16-3513 Series

Catalog

16P DIP GOLD BERYLLIUM COPPER ALLOY -55℃~+105℃ 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

Part	Material Flammability Rating	Contact Material - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Housing Material	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Type	Type	Type	Contact Material - Post [custom]	Mounting Type	Termination Post Length	Termination Post Length	Contact Finish - Post	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid)	Current Rating (Amps)
Aries Electronics 16-3513-11H	UL94 V-0	Beryllium Copper	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	10 çin	0.25 çm	Solder	0.3 "	7.62 mm	DIP	Brass	Through Hole	3.18 mm	0.125 in	Gold	2.54 mm	0.1 in	10 çin	0.25 çm	Gold	0.1 in	2.54 mm	16	3 A
Aries Electronics 16-3513-11	UL94 V-0	Beryllium Copper	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	10 çin	0.25 çm	Solder	0.3 "	7.62 mm	DIP	Brass	Through Hole	3.18 mm	0.125 in	Gold	2.54 mm	0.1 in	10 çin	0.25 çm	Gold	0.1 in	2.54 mm	16	3 A
Aries Electronics 16-3513-10	UL94 V-0	Beryllium Copper	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	10 çin	0.25 çm	Solder	0.3 "	7.62 mm	DIP	Brass	Through Hole	3.18 mm	0.125 in	Tin	2.54 mm	0.1 in	200 µin	5.08 µm	Gold	0.1 in	2.54 mm	16	3 A
Aries Electronics 16-3513-00	UL94 V-0	Beryllium Copper	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	10 çin	0.25 çm	Solder	0.3 "	7.62 mm	DIP	Brass	Through Hole	3.18 mm	0.125 in	Tin	2.54 mm	0.1 in	200 µin	5.08 µm	Gold	0.1 in	2.54 mm	16	3 A
Aries Electronics 16-3513-10H	UL94 V-0	Beryllium Copper	105 ░C	-55 °C	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	10 çin	0.25 çm	Solder	0.3 "	7.62 mm	DIP	Brass	Through Hole	3.18 mm	0.125 in	Tin	2.54 mm	0.1 in	200 µin	5.08 µm	Gold	0.1 in	2.54 mm	16	3 A