228-1371-00-0602J

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IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 2.54 MM, 228 SERIES, 11.43 MM, BERYLLIUM COPPER

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228-1371-00-0602J

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IC & COMPONENT SOCKET, 28 CONTACTS, DIP SOCKET, 2.54 MM, 228 SERIES, 11.43 MM, BERYLLIUM COPPER

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DocumentsDatasheet Technical Data Sheet EN

Specifications Pricing Series Description Documents

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	1	$ 39.90
		10	$ 34.94
		30	$ 33.43
		40	$ 32.35
		80	$ 31.27
		230	$ 29.55
Newark	N/A	10	$ 56.36
		25	$ 54.26
		50	$ 50.97

Description

General part information

228 Series

The 228-1371-00-0602J is a 28-way Textool™ Universal DIP Socket with gold-plated beryllium copper contacts, 2.54mm lead spacing. This socket is glass filled polysulfone insulated, lever actuated zero insertion force mechanism, extra wide contact zone allows insertion of DIP's with distance between rows from 7.62mm through 15.24mm.

Documents

Technical documentation and resources

Datasheet

Technical Data Sheet EN

Datasheet

Specification	228-1371-00-0602J	228 Series

Contact Finish - Mating	Gold	Gold
Contact Finish - Post	Gold	Gold
Contact Finish Thickness - Mating	30 Áin	30 Áin
Contact Finish Thickness - Mating	0.76 Ám	0.76 Ám
Contact Finish Thickness - Post	30 µin	30 µin
Contact Finish Thickness - Post	0.76 µm	0.76 µm
Contact Material - Mating	Beryllium Copper	Beryllium Copper
Contact Material - Post	Beryllium Copper	Beryllium Copper
Contact Resistance	15 mOhm	15 - 25 mOhm
Convert From (Adapter End)	-	15.24 mm
Convert From (Adapter End)	-	DIP
Convert From (Adapter End)	-	0.6 in
Convert To (Adapter End)	-	0.4 - 0.6 in
Convert To (Adapter End)	-	DIP
Convert To (Adapter End)	-	10.16 - 15.24 mm
Current Rating (Amps)	1 A	1 A
Features	Closed Frame	Closed Frame
Housing Material	Polysulfone (PSU), Glass Filled	Polysulfone (PSU), Glass Filled, Polyethersulfone (PES), Polyethersulfone (PES), Glass Filled
Material Flammability Rating	UL94 V-0	UL94 V-0
Mounting Type	Connector	Through Hole, Connector
Number of Pins	-	28
Number of Positions or Pins (Grid)	28	28
Number of Positions or Pins (Grid)	-	4
Number of Positions or Pins (Grid)	-	7
Operating Temperature [Max]	125 °C	125 - 150 °C
Operating Temperature [Min]	-55 °C	-55 °C
Pitch - Mating	0.1 in	0.02 - 0.1 in
Pitch - Mating	2.54 mm	0.5 - 2.54 mm
Pitch - Post	2.54 mm	1.78 - 2.54 mm
Pitch - Post	0.1 in	0.07 - 0.1 in
Termination	Press-Fit	Solder, Press-Fit
Termination Post Length	0.11 in	0.11 - 0.14 in
Termination Post Length	2.78 mm	2.78 - 3.56 mm
Type	15.24 mm	10.16 - 15.24 mm
Type	DIP, ZIF (ZIP)	QFN, DIP, ZIF (ZIP), SOIC, DIP, ZIP, ZIF
Type	0.6 "	0.6 "
Type	-	0.4 in

Part

Termination

Termination Post Length

Mounting Type

Current Rating (Amps)

Contact Finish Thickness - Mating

Contact Material - Post

Convert To (Adapter End)

Contact Finish Thickness - Post

Contact Material - Mating

Material Flammability Rating

Number of Pins

Pitch - Mating

Contact Finish - Mating

Pitch - Post

Housing Material

Contact Finish - Post

Convert From (Adapter End)

Operating Temperature [Min]

Operating Temperature [Max]

Contact Resistance

Number of Positions or Pins (Grid) [custom]

Number of Positions or Pins (Grid)

Number of Positions or Pins (Grid) [custom]

Type

Features

Type

228-1277-09-0602J

Solder

3.3 mm

0.13 in

Through Hole

1 A

30 Áin

0.76 Ám

Beryllium Copper

0.6 in

DIP

15.24 mm

30 µin

0.76 µm

Beryllium Copper

UL94 V-0

0.1 in

2.54 mm

Gold

2.54 mm

0.1 in

Polysulfone (PSU), Glass Filled

Gold

15.24 mm

DIP

0.6 in

-55 °C

125 °C

228-5204-01

Solder

3 mm

0.118 in

Through Hole

Beryllium Copper

0.02 in

0.5 mm

Gold

Polyethersulfone (PES)

Gold

25 mOhm

QFN

228-1277-39-0602J

Solder

Through Hole

1 A

30 Áin

0.76 Ám

Beryllium Copper

0.6 in

DIP

15.24 mm

30 µin

0.76 µm

Beryllium Copper

UL94 V-0

0.1 in

2.54 mm

Gold

2.54 mm

0.1 in

Polysulfone (PSU), Glass Filled

Gold

15.24 mm

DIP

0.6 in

-55 °C

125 °C

228-4817-09-0602J

Solder

3.3 mm

0.13 in

Through Hole

1 A

30 Áin

0.76 Ám

Beryllium Copper

0.4 in

DIP

10.16 mm

30 µin

0.76 µm

Beryllium Copper

UL94 V-0

0.1 in

2.54 mm

Gold

2.54 mm

0.1 in

Polysulfone (PSU), Glass Filled

Gold

-55 °C

125 °C

228-1371-00-0602J

Press-Fit

2.78 mm

0.11 in

Connector

1 A

30 Áin

0.76 Ám

Beryllium Copper

30 µin

0.76 µm

Beryllium Copper

UL94 V-0

0.1 in

2.54 mm

Gold

2.54 mm

0.1 in

Polysulfone (PSU), Glass Filled

Gold

-55 °C

125 °C

15 mOhm

DIP, ZIF (ZIP)

15.24 mm

0.6 "

Closed Frame

228-1277-19-0602J

Solder

Through Hole

1 A

30 Áin

0.76 Ám

Beryllium Copper

0.6 in

DIP

15.24 mm

30 µin

0.76 µm

Beryllium Copper

UL94 V-0

0.1 in

2.54 mm

Gold

2.54 mm

0.1 in

Polysulfone (PSU), Glass Filled

Gold

15.24 mm

DIP

0.6 in

-55 °C

125 °C

228-7474-55-1902

Solder

3.56 mm

0.14 in

Through Hole

1 A

Beryllium Copper

30 µin

0.76 µm

Beryllium Copper

UL94 V-0

Gold

Polyethersulfone (PES), Glass Filled

Gold

-55 °C

150 °C

SOIC

Closed Frame

228-4817-00-0602J

Press-Fit

2.78 mm

0.11 in

Connector

1 A

30 Áin

0.76 Ám

Beryllium Copper

30 µin

0.76 µm

Beryllium Copper

UL94 V-0

0.1 in

2.54 mm

Gold

2.54 mm

0.1 in

Polysulfone (PSU), Glass Filled

Gold

-55 °C

125 °C

15 mOhm

DIP, ZIF, ZIP

10.16 mm

Closed Frame

0.4 in

228-1290-00-0602J

Press-Fit

2.78 mm

0.11 in

Connector

1 A

30 Áin

0.76 Ám

Beryllium Copper

30 µin

0.76 µm

Beryllium Copper

UL94 V-0

0.07 in

1.78 mm

Gold

2.54 mm

0.1 in

Polysulfone (PSU), Glass Filled

Gold

-55 °C

125 °C

15 mOhm

DIP, ZIF (ZIP)

15.24 mm

0.6 "

Closed Frame

228-1290-09-0602J

Solder

3.3 mm

0.13 in

Through Hole

1 A

30 Áin

0.76 Ám

Beryllium Copper

0.4 in

DIP

10.16 mm

30 µin

0.76 µm

Beryllium Copper

UL94 V-0

0.07 in

1.78 mm

Gold

1.78 mm

0.07 in

Polysulfone (PSU), Glass Filled

Gold

-55 °C

125 °C

Part	Termination	Termination Post Length	Termination Post Length	Mounting Type	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Material Flammability Rating	Number of Pins	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Pitch - Post	Pitch - Post	Housing Material	Contact Finish - Post	Convert From (Adapter End)	Convert From (Adapter End)	Convert From (Adapter End)	Operating Temperature [Min]	Operating Temperature [Max]	Contact Resistance	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Type	Type	Type	Features	Type
3M 228-1277-09-0602J	Solder	3.3 mm	0.13 in	Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.6 in	DIP	15.24 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold	15.24 mm	DIP	0.6 in	-55 °C	125 °C
3M 228-5204-01	Solder	3 mm	0.118 in	Through Hole				Beryllium Copper						Beryllium Copper			0.02 in	0.5 mm	Gold			Polyethersulfone (PES)	Gold						25 mOhm	4	28	7	QFN
3M 228-1277-39-0602J	Solder			Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.6 in	DIP	15.24 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold	15.24 mm	DIP	0.6 in	-55 °C	125 °C
3M 228-4817-09-0602J	Solder	3.3 mm	0.13 in	Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.4 in	DIP	10.16 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C
3M 228-1371-00-0602J	Press-Fit	2.78 mm	0.11 in	Connector	1 A	30 Áin	0.76 Ám	Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0		0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C	15 mOhm		28		DIP, ZIF (ZIP)	15.24 mm	0.6 "	Closed Frame
3M 228-1277-19-0602J	Solder			Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.6 in	DIP	15.24 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold	15.24 mm	DIP	0.6 in	-55 °C	125 °C
3M 228-7474-55-1902	Solder	3.56 mm	0.14 in	Through Hole	1 A			Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0				Gold			Polyethersulfone (PES), Glass Filled	Gold				-55 °C	150 °C			28		SOIC			Closed Frame
3M 228-4817-00-0602J	Press-Fit	2.78 mm	0.11 in	Connector	1 A	30 Áin	0.76 Ám	Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0		0.1 in	2.54 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C	15 mOhm		28		DIP, ZIF, ZIP	10.16 mm		Closed Frame	0.4 in
3M 228-1290-00-0602J	Press-Fit	2.78 mm	0.11 in	Connector	1 A	30 Áin	0.76 Ám	Beryllium Copper				30 µin	0.76 µm	Beryllium Copper	UL94 V-0		0.07 in	1.78 mm	Gold	2.54 mm	0.1 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C	15 mOhm		28		DIP, ZIF (ZIP)	15.24 mm	0.6 "	Closed Frame
3M 228-1290-09-0602J	Solder	3.3 mm	0.13 in	Through Hole	1 A	30 Áin	0.76 Ám	Beryllium Copper	0.4 in	DIP	10.16 mm	30 µin	0.76 µm	Beryllium Copper	UL94 V-0	28	0.07 in	1.78 mm	Gold	1.78 mm	0.07 in	Polysulfone (PSU), Glass Filled	Gold				-55 °C	125 °C

228-1371-00-0602J

Deep-Dive with AI

228-1371-00-0602J

Deep-Dive with AI

Pricing

Description

228 Series

Documents

Datasheet

Technical Data Sheet EN

Technical Specifications

228 Series