228-7474-55-1902

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CONN SOCKET SOIC 28POS GOLD

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228-7474-55-1902

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CONN SOCKET SOIC 28POS GOLD

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Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 53.16
		10	$ 48.78
		30	$ 46.91
		50	$ 45.34
		100	$ 42.84

Description

General part information

228 Series

28 (2 x 14) Pos SOIC Socket Gold Through Hole

Documents

Technical documentation and resources

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	228-7474-55-1902	228 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	-	30 Áin
Contact Finish Thickness - Mating	-	0.76 Ám
Contact Finish Thickness - Post	30 µin	30 µin
Contact Finish Thickness - Post	0.76 µm	0.76 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	-	15 - 25 mOhm
Convert From (Adapter End)	-	15.24 mm
Convert From (Adapter End)	-	DIP
Convert From (Adapter End)	-	0.6 in
Convert To (Adapter End)	-	0.4 - 0.6 in
Convert To (Adapter End)	-	DIP
Convert To (Adapter End)	-	10.16 - 15.24 mm
Current Rating (Amps)	1 A	1 A
Features	Closed Frame	Closed Frame
Housing Material	Polyethersulfone (PES), Glass Filled	Polysulfone (PSU), Glass Filled, Polyethersulfone (PES), Polyethersulfone (PES), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole, Connector
Number of Pins	-	28
Number of Positions or Pins (Grid)	28	28
Number of Positions or Pins (Grid)	-	4
Number of Positions or Pins (Grid)	-	7
Operating Temperature [Max]	150 °C	125 - 150 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	-	0.02 - 0.1 in
Pitch - Mating	-	0.5 - 2.54 mm
Pitch - Post	-	1.78 - 2.54 mm
Pitch - Post	-	0.07 - 0.1 in
Termination	Solder	Solder, Press-Fit
Termination Post Length	3.56 mm	2.78 - 3.56 mm
Termination Post Length	0.14 in	0.11 - 0.14 in
Type	SOIC	QFN, DIP, ZIF (ZIP), SOIC, DIP, ZIP, ZIF
Type	-	10.16 - 15.24 mm
Type	-	0.6 "
Type	-	0.4 in

228 Series

SOCKET ADAPTER 28DIP TO 28DIP

Part	Termination	Termination Post Length	Termination Post Length	Mounting Type	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Material Flammability Rating	Number of Pins	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Pitch - Post	Pitch - Post	Housing Material	Contact Finish - Post	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Operating Temperature [Min]	Operating Temperature [Max]	Contact Resistance	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Type	Type	Type	Features	Type
3M 228-1277-09-0602J	Solder	3.3 mm	0.13 in	Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.6 in	DIP	15.24 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold	15.24 mm	DIP	0.6 in	-55 °C	125 °C
3M 228-5204-01	Solder	3 mm	0.118 in	Through Hole				Beryllium Copper						Beryllium Copper			0.02 in	0.5 mm	Gold			Polyethersulfone (PES)	Gold						25 mOhm	4	28	7	QFN
3M 228-1277-39-0602J	Solder			Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.6 in	DIP	15.24 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold	15.24 mm	DIP	0.6 in	-55 °C	125 °C
3M 228-4817-09-0602J	Solder	3.3 mm	0.13 in	Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.4 in	DIP	10.16 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C
3M 228-1371-00-0602J	Press-Fit	2.78 mm	0.11 in	Connector	1 A	30 Áin	0.76 Ám	Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0		0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C	15 mOhm		28		DIP, ZIF (ZIP)	15.24 mm	0.6 "	Closed Frame
3M 228-1277-19-0602J	Solder			Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.6 in	DIP	15.24 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold	15.24 mm	DIP	0.6 in	-55 °C	125 °C
3M 228-7474-55-1902	Solder	3.56 mm	0.14 in	Through Hole	1 A			Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0				Gold			Polyethersulfone (PES), Glass Filled	Gold				-55 °C	150 °C			28		SOIC			Closed Frame
3M 228-4817-00-0602J	Press-Fit	2.78 mm	0.11 in	Connector	1 A	30 Áin	0.76 Ám	Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0		0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C	15 mOhm		28		DIP, ZIF, ZIP	10.16 mm		Closed Frame	0.4 in
3M 228-1290-00-0602J	Press-Fit	2.78 mm	0.11 in	Connector	1 A	30 Áin	0.76 Ám	Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0		0.07 in	1.78 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C	15 mOhm		28		DIP, ZIF (ZIP)	15.24 mm	0.6 "	Closed Frame
3M 228-1290-09-0602J	Solder	3.3 mm	0.13 in	Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.4 in	DIP	10.16 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.07 in	1.78 mm	Gold	1.78 mm	0.07 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C