24-655 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Housing Material	Termination Post Length	Termination Post Length	Material Flammability Rating	Type	Type	Type	Features	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Mounting Type	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Number of Positions or Pins (Grid)	Contact Finish - Post	Current Rating (Amps)	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Contact Material - Post
Aries Electronics 24-6556-10	Polyphenylene Sulfide (PPS) Glass Filled	3.3 mm	0.13 in	UL94 V-0	DIP	0.6 in	15.24 mm	Open Frame	Solder	200 µin	5.08 µm	Gold	Through Hole	Beryllium Copper	2.54 mm	0.1 in	Brass	24	Tin	3 A	0.1 in	2.54 mm	30 Áin	0.76 Ám
Aries Electronics 24-6556-40	Polyphenylene Sulfide (PPS) Glass Filled	4.57 mm	0.18 in	UL94 V-0	DIP	0.6 in	15.24 mm	Open Frame		200 µin	5.08 µm	Gold	Through Hole	Beryllium Copper	2.54 mm	0.1 in	Brass	24	Tin	3 A	0.1 in	2.54 mm	30 Áin	0.76 Ám
Aries Electronics 24-6551-11	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder			Gold	Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Gold	1 A	0.1 in	2.54 mm			0.6 "	Beryllium Copper
Aries Electronics 24-6553-11	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder			Gold	Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Gold	1 A	0.1 in	2.54 mm			0.6 "	Beryllium Copper
Aries Electronics 24-6552-11	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder			Gold	Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Gold	1 A	0.1 in	2.54 mm			0.6 "	Beryllium Copper
Aries Electronics 24-6556-11	Polyphenylene Sulfide (PPS) Glass Filled	3.3 mm	0.13 in	UL94 V-0	DIP	0.6 in	15.24 mm	Open Frame	Solder	10 çin	0.25 çm	Gold	Through Hole	Beryllium Copper	2.54 mm	0.1 in	Brass	24	Gold	3 A	0.1 in	2.54 mm	30 Áin	0.76 Ám
Aries Electronics 24-6554-10	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder	200 µin	5.08 µm		Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Tin	1 A	0.1 in	2.54 mm	200 µin	5.08 µm	0.6 "	Beryllium Copper
Aries Electronics 24-6553-16	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder	50 µin	1.27 µm	Nickel Boron	Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Nickel Boron	1 A	0.1 in	2.54 mm	50 µin	1.27 µm	0.6 "	Beryllium Copper
Aries Electronics 24-6554-16	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder	50 µin	1.27 µm	Nickel Boron	Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Nickel Boron	1 A	0.1 in	2.54 mm	50 µin	1.27 µm	0.6 "	Beryllium Copper
Aries Electronics 24-6552-16	Polyphenylene Sulfide (PPS) Glass Filled	2.78 mm	0.11 in	UL94 V-0	DIP ZIF (ZIP)		15.24 mm	Closed Frame	Solder	50 µin	1.27 µm	Nickel Boron	Through Hole	Beryllium Copper	2.54 mm	0.1 in		24	Nickel Boron	1 A	0.1 in	2.54 mm	50 µin	1.27 µm	0.6 "	Beryllium Copper