40-526-11

Active

Aries Electronics

CONN IC DIP SOCKET ZIF 40POS GLD

Search across all available documentation for this part.

Active

Aries Electronics

CONN IC DIP SOCKET ZIF 40POS GLD

Technical Specifications

Parameters and characteristics for this part

Specification	40-526-11

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	40
Number of Positions or Pins (Grid) [custom]	20
Number of Positions or Pins (Grid) [custom]	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.105 in
Termination Post Length	2.67 mm
Type	ZIF (ZIP), DIP

Part	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Termination Post Length	Termination Post Length	Contact Material - Post	Housing Material	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Termination	Pitch - Mating	Pitch - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Type	Material Flammability Rating	Mounting Type	Features	Contact Finish - Mating
Aries Electronics 40-526-10	2.54 mm	0.1 in	40	20	2	10 çin	0.25 çm	Beryllium Copper	0.105 in	2.67 mm	Beryllium Copper	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	10 çin	0.25 çm	3 A	Solder	0.1 in	2.54 mm	105 ░C	-55 °C	DIP ZIF (ZIP)	UL94 V-0	Through Hole	Closed Frame
Aries Electronics 40-526-11	2.54 mm	0.1 in	40	20	2	10 çin	0.25 çm	Beryllium Copper	0.105 in	2.67 mm	Beryllium Copper	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	10 çin	0.25 çm	3 A	Solder	0.1 in	2.54 mm	125 °C	-55 °C	DIP ZIF (ZIP)	UL94 V-0	Through Hole	Closed Frame	Gold

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	22	$ 19.80

General part information

40 (2 x 20) Pos DIP, ZIF (ZIP) Socket Gold Through Hole

Technical documentation and resources