HTSW-140 Series
Manufacturer: Samtec Inc.
CONN HEADER VERT 40POS 2.54MM
| Part | Contact Shape | Contact Finish - Post | Number of Positions Loaded | Fastening Type | Contact Length - Post | Number of Rows | Current Rating | Current Rating | Pitch - Mating | Material Flammability Rating | Insulation Material | Insulation Height | Connector Type | Number of Positions | Contact Type | Mounting Type | Contact Material | Contact Finish - Mating | Shrouding | Contact Length - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Overall Contact Length | Style | Contact Finish Thickness - Mating | Insulation Color | Termination | Row Spacing - Mating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Square | Tin | All | Push-Pull | 0.1 in | 1 | 0 A | Varies by Wire Gauge | 0.1 in | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | Header | 40 | Male Pin | Through Hole | Phosphor Bronze | Gold | Unshrouded | 0.23 in | 125 °C | -55 °C | 0.43 in | Board Board or Cable | 30 µin | Natural | Kinked Pin Solder | ||
Samtec Inc. | Square | Tin | All | Push-Pull | 0.13 in | 3 | 0 A | Varies by Wire Gauge | 0.1 in | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | Header | 120 | Male Pin | Through Hole | Phosphor Bronze | Gold | Unshrouded | 0.105 in | 125 °C | -55 °C | 0.335 in | Board Board or Cable | 3 µin | Natural | Solder | 0.1 in | |
Samtec Inc. | Square | Gold | All | Push-Pull | 0.11 in | 2 | 0 A | Varies by Wire Gauge | 0.1 in | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | Header | 80 | Male Pin | Through Hole | Phosphor Bronze | Gold | Unshrouded | 0.32 in | 125 °C | -55 °C | 0.53 in | Board Board or Cable | 10 µin | Natural | Solder | 0.1 in | 3 µin |
Samtec Inc. | Square | Tin | All | Push-Pull | 0.2 in | 3 | 0 A | Varies by Wire Gauge | 0.1 in | Liquid Crystal Polymer (LCP) | Header | 120 | Male Pin | Through Hole | Phosphor Bronze | Gold | Unshrouded | 0.23 in | 0.53 in | Board Board or Cable | 10 µin | Natural | Solder | 0.1 in | |||||
Samtec Inc. | Square | Tin | All | Push-Pull | 0.095 in | 1 | 0 A | Varies by Wire Gauge | 0.1 in | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | Header | 40 | Male Pin | Through Hole | Phosphor Bronze | Gold | Unshrouded | 0.105 in | 125 °C | -55 °C | 0.3 in | Board Board or Cable | 3 µin | Natural | Solder | ||
Samtec Inc. | Square | Tin | Push-Pull | 2 | 0.1 in | UL94 V-0 | Liquid Crystal Polymer (LCP) | Header | 80 | Male Pin | Right Angle Through Hole | Phosphor Bronze | Gold | Unshrouded | 125 °C | -55 °C | Board Board or Cable | Natural | Solder | ||||||||||
Samtec Inc. | Square | Tin | All | Push-Pull | 0.2 in | 2 | 0 A | Varies by Wire Gauge | 0.1 in | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | Header | 80 | Male Pin | Through Hole | Phosphor Bronze | Gold | Unshrouded | 0.23 in | 125 °C | -55 °C | 0.53 in | Board Board or Cable | 10 µin | Natural | Solder | 0.1 in | |
Samtec Inc. | Square | Tin | All | Push-Pull | 0.11 in | 2 | 0 A | Varies by Wire Gauge | 0.1 in | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | Header | 80 | Male Pin | Through Hole | Phosphor Bronze | Gold | Unshrouded | 1.22 in | 125 °C | -55 °C | 1.43 in | Board Board or Cable | 10 µin | Natural | Solder | 0.1 in | |
Samtec Inc. | Square | Gold | All | Push-Pull | 0.11 in | 1 | 0 A | Varies by Wire Gauge | 0.1 in | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | Header | 40 | Male Pin | Through Hole | Phosphor Bronze | Gold | Unshrouded | 0.52 in | 125 °C | -55 °C | 0.73 in | Board Board or Cable | 10 µin | Natural | Solder | 3 µin | |
Samtec Inc. | Square | Tin | All | Push-Pull | 0.11 in | 2 | 0 A | Varies by Wire Gauge | 0.1 in | UL94 V-0 | Liquid Crystal Polymer (LCP) | 0.1 in | Header | 80 | Male Pin | Through Hole | Phosphor Bronze | Gold | Unshrouded | 0.32 in | 125 °C | -55 °C | 0.53 in | Board Board or Cable | 3 µin | Natural | Kinked Pin Solder | 0.1 in |