HTSW-140-08-L-D

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Samtec Inc.

CONN UNSHROUDED HEADER HDR 80 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

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HTSW-140-08-L-D

Active

Samtec Inc.

CONN UNSHROUDED HEADER HDR 80 POS 2.54MM SOLDER ST TOP ENTRY THRU-HOLE BULK

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	HTSW-140-08-L-D

Connector Type	Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Length - Mating	5.84 mm
Contact Length - Mating [x]	0.23 in
Contact Length - Post [x]	5.08 mm
Contact Length - Post [x]	0.2 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	Varies by Wire Gauge
Fastening Type	Push-Pull
Insulation Color	Natural
Insulation Height	0.1 in
Insulation Height	2.54 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions	80
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Overall Contact Length	13.46 mm
Overall Contact Length	0.53 in
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

HTSW-140 Series

Part	Insulation Height	Insulation Height	Contact Shape	Pitch - Mating	Pitch - Mating	Contact Length - Mating [x]	Contact Length - Mating	Insulation Color	Fastening Type	Overall Contact Length	Overall Contact Length	Style	Number of Positions	Contact Finish - Post	Contact Length - Post	Contact Length - Post	Contact Type	Mounting Type	Connector Type	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Rows	Material Flammability Rating	Insulation Material	Contact Finish - Mating	Contact Material	Number of Positions Loaded	Operating Temperature [Min]	Operating Temperature [Max]	Shrouding	Termination	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Mating	Contact Length - Post [x]	Contact Length - Post [x]	Contact Length - Mating [x]
Samtec Inc. HTSW-140-07-SS-S-LL	0.1 in	2.54 mm	Square	0.1 in	2.54 mm	0.23 in	5.84 mm	Natural	Push-Pull	0.43 in	10.92 mm	Board to Board Cable	40	Tin	2.54 mm	0.1 in	Male Pin	Through Hole	Header	Varies by Wire Gauge	30 Áin	0.76 Ám	1	UL94 V-0	Liquid Crystal Polymer (LCP)	Gold	Phosphor Bronze	All	-55 °C	125 °C	Unshrouded	Kinked Pin Solder
Samtec Inc. HTSW-140-05-F-T	0.1 in	2.54 mm	Square	0.1 in	2.54 mm			Natural	Push-Pull	0.335 in	8.51 mm	Board to Board Cable	120	Tin	3.3 mm	0.13 in	Male Pin	Through Hole	Header	Varies by Wire Gauge	3 µin	0.076 µm	3	UL94 V-0	Liquid Crystal Polymer (LCP)	Gold	Phosphor Bronze	All	-55 °C	125 °C	Unshrouded	Solder	2.54 mm	0.1 in
Samtec Inc. HTSW-140-14-G-D	0.1 in	2.54 mm	Square	0.1 in	2.54 mm		8.13 mm	Natural	Push-Pull	0.53 in	13.46 mm	Board to Board Cable	80	Gold	2.79 mm		Male Pin	Through Hole	Header	Varies by Wire Gauge	10 çin	0.25 çm	2	UL94 V-0	Liquid Crystal Polymer (LCP)	Gold	Phosphor Bronze	All	-55 °C	125 °C	Unshrouded	Solder	2.54 mm	0.1 in	3 µin	0.076 µm	0.32 in	0.11 in
Samtec Inc. HTSW-140-08-L-T
Samtec Inc. HTSW-140-08-L-D	0.1 in	2.54 mm	Square	0.1 in	2.54 mm	0.23 in	5.84 mm	Natural	Push-Pull	0.53 in	13.46 mm	Board to Board Cable	80	Tin			Male Pin	Through Hole	Header	Varies by Wire Gauge	10 çin	0.25 çm	2	UL94 V-0	Liquid Crystal Polymer (LCP)	Gold	Phosphor Bronze	All	-55 °C	125 °C	Unshrouded	Solder	2.54 mm	0.1 in				0.2 in	5.08 mm
Samtec Inc. HTSW-140-21-L-D	0.1 in	2.54 mm	Square	0.1 in	2.54 mm		30.99 mm	Natural	Push-Pull			Board to Board Cable	80	Tin	2.79 mm		Male Pin	Through Hole	Header	Varies by Wire Gauge	10 çin	0.25 çm	2	UL94 V-0	Liquid Crystal Polymer (LCP)	Gold	Phosphor Bronze	All	-55 °C	125 °C	Unshrouded	Solder	2.54 mm	0.1 in			1.22 "	0.11 in
Samtec Inc. HTSW-140-15-G-S	0.1 in	2.54 mm	Square	0.1 in	2.54 mm	0.52 in		Natural	Push-Pull	0.73 in	18.54 mm	Board to Board Cable	40	Gold	2.79 mm		Male Pin	Through Hole	Header	Varies by Wire Gauge	10 çin	0.25 çm	1	UL94 V-0	Liquid Crystal Polymer (LCP)	Gold	Phosphor Bronze	All	-55 °C	125 °C	Unshrouded	Solder			3 µin	0.076 µm		0.11 in		13.21 mm
Samtec Inc. HTSW-140-14-F-D-LL	0.1 in	2.54 mm	Square	0.1 in	2.54 mm		8.13 mm	Natural	Push-Pull	0.53 in	13.46 mm	Board to Board Cable	80	Tin	2.79 mm		Male Pin	Through Hole	Header	Varies by Wire Gauge	3 µin	0.076 µm	2	UL94 V-0	Liquid Crystal Polymer (LCP)	Gold	Phosphor Bronze	All	-55 °C	125 °C	Unshrouded	Kinked Pin Solder	2.54 mm	0.1 in			0.32 in	0.11 in
Samtec Inc. HTSW-140-07-F-D	0.1 in	2.54 mm	Square	0.1 in	2.54 mm	0.23 in	5.84 mm	Natural	Push-Pull	0.43 in	10.92 mm	Board to Board Cable	80	Tin	2.54 mm	0.1 in	Male Pin	Through Hole	Header	Varies by Wire Gauge	3 µin	0.076 µm	2	UL94 V-0	Liquid Crystal Polymer (LCP)	Gold	Phosphor Bronze	All	-55 °C	125 °C	Unshrouded	Solder	2.54 mm	0.1 in
Samtec Inc. HTSW-140-12-G-S-RA	0.122 in	3.1 mm	Square	0.1 in	2.54 mm	0.23 in	5.84 mm	Natural	Push-Pull			Board to Board Cable	40	Gold			Male Pin	Through Hole Right Angle	Header	Varies by Wire Gauge	10 çin	0.25 çm	1	UL94 V-0	Liquid Crystal Polymer (LCP)	Gold	Phosphor Bronze	All	-55 °C	125 °C	Unshrouded	Solder			3 µin	0.076 µm		0.59 in	14.99 mm

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Arrow	N/A	1	$ 5.01
		25	$ 4.83
		50	$ 4.61
Digikey	Bulk	1	$ 7.02

Description

General part information

HTSW-140 Series

Connector Header Through Hole 80 position 0.100" (2.54mm)

Documents

Technical documentation and resources

No documents available