24-6552-11
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
Deep-Dive with AI
Search across all available documentation for this part.
DocumentsDatasheet
24-6552-11
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 24POS GLD
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 24-6552-11 |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 24 |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 0.11 in |
| Termination Post Length | 2.78 mm |
| Type | 15.24 mm |
| Type | DIP, ZIF (ZIP) |
| Type | 0.6 " |
24-655 Series
| Part | Housing Material | Termination Post Length | Termination Post Length | Material Flammability Rating | Type | Type | Type | Features | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Mounting Type | Contact Material - Mating | Pitch - Post | Pitch - Post | Contact Material - Post [custom] | Number of Positions or Pins (Grid) | Contact Finish - Post | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 3.3 mm | 0.13 in | UL94 V-0 | DIP | 0.6 in | 15.24 mm | Open Frame | Solder | 200 µin | 5.08 µm | Gold | Through Hole | Beryllium Copper | 2.54 mm | 0.1 in | Brass | 24 | Tin | 3 A | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | ||
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 4.57 mm | 0.18 in | UL94 V-0 | DIP | 0.6 in | 15.24 mm | Open Frame | 200 µin | 5.08 µm | Gold | Through Hole | Beryllium Copper | 2.54 mm | 0.1 in | Brass | 24 | Tin | 3 A | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | |||
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 2.78 mm | 0.11 in | UL94 V-0 | DIP ZIF (ZIP) | 15.24 mm | Closed Frame | Solder | Gold | Through Hole | Beryllium Copper | 2.54 mm | 0.1 in | 24 | Gold | 1 A | 0.1 in | 2.54 mm | 0.6 " | Beryllium Copper | ||||||
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 2.78 mm | 0.11 in | UL94 V-0 | DIP ZIF (ZIP) | 15.24 mm | Closed Frame | Solder | Gold | Through Hole | Beryllium Copper | 2.54 mm | 0.1 in | 24 | Gold | 1 A | 0.1 in | 2.54 mm | 0.6 " | Beryllium Copper | ||||||
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 2.78 mm | 0.11 in | UL94 V-0 | DIP ZIF (ZIP) | 15.24 mm | Closed Frame | Solder | Gold | Through Hole | Beryllium Copper | 2.54 mm | 0.1 in | 24 | Gold | 1 A | 0.1 in | 2.54 mm | 0.6 " | Beryllium Copper | ||||||
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 3.3 mm | 0.13 in | UL94 V-0 | DIP | 0.6 in | 15.24 mm | Open Frame | Solder | 10 çin | 0.25 çm | Gold | Through Hole | Beryllium Copper | 2.54 mm | 0.1 in | Brass | 24 | Gold | 3 A | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | ||
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 2.78 mm | 0.11 in | UL94 V-0 | DIP ZIF (ZIP) | 15.24 mm | Closed Frame | Solder | 200 µin | 5.08 µm | Through Hole | Beryllium Copper | 2.54 mm | 0.1 in | 24 | Tin | 1 A | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 0.6 " | Beryllium Copper | |||
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 2.78 mm | 0.11 in | UL94 V-0 | DIP ZIF (ZIP) | 15.24 mm | Closed Frame | Solder | 50 µin | 1.27 µm | Nickel Boron | Through Hole | Beryllium Copper | 2.54 mm | 0.1 in | 24 | Nickel Boron | 1 A | 0.1 in | 2.54 mm | 50 µin | 1.27 µm | 0.6 " | Beryllium Copper | ||
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 2.78 mm | 0.11 in | UL94 V-0 | DIP ZIF (ZIP) | 15.24 mm | Closed Frame | Solder | 50 µin | 1.27 µm | Nickel Boron | Through Hole | Beryllium Copper | 2.54 mm | 0.1 in | 24 | Nickel Boron | 1 A | 0.1 in | 2.54 mm | 50 µin | 1.27 µm | 0.6 " | Beryllium Copper | ||
Aries Electronics | Polyphenylene Sulfide (PPS) Glass Filled | 2.78 mm | 0.11 in | UL94 V-0 | DIP ZIF (ZIP) | 15.24 mm | Closed Frame | Solder | 50 µin | 1.27 µm | Nickel Boron | Through Hole | Beryllium Copper | 2.54 mm | 0.1 in | 24 | Nickel Boron | 1 A | 0.1 in | 2.54 mm | 50 µin | 1.27 µm | 0.6 " | Beryllium Copper |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 30 | $ 16.28 | |
Description
General part information
24-655 Series
24 (2 x 12) Pos DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources