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16-3513-00

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Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

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16-3513-00

Active
Aries Electronics

CONN IC DIP SOCKET 16POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification16-3513-00
Contact Finish - MatingGold
Contact Finish - PostTin
Contact Finish Thickness - Mating10 çin
Contact Finish Thickness - Mating0.25 çm
Contact Finish Thickness - Post200 µin
Contact Finish Thickness - Post5.08 µm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesClosed Frame
Housing MaterialGlass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)16
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 °C
Pitch - Mating0.1 in
Pitch - Mating2.54 mm
Pitch - Post2.54 mm
Pitch - Post0.1 in
TerminationSolder
Termination Post Length3.18 mm
Termination Post Length0.125 in
Type0.3 "
Type7.62 mm
TypeDIP

16-3513 Series

PartMaterial Flammability RatingContact Material - MatingOperating Temperature [Max]Operating Temperature [Min]Housing MaterialFeaturesContact Finish Thickness - MatingContact Finish Thickness - MatingTerminationTypeTypeTypeContact Material - Post [custom]Mounting TypeTermination Post LengthTermination Post LengthContact Finish - PostPitch - PostPitch - PostContact Finish Thickness - PostContact Finish Thickness - PostContact Finish - MatingPitch - MatingPitch - MatingNumber of Positions or Pins (Grid)Current Rating (Amps)
Aries Electronics
UL94 V-0
Beryllium Copper
105 ░C
-55 °C
Glass Filled
Nylon 4/6
Polyamide (PA46)
Closed Frame
10 çin
0.25 çm
Solder
0.3 "
7.62 mm
DIP
Brass
Through Hole
3.18 mm
0.125 in
Gold
2.54 mm
0.1 in
10 çin
0.25 çm
Gold
0.1 in
2.54 mm
16
3 A
Aries Electronics
UL94 V-0
Beryllium Copper
105 ░C
-55 °C
Glass Filled
Nylon 4/6
Polyamide (PA46)
Closed Frame
10 çin
0.25 çm
Solder
0.3 "
7.62 mm
DIP
Brass
Through Hole
3.18 mm
0.125 in
Gold
2.54 mm
0.1 in
10 çin
0.25 çm
Gold
0.1 in
2.54 mm
16
3 A
Aries Electronics
UL94 V-0
Beryllium Copper
105 ░C
-55 °C
Glass Filled
Nylon 4/6
Polyamide (PA46)
Closed Frame
10 çin
0.25 çm
Solder
0.3 "
7.62 mm
DIP
Brass
Through Hole
3.18 mm
0.125 in
Tin
2.54 mm
0.1 in
200 µin
5.08 µm
Gold
0.1 in
2.54 mm
16
3 A
Aries Electronics
UL94 V-0
Beryllium Copper
105 ░C
-55 °C
Glass Filled
Nylon 4/6
Polyamide (PA46)
Closed Frame
10 çin
0.25 çm
Solder
0.3 "
7.62 mm
DIP
Brass
Through Hole
3.18 mm
0.125 in
Tin
2.54 mm
0.1 in
200 µin
5.08 µm
Gold
0.1 in
2.54 mm
16
3 A
Aries Electronics
UL94 V-0
Beryllium Copper
105 ░C
-55 °C
Glass Filled
Nylon 4/6
Polyamide (PA46)
Closed Frame
10 çin
0.25 çm
Solder
0.3 "
7.62 mm
DIP
Brass
Through Hole
3.18 mm
0.125 in
Tin
2.54 mm
0.1 in
200 µin
5.08 µm
Gold
0.1 in
2.54 mm
16
3 A

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 175$ 3.03

Description

General part information

16-3513 Series

16 (2 x 8) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources