40-526 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 40POS TIN
| Part | Contact Material - Post | Contact Finish Thickness - Mating | Contact Material - Mating | Pitch - Post | Contact Finish - Mating | Grid Columns | Number of Positions or Pins (Grid) | Grid Rows | Contact Finish - Post | Operating Temperature (Min) | Operating Temperature (Max) | Type | Features | Termination | Housing Material | Pitch - Mating | Mounting Type | Contact Finish Thickness - Post | Current Rating | Material Flammability Rating | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | Beryllium Copper | 10 µin | Beryllium Copper | 0.1 in | Tin | 20 | 40 | 2 | Tin | -55 °C | 105 °C | DIP ZIF (ZIP) | Closed Frame | Solder | Glass Filled Nylon 4/6 PA46 Polyamide | 0.1 in | Through Hole | 10 µin | 3 A | UL94 V-0 | 0.105 in |
 Aries Electronics | Beryllium Copper | 10 µin | Beryllium Copper | 0.1 in | Gold | 20 | 40 | 2 | Gold | -55 °C | 125 °C | DIP ZIF (ZIP) | Closed Frame | Solder | Glass Filled Nylon 4/6 PA46 Polyamide | 0.1 in | Through Hole | 10 µin | 3 A | UL94 V-0 | 0.105 in |