20-3518 Series

Catalog

CONN IC DIP SOCKET 20POS GOLD

Part	Features	Contact Material - Post [custom]	Termination	Contact Finish - Post	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Termination Post Length	Termination Post Length	Type	Type	Type	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Material Flammability Rating	Mounting Type
Aries Electronics 20-3518-102	Open Frame	Brass	Solder	Tin	3 A	0.1 in	2.54 mm	Beryllium Copper	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	20	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Through Hole
Aries Electronics 20-3518-111	Open Frame	Brass	Solder	Gold	3 A	0.1 in	2.54 mm	Beryllium Copper	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	10 çin	0.25 çm	20	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Through Hole
Aries Electronics 20-3518-112	Open Frame	Brass	Solder	Gold	3 A	0.1 in	2.54 mm	Beryllium Copper	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	10 çin	0.25 çm	20	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Through Hole
Aries Electronics 20-3518-10	Open Frame	Brass	Solder	Tin	3 A	0.1 in	2.54 mm	Beryllium Copper	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	20	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Through Hole
Aries Electronics 20-3518-10T	Open Frame	Brass	Solder	Tin	3 A	0.1 in	2.54 mm	Beryllium Copper	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	200 µin	5.08 µm	20	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Through Hole
Aries Electronics 20-3518-11	Open Frame	Brass	Solder	Gold	3 A	0.1 in	2.54 mm	Beryllium Copper	3.18 mm	0.125 in	0.3 "	7.62 mm	DIP	2.54 mm	0.1 in	10 çin	0.25 çm	20	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	Through Hole