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228-1277-39-0602J - 228-1277-39-0602J

228-1277-39-0602J

Active
3M

IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER

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DocumentsDatasheetTechnical Data Sheet EN
228-1277-39-0602J - 228-1277-39-0602J

228-1277-39-0602J

Active
3M

IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 2.54 MM, 15.24 MM, BERYLLIUM COPPER

Deep-Dive with AI

DocumentsDatasheetTechnical Data Sheet EN

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification228-1277-39-0602J228 Series
Contact Finish - MatingGoldGold
Contact Finish - PostGoldGold
Contact Finish Thickness - Mating30 Áin30 Áin
Contact Finish Thickness - Mating0.76 Ám0.76 Ám
Contact Finish Thickness - Post30 µin30 µin
Contact Finish Thickness - Post0.76 µm0.76 µm
Contact Material - MatingBeryllium CopperBeryllium Copper
Contact Material - PostBeryllium CopperBeryllium Copper
Contact Resistance-15 - 25 mOhm
Convert From (Adapter End)15.24 mm15.24 mm
Convert From (Adapter End)DIPDIP
Convert From (Adapter End)0.6 in0.6 in
Convert To (Adapter End)0.6 in0.4 - 0.6 in
Convert To (Adapter End)DIPDIP
Convert To (Adapter End)15.24 mm10.16 - 15.24 mm
Current Rating (Amps)1 A1 A
Features-Closed Frame
Housing MaterialPolysulfone (PSU), Glass FilledPolysulfone (PSU), Glass Filled, Polyethersulfone (PES), Polyethersulfone (PES), Glass Filled
Material Flammability RatingUL94 V-0UL94 V-0
Mounting TypeThrough HoleThrough Hole, Connector
Number of Pins2828
Number of Positions or Pins (Grid)-4
Number of Positions or Pins (Grid)-28
Number of Positions or Pins (Grid)-7
Operating Temperature [Max]125 °C125 - 150 °C
Operating Temperature [Min]-55 °C-55 °C
Pitch - Mating0.1 in0.02 - 0.1 in
Pitch - Mating2.54 mm0.5 - 2.54 mm
Pitch - Post2.54 mm1.78 - 2.54 mm
Pitch - Post0.1 in0.07 - 0.1 in
TerminationSolderSolder, Press-Fit
Termination Post Length-2.78 - 3.56 mm
Termination Post Length-0.11 - 0.14 in
Type-QFN, DIP, ZIF (ZIP), SOIC, DIP, ZIP, ZIF
Type-10.16 - 15.24 mm
Type-0.6 "
Type-0.4 in

228 Series

SOCKET ADAPTER 28DIP TO 28DIP

PartTerminationTermination Post LengthTermination Post LengthMounting TypeCurrent Rating (Amps)Contact Finish Thickness - MatingContact Finish Thickness - MatingContact Material - PostConvert To (Adapter End)Convert To (Adapter End)Convert To (Adapter End)Contact Finish Thickness - PostContact Finish Thickness - PostContact Material - MatingMaterial Flammability RatingNumber of PinsPitch - MatingPitch - MatingContact Finish - MatingPitch - PostPitch - PostHousing MaterialContact Finish - PostConvert From (Adapter End)Convert From (Adapter End)Convert From (Adapter End)Operating Temperature [Min]Operating Temperature [Max]Contact ResistanceNumber of Positions or Pins (Grid) [custom]Number of Positions or Pins (Grid)Number of Positions or Pins (Grid) [custom]TypeTypeTypeFeaturesType
3M
228-1277-09-0602J
Solder
3.3 mm
0.13 in
Through Hole
1 A
30 Áin
0.76 Ám
Beryllium Copper
0.6 in
DIP
15.24 mm
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
28
0.1 in
2.54 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
15.24 mm
DIP
0.6 in
-55 °C
125 °C
3M
228-5204-01
Solder
3 mm
0.118 in
Through Hole
Beryllium Copper
Beryllium Copper
0.02 in
0.5 mm
Gold
Polyethersulfone (PES)
Gold
25 mOhm
4
28
7
QFN
3M
228-1277-39-0602J
Solder
Through Hole
1 A
30 Áin
0.76 Ám
Beryllium Copper
0.6 in
DIP
15.24 mm
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
28
0.1 in
2.54 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
15.24 mm
DIP
0.6 in
-55 °C
125 °C
3M
228-4817-09-0602J
Solder
3.3 mm
0.13 in
Through Hole
1 A
30 Áin
0.76 Ám
Beryllium Copper
0.4 in
DIP
10.16 mm
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
28
0.1 in
2.54 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
-55 °C
125 °C
3M
228-1371-00-0602J
Press-Fit
2.78 mm
0.11 in
Connector
1 A
30 Áin
0.76 Ám
Beryllium Copper
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
0.1 in
2.54 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
-55 °C
125 °C
15 mOhm
28
DIP, ZIF (ZIP)
15.24 mm
0.6 "
Closed Frame
3M
228-1277-19-0602J
Solder
Through Hole
1 A
30 Áin
0.76 Ám
Beryllium Copper
0.6 in
DIP
15.24 mm
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
28
0.1 in
2.54 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
15.24 mm
DIP
0.6 in
-55 °C
125 °C
3M
228-7474-55-1902
Solder
3.56 mm
0.14 in
Through Hole
1 A
Beryllium Copper
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
Gold
Polyethersulfone (PES), Glass Filled
Gold
-55 °C
150 °C
28
SOIC
Closed Frame
3M
228-4817-00-0602J
Press-Fit
2.78 mm
0.11 in
Connector
1 A
30 Áin
0.76 Ám
Beryllium Copper
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
0.1 in
2.54 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
-55 °C
125 °C
15 mOhm
28
DIP, ZIF, ZIP
10.16 mm
Closed Frame
0.4 in
3M
228-1290-00-0602J
Press-Fit
2.78 mm
0.11 in
Connector
1 A
30 Áin
0.76 Ám
Beryllium Copper
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
0.07 in
1.78 mm
Gold
2.54 mm
0.1 in
Polysulfone (PSU), Glass Filled
Gold
-55 °C
125 °C
15 mOhm
28
DIP, ZIF (ZIP)
15.24 mm
0.6 "
Closed Frame
3M
228-1290-09-0602J
Solder
3.3 mm
0.13 in
Through Hole
1 A
30 Áin
0.76 Ám
Beryllium Copper
0.4 in
DIP
10.16 mm
30 µin
0.76 µm
Beryllium Copper
UL94 V-0
28
0.07 in
1.78 mm
Gold
1.78 mm
0.07 in
Polysulfone (PSU), Glass Filled
Gold
-55 °C
125 °C

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBox 30$ 31.70
NewarkN/A 1$ 32.09
5$ 30.17
10$ 28.38

Description

General part information

228 Series

IC Socket Adapter DIP, 0.6" (15.24mm) Row Spacing To DIP, 0.6" (15.24mm) Row Spacing Through Hole

Documents

Technical documentation and resources

Datasheet

Datasheet

Technical Data Sheet EN

Datasheet