CONN RCPT .100" 11POS GOLD T/H
| Part | Termination | Number of Rows | Insulation Height | Insulation Height | Mounting Type | Contact Type | Connector Type | Number of Positions | Fastening Type | Insulation Color | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Shape | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions Loaded | Contact Finish - Mating | Contact Length - Post [x] | Contact Length - Post [x] | Insulation Material | Contact Material | Contact Length - Post | Contact Length - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Solder | 1 | 0.1 in | 2.54 mm | Through Hole | Female Socket | Receptacle | 11 | Push-Pull | Black | 0.1 in | 2.54 mm | Tin | 30 Áin | 0.76 Ám | Circular | -55 °C | 125 °C | All | Gold | 3.18 mm | 0.125 in | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | ||||
Samtec Inc. | Solder | 1 | 0.1 in | 2.54 mm | Through Hole | Female Socket | Receptacle | 11 | Push-Pull | Black | 0.1 in | 2.54 mm | Tin | 30 Áin | 0.76 Ám | Circular | -55 °C | 125 °C | All | Gold | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | 0.18 in | 4.57 mm | ||||
Samtec Inc. | Solder | 1 | 0.1 in | 2.54 mm | Through Hole | Female Socket | Receptacle | 11 | Push-Pull | Black | 0.1 in | 2.54 mm | Tin | 30 Áin | 0.76 Ám | Circular | -55 °C | 125 °C | All | Gold | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | ||||||
Samtec Inc. | Solder | 1 | 0.1 in | 2.54 mm | Through Hole | Female Socket | Receptacle | 11 | Push-Pull | Black | 0.1 in | 2.54 mm | Tin | 10 çin | 0.25 çm | Circular | -55 °C | 125 °C | All | Gold | 3.18 mm | 0.125 in | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | ||||
Samtec Inc. | Solder | 1 | 0.1 in | 2.54 mm | Through Hole | Female Socket | Receptacle | 11 | Push-Pull | Black | 0.1 in | 2.54 mm | Tin | -55 °C | 125 °C | All | 0.51 in | 12.95 mm | ||||||||||
Samtec Inc. | Solder | 1 | 0.1 in | 2.54 mm | Through Hole | Female Socket | Receptacle | 11 | Push-Pull | Black | 0.1 in | 2.54 mm | Tin | 30 Áin | 0.76 Ám | Circular | -55 °C | 125 °C | All | Gold | 3.18 mm | 0.125 in | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | ||||
Samtec Inc. | Solder | 1 | 0.1 in | 2.54 mm | Through Hole | Female Socket | Receptacle | 11 | Push-Pull | Black | 0.1 in | 2.54 mm | Tin | 30 Áin | 0.76 Ám | Circular | -55 °C | 125 °C | All | Gold | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | 0.173 in | 4.4 mm | ||||
Samtec Inc. | Solder | 1 | 0.1 in | 2.54 mm | Through Hole | Female Socket | Receptacle | 11 | Push-Pull | Black | 0.1 in | 2.54 mm | Gold | 30 Áin | 0.76 Ám | Circular | -55 °C | 125 °C | All | Gold | 6.6 mm | 0.26 in | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | 10 çin | 0.25 çm | ||
Samtec Inc. | Solder | 1 | 0.1 in | 2.54 mm | Through Hole | Female Socket | Receptacle | 11 | Push-Pull | Black | 0.1 in | 2.54 mm | Tin | 10 çin | 0.25 çm | Circular | -55 °C | 125 °C | All | Gold | 3.18 mm | 0.125 in | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | ||||
Samtec Inc. | Solder | 1 | 0.1 in | 2.54 mm | Through Hole | Female Socket | Receptacle | 11 | Push-Pull | Black | 0.1 in | 2.54 mm | Gold | 30 Áin | 0.76 Ám | Circular | -55 °C | 125 °C | All | Gold | 3.18 mm | 0.125 in | Polybutylene Terephthalate (PBT) Glass Filled | Beryllium Copper | 10 çin | 0.25 çm |