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CP3SP33SMS/NOPB

Active
Texas Instruments

PROCESSOR WITH CACHE, DSP,BLUETOOTH, USB, DUAL CAN INTERFACE

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CP3SP33SMS/NOPB - https://ti.com/content/dam/ticom/images/products/package/n/nzn0224a.png

CP3SP33SMS/NOPB

Active
Texas Instruments

PROCESSOR WITH CACHE, DSP,BLUETOOTH, USB, DUAL CAN INTERFACE

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationCP3SP33SMS/NOPBCP3SP33 Series
ApplicationsConnectivity ProcessorConnectivity Processor
Controller SeriesCP3000CP3000
Core ProcessorCR16CCR16C
InterfaceBluetooth, I2S, USB OTG, CAN, ACCESS.bus, Audio, UART/USART, Microwire/SPI, EBI/EMIBluetooth, I2S, USB OTG, CAN, ACCESS.bus, Audio, UART/USART, Microwire/SPI, EBI/EMI
Mounting TypeSurface MountSurface Mount
Number of I/O6436 - 64
Operating Temperature [Max]85 °C85 °C
Operating Temperature [Min]-40 °C-40 °C
Package / Case224-LFBGA224-LFBGA, 144-LFBGA
Program Memory TypeExternal Program MemoryExternal Program Memory
RAM Size44 K44 K
Supplier Device Package224-NFBGA (13x13)224-NFBGA (13x13), 144-FBGA (10x10)
Voltage - Supply [Max]3.3 V3.3 V
Voltage - Supply [Min]3 V3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 14$ 21.76
15$ 20.56
Tray 160$ 23.36
Texas InstrumentsJEDEC TRAY (10+1) 1$ 27.44
100$ 23.97
250$ 18.48
1000$ 16.53

CP3SP33 Series

Processor with Cache, DSP,Bluetooth, USB, Dual CAN Interface

PartPackage / CaseApplicationsRAM SizeProgram Memory TypeSupplier Device PackageVoltage - Supply [Min]Voltage - Supply [Max]Operating Temperature [Min]Operating Temperature [Max]Mounting TypeInterfaceController SeriesNumber of I/OCore Processor
Texas Instruments
CP3SP33SMSX/NOPB
224-LFBGA
Connectivity Processor
44 K
External Program Memory
224-NFBGA (13x13)
3 V
3.3 V
-40 °C
85 °C
Surface Mount
ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I2S, Microwire/SPI, UART/USART, USB OTG
CP3000
64
CR16C
Texas Instruments
CP3SP33SMS/NOPB
224-LFBGA
Connectivity Processor
44 K
External Program Memory
224-NFBGA (13x13)
3 V
3.3 V
-40 °C
85 °C
Surface Mount
ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I2S, Microwire/SPI, UART/USART, USB OTG
CP3000
64
CR16C
Texas Instruments
CP3SP33SMR/NOPB
144-LFBGA
Connectivity Processor
44 K
External Program Memory
144-FBGA (10x10)
3 V
3.3 V
-40 °C
85 °C
Surface Mount
ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I2S, Microwire/SPI, UART/USART, USB OTG
CP3000
36
CR16C

Description

General part information

CP3SP33 Series

The CP3SP33 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high computing bandwidth, DMA-driven hardware communications peripherals provide high I/O bandwidth, and an external bus provides system expandability.

On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (2.0) OTG node and host controller, dual CAN, dual Microwire/Plus/SPI, dual ACCESS.bus, quad UART, 10-bit A/D converter, and telematics/audio codec. Additional on-chip peripherals include DMA controller, dual CVSD/PCM conversion module, I2S and AAI digital audio bus interfaces, Timing and Watchdog Unit, dual Versatile Timer Unit, dual Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.

In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with an external program memory and a Bluetooth radio transceiver such as National’s LMX5252, the CP3SP33 provides a complete Bluetooth system solution.