228-1290-09-0602J

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IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 1.78 MM, 10.16 MM, BERYLLIUM COPPER

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DocumentsTechnical Data Sheet EN Datasheet

228-1290-09-0602J

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IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 1.78 MM, 10.16 MM, BERYLLIUM COPPER

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DocumentsTechnical Data Sheet EN Datasheet

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Description

General part information

228 Series

IC Socket Adapter DIP, 0.4" (10.16mm) Row Spacing To DIP, 0.4" (10.16mm) Row Spacing Through Hole

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	228-1290-09-0602J	228 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	30 Áin	30 Áin
Contact Finish Thickness - Mating	0.76 Ám	0.76 Ám
Contact Finish Thickness - Post	30 µin	30 µin
Contact Finish Thickness - Post	0.76 µm	0.76 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	-	15 - 25 mOhm
Convert From (Adapter End)	-	15.24 mm
Convert From (Adapter End)	-	DIP
Convert From (Adapter End)	-	0.6 in
Convert To (Adapter End)	0.4 in	0.4 - 0.6 in
Convert To (Adapter End)	DIP	DIP
Convert To (Adapter End)	10.16 mm	10.16 - 15.24 mm
Current Rating (Amps)	1 A	1 A
Features	-	Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled	Polysulfone (PSU), Glass Filled, Polyethersulfone (PES), Polyethersulfone (PES), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Through Hole	Through Hole, Connector
Number of Pins	28	28
Number of Positions or Pins (Grid)	-	4
Number of Positions or Pins (Grid)	-	28
Number of Positions or Pins (Grid)	-	7
Operating Temperature [Max]	125 °C	125 - 150 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.07 in	0.02 - 0.1 in
Pitch - Mating	1.78 mm	0.5 - 2.54 mm
Pitch - Post	0.07 in	0.07 - 0.1 in
Pitch - Post	1.78 mm	1.78 - 2.54 mm
Termination	Solder	Solder, Press-Fit
Termination Post Length	3.3 mm	2.78 - 3.56 mm
Termination Post Length	0.13 in	0.11 - 0.14 in
Type	-	QFN, DIP, ZIF (ZIP), SOIC, DIP, ZIP, ZIF
Type	-	10.16 - 15.24 mm
Type	-	0.6 "
Type	-	0.4 in

228 Series

SOCKET ADAPTER 28DIP TO 28DIP

Part	Termination	Termination Post Length	Termination Post Length	Mounting Type	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Material Flammability Rating	Number of Pins	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Pitch - Post	Pitch - Post	Housing Material	Contact Finish - Post	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Operating Temperature [Min]	Operating Temperature [Max]	Contact Resistance	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Type	Type	Type	Features	Type
3M 228-1277-09-0602J	Solder	3.3 mm	0.13 in	Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.6 in	DIP	15.24 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold	15.24 mm	DIP	0.6 in	-55 °C	125 °C
3M 228-5204-01	Solder	3 mm	0.118 in	Through Hole				Beryllium Copper						Beryllium Copper			0.02 in	0.5 mm	Gold			Polyethersulfone (PES)	Gold						25 mOhm	4	28	7	QFN
3M 228-1277-39-0602J	Solder			Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.6 in	DIP	15.24 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold	15.24 mm	DIP	0.6 in	-55 °C	125 °C
3M 228-4817-09-0602J	Solder	3.3 mm	0.13 in	Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.4 in	DIP	10.16 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C
3M 228-1371-00-0602J	Press-Fit	2.78 mm	0.11 in	Connector	1 A	30 Áin	0.76 Ám	Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0		0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C	15 mOhm		28		DIP, ZIF (ZIP)	15.24 mm	0.6 "	Closed Frame
3M 228-1277-19-0602J	Solder			Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.6 in	DIP	15.24 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold	15.24 mm	DIP	0.6 in	-55 °C	125 °C
3M 228-7474-55-1902	Solder	3.56 mm	0.14 in	Through Hole	1 A			Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0				Gold			Polyethersulfone (PES), Glass Filled	Gold				-55 °C	150 °C			28		SOIC			Closed Frame
3M 228-4817-00-0602J	Press-Fit	2.78 mm	0.11 in	Connector	1 A	30 Áin	0.76 Ám	Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0		0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C	15 mOhm		28		DIP, ZIF, ZIP	10.16 mm		Closed Frame	0.4 in
3M 228-1290-00-0602J	Press-Fit	2.78 mm	0.11 in	Connector	1 A	30 Áin	0.76 Ám	Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0		0.07 in	1.78 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C	15 mOhm		28		DIP, ZIF (ZIP)	15.24 mm	0.6 "	Closed Frame
3M 228-1290-09-0602J	Solder	3.3 mm	0.13 in	Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.4 in	DIP	10.16 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.07 in	1.78 mm	Gold	1.78 mm	0.07 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C