24-6554-16

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Aries Electronics

24P DIP NICKEL BORON BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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24-6554-16

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Aries Electronics

24P DIP NICKEL BORON BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS

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Technical Specifications

Parameters and characteristics for this part

Specification	24-6554-16

Contact Finish - Mating	Nickel Boron
Contact Finish - Post	Nickel Boron
Contact Finish Thickness - Mating	1.27 µm
Contact Finish Thickness - Mating	50 µin
Contact Finish Thickness - Post	1.27 µm
Contact Finish Thickness - Post	50 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Current Rating (Amps)	1 A
Features	Closed Frame
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	24
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.11 in
Termination Post Length	2.78 mm
Type	15.24 mm
Type	DIP, ZIF (ZIP)
Type	0.6 "

24-655 Series

Part	Housing Material	Termination Post Length	Termination Post Length	Material Flammability Rating	Type	Type	Type	Features	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Mounting Type	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Number of Positions or Pins (Grid)	Contact Finish - Post	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Contact Material - Post
Aries Electronics 24-6556-10	Polyphenylene Sulfide (PPS) Glass Filled	3.3 mm	0.13 in	UL94 V-0	DIP	0.6 in	15.24 mm	Open Frame	Solder	200 µin	5.08 µm	Gold	Through Hole	Beryllium Copper	2.54 mm	0.1 in	Brass	24	Tin	3 A	0.1 in	2.54 mm	30 Áin	0.76 Ám
Aries Electronics 24-6556-40	Polyphenylene Sulfide (PPS) Glass Filled	4.57 mm	0.18 in	UL94 V-0	DIP	0.6 in	15.24 mm	Open Frame		200 µin	5.08 µm	Gold	Through Hole	Beryllium Copper	2.54 mm	0.1 in	Brass	24	Tin	3 A	0.1 in	2.54 mm	30 Áin	0.76 Ám
Aries Electronics 24-6551-11	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder			Gold	Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Gold	1 A	0.1 in	2.54 mm			0.6 "	Beryllium Copper
Aries Electronics 24-6553-11	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder			Gold	Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Gold	1 A	0.1 in	2.54 mm			0.6 "	Beryllium Copper
Aries Electronics 24-6552-11	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder			Gold	Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Gold	1 A	0.1 in	2.54 mm			0.6 "	Beryllium Copper
Aries Electronics 24-6556-11	Polyphenylene Sulfide (PPS) Glass Filled	3.3 mm	0.13 in	UL94 V-0	DIP	0.6 in	15.24 mm	Open Frame	Solder	10 çin	0.25 çm	Gold	Through Hole	Beryllium Copper	2.54 mm	0.1 in	Brass	24	Gold	3 A	0.1 in	2.54 mm	30 Áin	0.76 Ám
Aries Electronics 24-6554-10	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder	200 µin	5.08 µm		Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Tin	1 A	0.1 in	2.54 mm	200 µin	5.08 µm	0.6 "	Beryllium Copper
Aries Electronics 24-6553-16	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder	50 µin	1.27 µm	Nickel Boron	Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Nickel Boron	1 A	0.1 in	2.54 mm	50 µin	1.27 µm	0.6 "	Beryllium Copper
Aries Electronics 24-6554-16	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder	50 µin	1.27 µm	Nickel Boron	Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Nickel Boron	1 A	0.1 in	2.54 mm	50 µin	1.27 µm	0.6 "	Beryllium Copper
Aries Electronics 24-6552-16	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder	50 µin	1.27 µm	Nickel Boron	Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Nickel Boron	1 A	0.1 in	2.54 mm	50 µin	1.27 µm	0.6 "	Beryllium Copper

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 48.69
		10	$ 44.68
		100	$ 39.24
LCSC	Piece	1	$ 98.74
		200	$ 39.40
		500	$ 38.08
		1000	$ 37.43

Description

General part information

24-655 Series

24 (2 x 12) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Nickel Boron Through Hole

Documents

Technical documentation and resources