
Through Hole
Female Socket
Receptacle
11
Push-Pull
Black
0.1 in
2.54 mm
Tin
-55 °C
125 °C
All
0.51 in
12.95 mm
Samtec Inc.
Solder
1
0.1 in
2.54 mm
Through Hole
Female Socket
Receptacle
11
Push-Pull
Black
0.1 in
2.54 mm
Tin
30 Áin
0.76 Ám
Circular
-55 °C
125 °C
All
Gold
3.18 mm
0.125 in
Polybutylene Terephthalate (PBT)
Glass Filled
Beryllium Copper
Samtec Inc.
Solder
1
0.1 in
2.54 mm
Through Hole
Female Socket
Receptacle
11
Push-Pull
Black
0.1 in
2.54 mm
Tin
30 Áin
0.76 Ám
Circular
-55 °C
125 °C
All
Gold
Polybutylene Terephthalate (PBT)
Glass Filled
Beryllium Copper
0.173 in
4.4 mm
Samtec Inc.
Solder
1
0.1 in
2.54 mm
Through Hole
Female Socket
Receptacle
11
Push-Pull
Black
0.1 in
2.54 mm
Gold
30 Áin
0.76 Ám
Circular
-55 °C
125 °C
All
Gold
6.6 mm
0.26 in
Polybutylene Terephthalate (PBT)
Glass Filled
Beryllium Copper
10 çin
0.25 çm
Samtec Inc.
Solder
1
0.1 in
2.54 mm
Through Hole
Female Socket
Receptacle
11
Push-Pull
Black
0.1 in
2.54 mm
Tin
10 çin
0.25 çm
Circular
-55 °C
125 °C
All
Gold
3.18 mm
0.125 in
Polybutylene Terephthalate (PBT)
Glass Filled
Beryllium Copper
Samtec Inc.
Solder
1
0.1 in
2.54 mm
Through Hole
Female Socket
Receptacle
11
Push-Pull
Black
0.1 in
2.54 mm
Gold
30 Áin
0.76 Ám
Circular
-55 °C
125 °C
All
Gold
3.18 mm
0.125 in
Polybutylene Terephthalate (PBT)
Glass Filled
Beryllium Copper
10 çin
0.25 çm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 1$ 4.18

Description

General part information

SS-111 Series

11 Position Receptacle Connector 0.100" (2.54mm) Through Hole Gold

Documents

Technical documentation and resources

No documents available