16-3513-11H

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Aries Electronics

16P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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16-3513-11H

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Aries Electronics

16P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	16-3513-11H

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	10 çin
Contact Finish Thickness - Post	0.25 çm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Closed Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	16
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	0.3 "
Type	7.62 mm
Type	DIP

16-3513 Series

Part	Material Flammability Rating	Contact Material - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Housing Material	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Type	Type	Type	Contact Material - Post [custom]	Mounting Type	Termination Post Length	Termination Post Length	Contact Finish - Post	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Current Rating (Amps)
Aries Electronics 16-3513-11H	UL94 V-0	Beryllium Copper	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	10 çin	0.25 çm	Solder	0.3 "	7.62 mm	DIP	Brass	Through Hole	3.18 mm	0.125 in	Gold	2.54 mm	0.1 in	10 çin	0.25 çm	Gold	0.1 in	2.54 mm	16	3 A
Aries Electronics 16-3513-11	UL94 V-0	Beryllium Copper	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	10 çin	0.25 çm	Solder	0.3 "	7.62 mm	DIP	Brass	Through Hole	3.18 mm	0.125 in	Gold	2.54 mm	0.1 in	10 çin	0.25 çm	Gold	0.1 in	2.54 mm	16	3 A
Aries Electronics 16-3513-10	UL94 V-0	Beryllium Copper	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	10 çin	0.25 çm	Solder	0.3 "	7.62 mm	DIP	Brass	Through Hole	3.18 mm	0.125 in	Tin	2.54 mm	0.1 in	200 µin	5.08 µm	Gold	0.1 in	2.54 mm	16	3 A
Aries Electronics 16-3513-00	UL94 V-0	Beryllium Copper	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	10 çin	0.25 çm	Solder	0.3 "	7.62 mm	DIP	Brass	Through Hole	3.18 mm	0.125 in	Tin	2.54 mm	0.1 in	200 µin	5.08 µm	Gold	0.1 in	2.54 mm	16	3 A
Aries Electronics 16-3513-10H	UL94 V-0	Beryllium Copper	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	10 çin	0.25 çm	Solder	0.3 "	7.62 mm	DIP	Brass	Through Hole	3.18 mm	0.125 in	Tin	2.54 mm	0.1 in	200 µin	5.08 µm	Gold	0.1 in	2.54 mm	16	3 A

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	140	$ 4.00
LCSC	Piece	1	$ 7.97
		192	$ 3.18
		504	$ 3.07
		1008	$ 3.02

Description

General part information

16-3513 Series

16 (2 x 8) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources