20-3518-10

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Aries Electronics

CONN IC DIP SOCKET 20POS GOLD

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20-3518-10

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Aries Electronics

CONN IC DIP SOCKET 20POS GOLD

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	20-3518-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 çin
Contact Finish Thickness - Mating	0.25 çm
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Current Rating (Amps)	3 A
Features	Open Frame
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	20
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	3.18 mm
Termination Post Length	0.125 in
Type	0.3 "
Type	7.62 mm
Type	DIP

20-3518 Series

Part	Features	Contact Material - Post [custom]	Termination	Contact Finish - Post	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Termination Post Length	Termination Post Length	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Material Flammability Rating	Mounting Type
Aries Electronics 20-3518-102	Open Frame	Brass	Solder	Tin	3 A	0.1 in	2.54 mm	Beryllium Copper	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	20	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Through Hole
Aries Electronics 20-3518-111	Open Frame	Brass	Solder	Gold	3 A	0.1 in	2.54 mm	Beryllium Copper	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	10 çin	0.25 çm	20	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Through Hole
Aries Electronics 20-3518-112	Open Frame	Brass	Solder	Gold	3 A	0.1 in	2.54 mm	Beryllium Copper	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	10 çin	0.25 çm	20	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Through Hole
Aries Electronics 20-3518-10	Open Frame	Brass	Solder	Tin	3 A	0.1 in	2.54 mm	Beryllium Copper	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	20	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Through Hole
Aries Electronics 20-3518-10T	Open Frame	Brass	Solder	Tin	3 A	0.1 in	2.54 mm	Beryllium Copper	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	20	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Through Hole
Aries Electronics 20-3518-11	Open Frame	Brass	Solder	Gold	3 A	0.1 in	2.54 mm	Beryllium Copper	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	10 çin	0.25 çm	20	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Through Hole

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	1	$ 1.67
		19	$ 1.35
		38	$ 1.29
		57	$ 1.25
		114	$ 1.19
		266	$ 1.12
		513	$ 1.07
		1007	$ 1.02
		2508	$ 0.96

Description

General part information

20-3518 Series

20 (2 x 10) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources