40-526 Series

Catalog

40P DIP TIN BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Part	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Termination Post Length	Termination Post Length	Contact Material - Post	Housing Material	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Termination	Pitch - Mating	Pitch - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Type	Material Flammability Rating	Mounting Type	Features	Contact Finish - Mating
Aries Electronics 40-526-10	2.54 mm	0.1 in	40	20	2	10 çin	0.25 çm	Beryllium Copper	0.105 in	2.67 mm	Beryllium Copper	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	10 çin	0.25 çm	3 A	Solder	0.1 in	2.54 mm	105 ░C	-55 °C	DIP ZIF (ZIP)	UL94 V-0	Through Hole	Closed Frame
Aries Electronics 40-526-11	2.54 mm	0.1 in	40	20	2	10 çin	0.25 çm	Beryllium Copper	0.105 in	2.67 mm	Beryllium Copper	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	10 çin	0.25 çm	3 A	Solder	0.1 in	2.54 mm	125 °C	-55 °C	DIP ZIF (ZIP)	UL94 V-0	Through Hole	Closed Frame	Gold