IDD03SG60CXTMA2
ActiveSILICON CARBIDE SCHOTTKY DIODE, THINQ GEN III SERIES, SINGLE, 600 V, 3 A, 3.2 NC, TO-252 (DPAK)
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IDD03SG60CXTMA2
ActiveSILICON CARBIDE SCHOTTKY DIODE, THINQ GEN III SERIES, SINGLE, 600 V, 3 A, 3.2 NC, TO-252 (DPAK)
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Technical Specifications
Parameters and characteristics for this part
| Specification | IDD03SG60CXTMA2 |
|---|---|
| Capacitance @ Vr, F | 60 pF |
| Current - Average Rectified (Io) | 3 A |
| Current - Reverse Leakage @ Vr | 15 µA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction [Max] | 175 ░C |
| Operating Temperature - Junction [Min] | -55 C |
| Package / Case | SC-63, DPAK (2 Leads + Tab), TO-252-3 |
| Reverse Recovery Time (trr) | 0 ns |
| Speed | No Recovery Time |
| Supplier Device Package | PG-TO252-3 |
| Technology | SiC (Silicon Carbide) Schottky |
| Voltage - DC Reverse (Vr) (Max) [Max] | 600 V |
| Voltage - Forward (Vf) (Max) @ If | 3 A, 2.3 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 1.82 | |
| 10 | $ 1.51 | |||
| 100 | $ 1.20 | |||
| 500 | $ 1.02 | |||
| 1000 | $ 0.86 | |||
| Digi-Reel® | 1 | $ 1.82 | ||
| 10 | $ 1.51 | |||
| 100 | $ 1.20 | |||
| 500 | $ 1.02 | |||
| 1000 | $ 0.86 | |||
| Tape & Reel (TR) | 2500 | $ 0.82 | ||
| 5000 | $ 0.79 | |||
| 12500 | $ 0.76 | |||
| Newark | Each (Supplied on Cut Tape) | 1 | $ 2.03 | |
| 10 | $ 1.38 | |||
| 25 | $ 1.27 | |||
| 50 | $ 1.15 | |||
| 100 | $ 1.04 | |||
| 250 | $ 1.03 | |||
| 500 | $ 0.85 | |||
| 1000 | $ 0.78 | |||
Description
General part information
IDD03SG60 Series
Infineon's CoolSiC™ Schottky diodes 600V G3 feature the industry’s lowest device capacitance for any given current rating, which further enhances overall system efficiency, especially at higher switching frequencies and under low load conditions. The generation 3 is based on the same technology platform as generation 2 with the introduction, at package level, of the so called diffusion soldering.
Documents
Technical documentation and resources