
LPAM-20-01.0-S-08-2-K-TR
ActiveSamtec Inc.
1.27MM 8 160P VERTICAL WELDING SMD,P=1.27MM BOARD-TO-BOARD AND BACKPLANE CONNECTOR ROHS
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LPAM-20-01.0-S-08-2-K-TR
ActiveSamtec Inc.
1.27MM 8 160P VERTICAL WELDING SMD,P=1.27MM BOARD-TO-BOARD AND BACKPLANE CONNECTOR ROHS
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | LPAM-20-01.0-S-08-2-K-TR |
|---|---|
| Connector Type | Male Pins, Array |
| Contact Finish | Gold |
| Contact Finish Thickness | 0.76 Ám |
| Contact Finish Thickness | 30 Áin |
| Features | Pick and Place, Board Guide |
| Height Above Board [z] | 3.68 mm |
| Height Above Board [z] | 0.145 in |
| Mated Stacking Heights | 4 mm, 4.5 mm |
| Mounting Type | Surface Mount |
| Number of Positions | 160 |
| Number of Rows | 8 |
| Pitch [x] | 0.05 in |
| Pitch [x] | 1.27 mm |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
LPAM-20 Series
Board to Board & Mezzanine Connectors .050" LP Array High-Speed High-Density Low Profile Open-Pin-Field Array, Terminal
Documents
Technical documentation and resources
No documents available