40-526-10

Active

Aries Electronics

40P DIP TIN BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Search across all available documentation for this part.

Active

Aries Electronics

40P DIP TIN BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Technical Specifications

Parameters and characteristics for this part

Specification	40-526-10

Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Number of Positions or Pins (Grid) [custom]	20
Number of Positions or Pins (Grid) [custom]	2
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.105 in
Termination Post Length	2.67 mm
Type	ZIF (ZIP), DIP

Part	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Termination Post Length	Termination Post Length	Contact Material - Post	Housing Material	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Termination	Pitch - Mating	Pitch - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Type	Material Flammability Rating	Mounting Type	Features	Contact Finish - Mating
Aries Electronics 40-526-10	2.54 mm	0.1 in	40	20	2	10 çin	0.25 çm	Beryllium Copper	0.105 in	2.67 mm	Beryllium Copper	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	10 çin	0.25 çm	3 A	Solder	0.1 in	2.54 mm	105 ░C	-55 °C	DIP ZIF (ZIP)	UL94 V-0	Through Hole	Closed Frame
Aries Electronics 40-526-11	2.54 mm	0.1 in	40	20	2	10 çin	0.25 çm	Beryllium Copper	0.105 in	2.67 mm	Beryllium Copper	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	10 çin	0.25 çm	3 A	Solder	0.1 in	2.54 mm	125 °C	-55 °C	DIP ZIF (ZIP)	UL94 V-0	Through Hole	Closed Frame	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

40 (2 x 20) Pos DIP, ZIF (ZIP) Socket Tin Through Hole

Technical documentation and resources