ICA-316-SST

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Samtec Inc.

16P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+125℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Active

Samtec Inc.

16P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+125℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Technical Specifications

Parameters and characteristics for this part

Specification	ICA-316-SST

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Contact Resistance	10 mOhm
Current Rating (Amps)	1 A
Features	Open Frame
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	16
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	0.3 "
Type	7.62 mm
Type	DIP

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Number of Positions or Pins (Grid)	Contact Finish - Mating	Material Flammability Rating	Termination Post Length	Termination Post Length	Features	Contact Material - Mating	Current Rating (Amps)	Type	Type	Type	Contact Resistance	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Mounting Type
Samtec Inc. ICA-316-SGG	30 Áin	0.76 Ám	0.1 in	2.54 mm	-55 °C	125 °C	16	Gold	UL94 V-0	3.18 mm	0.125 in	Open Frame	Beryllium Copper	1 A	0.3 "	7.62 mm	DIP	10 mOhm	Gold	10 çin	0.25 çm	Solder	Brass	2.54 mm	0.1 in	Through Hole
Samtec Inc. ICA-316-SST	10 çin	0.25 çm	0.1 in	2.54 mm	-55 °C	125 °C	16	Gold	UL94 V-0	3.18 mm	0.125 in	Open Frame	Beryllium Copper	1 A	0.3 "	7.62 mm	DIP	10 mOhm	Tin			Solder	Brass	2.54 mm	0.1 in	Through Hole
Samtec Inc. ICA-316-ZAGT	30 Áin	0.76 Ám	0.1 in	2.54 mm	-55 °C	125 °C	16	Gold	UL94 V-0	3.18 mm	0.125 in	Open Frame	Beryllium Copper	1 A	0.3 "	7.62 mm	DIP	10 mOhm	Tin	10 çin	0.25 çm	Solder	Brass	2.54 mm	0.1 in	Through Hole

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

16 (2 x 8) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources

No documents available