CP3SP33 Series
Processor with Cache, DSP,Bluetooth, USB, Dual CAN Interface
Manufacturer: Texas Instruments
Link to Manufacturer Page: https://www.ti.com/
Catalog
Processor with Cache, DSP,Bluetooth, USB, Dual CAN Interface
| Part | Package / Case | Applications | RAM Size | Program Memory Type | Supplier Device Package | Voltage - Supply [Min] | Voltage - Supply [Max] | Operating Temperature [Min] | Operating Temperature [Max] | Mounting Type | Interface | Controller Series | Number of I/O | Core Processor |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Texas Instruments CP3SP33SMSX/NOPB | 224-LFBGA | Connectivity Processor | 44 K | External Program Memory | 224-NFBGA (13x13) | 3 V | 3.3 V | -40 °C | 85 °C | Surface Mount | ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I2S, Microwire/SPI, UART/USART, USB OTG | CP3000 | 64 | CR16C |
Texas Instruments CP3SP33SMS/NOPB | 224-LFBGA | Connectivity Processor | 44 K | External Program Memory | 224-NFBGA (13x13) | 3 V | 3.3 V | -40 °C | 85 °C | Surface Mount | ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I2S, Microwire/SPI, UART/USART, USB OTG | CP3000 | 64 | CR16C |
Texas Instruments CP3SP33SMR/NOPB | 144-LFBGA | Connectivity Processor | 44 K | External Program Memory | 144-FBGA (10x10) | 3 V | 3.3 V | -40 °C | 85 °C | Surface Mount | ACCESS.bus, Audio, Bluetooth, CAN, EBI/EMI, I2S, Microwire/SPI, UART/USART, USB OTG | CP3000 | 36 | CR16C |
Key Features
• CPU FeaturesFully static RISC processor core,capable of operating from 0 to 96 MHzwith zero wait/hold stateMinimum 10.4 ns instruction cycle timewith a 96-MHz internal clock frequency,based on a 12-MHz external input4K-byte, 4-way set-associativeinstruction cache69 independently vectored peripheralinterruptsDSP FeaturesCapable of operating up to 96 MHz16-bit fixed-point arithmetic, dual-MACarchitecture32-bit interface to 4K-byte RAM shared withCPU32-bit external bus interfaceBus master interface to audio peripheralsand I/OMemory4K bytes CPU instructioncache32K bytes CPU data RAM4K bytes CPU/DSP shared RAM24K bytes DSP program RAM24K bytes DSP data RAM8K bytes Bluetooth sequencer and data RAMAddresses up to 96M bytes (FBGA-224 package)or 8M bytes (FBGA-144 package) of externalmemoryBroad Range of Hardware Communications PeripheralsBluetooth Lower Link Controller (LLC)including a shared 7K byte Bluetooth dataRAM and 1K byte Bluetooth Sequencer RAMUniversal Serial Bus (USB) 2.0 On-The-GoAudio/telematics codec with dual ADC inputsand high quality stereo DAC outputTwo CAN interfaces with 15 message buffersconforming to CAN specification 2.0B activeTwo ACCESS.bus serial bus interfaces (I2C compatible)Two 8/16-bit SPI, Microwire/Plus serial interfacesI2S digital audio bus interfaceFour Universal Asynchronous Receiver/Transmitter (UART)channels, one channel has USART capabilityAdvanced Audio Interface (AAI) to connect to external8/ 13-bit PCM Codecs as well as to ISDN-Controllersthrough the IOM-2 interface (slave only)Two CVSD/PCM converters, for supporting two bidirectionalaudio connectionsExternal Bus Interface Shared Between CPU and DSP16/32-bit data busbus interface23-bit address bus3 programmable chip select outputsUp to 96M bytes external memory8-level write bufferGeneral-Purpose Hardware Peripherals10-channel, 10-bit A/D Converter (ADC)16-channel DMA controllerDual 16-bit Multi-Function Timer (MFT)Dual Versatile Timer Units (VTU), each with fourindependent timersTiming and Watchdog UnitExtensive Power and Clock Management SupportTwo Phase Locked Loops (PLL) for synthesizing independentsystem and audio peripheral clocksTwo independent oscillators for Active mode(12 MHz) and Power Save mode (32.768 kHz) clocksLow-power modes (Power Save, Idle, and Halt) forslowing or stopping clocks to optimize powerconsumption while meeting application needsFlexible I/OUp to 64 general-purpose I/O pins (shared with on-chipperipheral I/O)Programmable I/O pin characteristics: TRI-STATE output,push-pull output, weak pullup/pulldown input, highimpedance input, high-speed drive capabilitySchmitt triggers on general-purpose inputsMulti-Input Wake-Up (MIWU) capability…Power SupplyI/O port operation at 3.0–3.3VCore logic operation at 1.8VOn-chip power-on resetTemperature Range–40°C to +85°C (Industrial)PackagesFBGA-224, FBGA-144Complete Development EnvironmentPre-integrated hardware and software support forrapid prototyping and productionMulti-file C source editor, source debugger,and project managerComprehensive, integrated, one-stop technical supportBluetooth Protocol StackApplications can interface to the high-levelprotocols or directly to the low-level HostController Interface (HCI)Transport layer support allows HCI command-basedinterface over UART portBaseband (Link Controller) hardware minimizesthe bandwidth demand on the CPULink Manager (LM)Logical Link Control and Adaptation Protocol(L2CAP)Service Discovery Protocol (SDP)RFCOMM Serial Port Emulation ProtocolAll packet types, piconet, and scatternetfunctionalityCPU FeaturesFully static RISC processor core,capable of operating from 0 to 96 MHzwith zero wait/hold stateMinimum 10.4 ns instruction cycle timewith a 96-MHz internal clock frequency,based on a 12-MHz external input4K-byte, 4-way set-associativeinstruction cache69 independently vectored peripheralinterruptsDSP FeaturesCapable of operating up to 96 MHz16-bit fixed-point arithmetic, dual-MACarchitecture32-bit interface to 4K-byte RAM shared withCPU32-bit external bus interfaceBus master interface to audio peripheralsand I/OMemory4K bytes CPU instructioncache32K bytes CPU data RAM4K bytes CPU/DSP shared RAM24K bytes DSP program RAM24K bytes DSP data RAM8K bytes Bluetooth sequencer and data RAMAddresses up to 96M bytes (FBGA-224 package)or 8M bytes (FBGA-144 package) of externalmemoryBroad Range of Hardware Communications PeripheralsBluetooth Lower Link Controller (LLC)including a shared 7K byte Bluetooth dataRAM and 1K byte Bluetooth Sequencer RAMUniversal Serial Bus (USB) 2.0 On-The-GoAudio/telematics codec with dual ADC inputsand high quality stereo DAC outputTwo CAN interfaces with 15 message buffersconforming to CAN specification 2.0B activeTwo ACCESS.bus serial bus interfaces (I2C compatible)Two 8/16-bit SPI, Microwire/Plus serial interfacesI2S digital audio bus interfaceFour Universal Asynchronous Receiver/Transmitter (UART)channels, one channel has USART capabilityAdvanced Audio Interface (AAI) to connect to external8/ 13-bit PCM Codecs as well as to ISDN-Controllersthrough the IOM-2 interface (slave only)Two CVSD/PCM converters, for supporting two bidirectionalaudio connectionsExternal Bus Interface Shared Between CPU and DSP16/32-bit data busbus interface23-bit address bus3 programmable chip select outputsUp to 96M bytes external memory8-level write bufferGeneral-Purpose Hardware Peripherals10-channel, 10-bit A/D Converter (ADC)16-channel DMA controllerDual 16-bit Multi-Function Timer (MFT)Dual Versatile Timer Units (VTU), each with fourindependent timersTiming and Watchdog UnitExtensive Power and Clock Management SupportTwo Phase Locked Loops (PLL) for synthesizing independentsystem and audio peripheral clocksTwo independent oscillators for Active mode(12 MHz) and Power Save mode (32.768 kHz) clocksLow-power modes (Power Save, Idle, and Halt) forslowing or stopping clocks to optimize powerconsumption while meeting application needsFlexible I/OUp to 64 general-purpose I/O pins (shared with on-chipperipheral I/O)Programmable I/O pin characteristics: TRI-STATE output,push-pull output, weak pullup/pulldown input, highimpedance input, high-speed drive capabilitySchmitt triggers on general-purpose inputsMulti-Input Wake-Up (MIWU) capability…Power SupplyI/O port operation at 3.0–3.3VCore logic operation at 1.8VOn-chip power-on resetTemperature Range–40°C to +85°C (Industrial)PackagesFBGA-224, FBGA-144Complete Development EnvironmentPre-integrated hardware and software support forrapid prototyping and productionMulti-file C source editor, source debugger,and project managerComprehensive, integrated, one-stop technical supportBluetooth Protocol StackApplications can interface to the high-levelprotocols or directly to the low-level HostController Interface (HCI)Transport layer support allows HCI command-basedinterface over UART portBaseband (Link Controller) hardware minimizesthe bandwidth demand on the CPULink Manager (LM)Logical Link Control and Adaptation Protocol(L2CAP)Service Discovery Protocol (SDP)RFCOMM Serial Port Emulation ProtocolAll packet types, piconet, and scatternetfunctionality
Description
AI
The CP3SP33 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high computing bandwidth, DMA-driven hardware communications peripherals provide high I/O bandwidth, and an external bus provides system expandability.
On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (2.0) OTG node and host controller, dual CAN, dual Microwire/Plus/SPI, dual ACCESS.bus, quad UART, 10-bit A/D converter, and telematics/audio codec. Additional on-chip peripherals include DMA controller, dual CVSD/PCM conversion module, I2S and AAI digital audio bus interfaces, Timing and Watchdog Unit, dual Versatile Timer Unit, dual Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.
In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with an external program memory and a Bluetooth radio transceiver such as National’s LMX5252, the CP3SP33 provides a complete Bluetooth system solution.
National Semiconductor offers a complete and industry proven application development environment for CP3SP33 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth protocol stack, and application examples.
The CP3SP33 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with 4Kbyte instruction cache and a Teak® DSP coprocessor provides high computing bandwidth, DMA-driven hardware communications peripherals provide high I/O bandwidth, and an external bus provides system expandability.
On-chip communications peripherals include: Bluetooth Lower Link Controller, Universal Serial Bus (2.0) OTG node and host controller, dual CAN, dual Microwire/Plus/SPI, dual ACCESS.bus, quad UART, 10-bit A/D converter, and telematics/audio codec. Additional on-chip peripherals include DMA controller, dual CVSD/PCM conversion module, I2S and AAI digital audio bus interfaces, Timing and Watchdog Unit, dual Versatile Timer Unit, dual Multi-Function Timer, and Multi-Input Wake-Up (MIWU) unit.
In addition to providing the features needed for the next generation of embedded Bluetooth products, the CP3SP33 is backed up by the software resources that designers need for rapid time-to-market, including an operating system, Bluetooth protocol stack implementation, peripheral drivers, reference designs, and an integrated development environment. Combined with an external program memory and a Bluetooth radio transceiver such as National’s LMX5252, the CP3SP33 provides a complete Bluetooth system solution.
National Semiconductor offers a complete and industry proven application development environment for CP3SP33 applications, including the IAR Embedded Workbench, iSYSTEM winIDEA and iC3000 Active Emulator, Bluetooth Development Board, Bluetooth protocol stack, and application examples.