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CONN IC DIP SOCKET 16POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions or Pins (Grid) | Contact Finish - Mating | Material Flammability Rating | Termination Post Length | Termination Post Length | Features | Contact Material - Mating | Current Rating (Amps) | Type | Type | Type | Contact Resistance | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Contact Material - Post [custom] | Pitch - Post | Pitch - Post | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | -55 °C | 125 °C | 16 | Gold | UL94 V-0 | 3.18 mm | 0.125 in | Open Frame | Beryllium Copper | 1 A | 0.3 " | 7.62 mm | DIP | 10 mOhm | Gold | 10 çin | 0.25 çm | Solder | Brass | 2.54 mm | 0.1 in | Through Hole |
Samtec Inc. | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | -55 °C | 125 °C | 16 | Gold | UL94 V-0 | 3.18 mm | 0.125 in | Open Frame | Beryllium Copper | 1 A | 0.3 " | 7.62 mm | DIP | 10 mOhm | Tin | Solder | Brass | 2.54 mm | 0.1 in | Through Hole | ||
Samtec Inc. | 30 Áin | 0.76 Ám | 0.1 in | 2.54 mm | -55 °C | 125 °C | 16 | Gold | UL94 V-0 | 3.18 mm | 0.125 in | Open Frame | Beryllium Copper | 1 A | 0.3 " | 7.62 mm | DIP | 10 mOhm | Tin | 10 çin | 0.25 çm | Solder | Brass | 2.54 mm | 0.1 in | Through Hole |